CA2031519A1

CA2031519A1 - Transfer fixture and process for printed circuit boards

Info

Publication number: CA2031519A1
Application number: CA 2031519
Authority: CA
Inventors: George A. Salensky; Thomas S. Thoman
Original assignee: Individual
Current assignee: BP Corp North America Inc
Priority date: 1989-04-27
Filing date: 1990-04-17
Publication date: 1990-10-28
Also published as: EP0422211A1; JPH03505551A; WO1990012683A1

Abstract

This invention relates to an apparatus and method for uniformly transmitting pressure to laminate a conductor or printed circuit to an at least two-dimensional substrate surface so that the bonding of one to the other is uniform across the surface including the periphery of the surface. The invention includes multiple platens disposed opposite each other. One platen contains a cavity for insertion of a substantial thickness of the substrate while the other platen has attached to it a cylinder having portions of its volume divided by multiple diaphragms. One of the diaphragms is a mold shaped to be a mirror image of the surface of the substrate, and which is confined in the distal end of the cylinder. An alternative embodiment is directed to the use of a bellows attached to the noted platen in place of the cylinder. The bellows has at its distal end the mentioned mold. This technique permits not only a uniform lamination technique, but also provides a technique for eliminating the hazard of using a bladder with hot pressurized fluid which can burst or jet fluid at personnel.

Description

WOgO~12683 2 n3l5 l9 PCT/US90/0~138 - 1 i TRANSFER FIXTURE_AND PROCES~ ~OR PRINTED CIRCUIT BOARD5 i ~ Rela~ed A~plications : This application is a continuation-in-part of ' Application Serial No. 214,380j filed July 1, 1988 and 5 United Skates Applica~ion Serial No. _343,741 , filed ! ~f ~ven d ~e, to the ~ame invent~rs as this application `~, entitled ~pparatus and ~ethod ~or Fabricating Printed Circuit Boards~. The appli~ations have ~he same assi~nee. ~hese applications are hereby incorporated by 10 reference.
Field of the Invention This inYention relates to pressure transmitting apparatus and processes to effect uniform transfer :~
pre~sure of a conductor to a substrate to o~tain unifonm 15 bonding:of on~ to ~he other ~cro~s two and three- .:
dimenxional sur~c~ of the ~ubs~rate. The conductor is .:
preferably A printed cir~uit Ioca~ed on a relea~e ~' medium. ..
Backqround ~rt : :
The art area ha~ been direc~3d to formins~ ~, circuit boards by techniques other than trans f erring a conductor to a subs~rate u~ed to f orm the circuit ~ard .
~, .
The art rea has b~en concerned principally with laminatio n o~ multilaye:red ~ircuit boards. ; ::
~ 25 For examplel United States Paten~ No. 4,029,845 :
: :: relate~ to a thermosetting resin: in which of heat: and ~:
pressure ~ are: ~used to form a compositt3 circuit bo~rd . The reference only discloses fosmin~ the ba!~eboard ~nd ~oes ` :1 ; not teach f~ Qing prin~ ircuit elements on th~t - ~-30 baseboard. ~ The~ ~referen~e re~fers to ~an a~dditi~re; process for ~m~nu~ncturing ~a printed clrcui~ ~ard without ;~ ~, , explan~tis:~n~ of that ~eaching.~

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WO gO~12683 2 0 315 ~ 9 PCr/~lS90~02138 ~ ':

United States Patent No. 4 ,180, 6~8 teaches heat and pressure u~ed to form a oomposi~e printl3d circuit board ~ However, the reference uses a s:arxier layer for resin but not a printed ~:ircuit a5 iIl the pres~nt ~.
S invention . A lamination is f c~rmed a~ taught in the art .
As examples of methods ~nd apparatus for .: `
molding structural parts, United S~a~e~ Pat~nt Nt~s.
3,642,415; 3~669~806 and 4,243,368 ~each diaphxagms u~ed :
to form plastic sh~et material. Pr~ssur2 is transmitted 10 using a fluid. ~egarding th~ ' 806 paten~, the ref~rence :~
does not teach bonding of an electrical condu~:tor to a substra~e. Whi}e ~eaching a controlled bonding force en~uring engagem~nt of components in the ' 806 pa~ent, it does not teach the present invention.
U~5. Patent No. 4,148,597 teaches use of a f luid pressure force to form an irreqular shape }:y applying thz~t forc~ to a ~ilicone ~ber ~old~ U.S.
Pa~ent 3, 255, 47S teach~3s a pre~ for irregularly shaped articles. ~`
U.S. Patent No. 4,129,730 teaches a pressure transmitting ~ppara~us ufiing a ~uperpl~s~ic alloy a~ the .
pressure tr~n mitting medium. The app~ratus is designed ~o that the ~Iloy medium will~not ~pread out in the eYent tha~ the ~pparatus break~. ~he preceding references ~re 25 all incoxpor~ted by reference. I
This invention over~omes disadvan~ages found in the prior ~rt which rçla~e~ to lamunating printad ~-circuits to ~ub~trstes, psrticularly ~hose ~ubstrates which h~v~ ~om~lex ~hapes.
3a b~
Thi5 inv~ntion relate~ ~o 8 uniform pre~sure tran~mitting ~pparatus fo~ uniformly lamlnating a ~ : conductor to ~ at lea~t;two-~imensional ~u~strate :~ .
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surface comprising, ~a) a first platen means ha~ing a `-fluid filled bellows with~a first cavity m~ans substanti- `~
ally confining a mold which i~ a mirror image of ~he at ~:
least two-dimensional substrate surface, (b) a second 5 pla~en means containing a second ca~i~y means dimensioned to protrude a portion of the thicknèss of the ~ubstrate, ~`~
(c) pre~surization means for compressing a conductor ;~:
oYerlaid on the~substrate surface,;and~(d) laminating means to bond the conductor to the $ubstrate surface. .-lQ This~inventio~ alsQ relates ~o a uniform pressure transmitting apparatus for uniformly laminatin~ :
: a printed circuit to an at~least ~wo-dimensional sub~
itrate surface comprising, (a) a first platen means ~.
havlng a fluid filled bellows with a first ca~ity means lS substantially confining a mold which i8 ~a mirror:Lmage of :
the at~least two-dLmensional su~strate ~urace, (b) a~
second plat~n means containing a;~econd:ca~ity means : ~
dlmensio~ed~ to~protrude a portlon of: the thickness of:the::`
substratet (c)~pressurizatlon~means for~c pr~ssing a~
20 printed clrcuit position;ed~on the:~ubstrate~surfa~e,~and (d) }am~inating~means~to bond~the prlnted~circuit to the~
sub~trate ~urface~
This inventi:on further relates ~o a method for ~nlformly laminatlng à conductor to an:at least two~
;25~ dLm~enslonal~ubsorate ~rfa~e~comprl&ing, insertlng a:~
: substantial~`~portion:of~the thlckne~s~;of ~th~ 8ub5trate in a;ca~i~y means of a~platen means, po~i~tioning a ~onduGtor~:: : .
on the ~ ~tra~e~surface,~app ~ing a~uniiform~pres~ur~ to th~ condu~tor~and su~strate ~urfac~ usin~ another platen : ,A
30 me~n`s~h~ving~a~f~lu~id-~f~l:lled bellows containing~another~
càvlty~m~ns~which~sub~tantially con~ines~a;~o ld,~which:~
is~a~mirror ~age~of~the~:at;~lea~t~two-dLmRn6ional~

~ WO90tl2683 PCT/~S90/02138 substrate surface, and laminating the conductor to the ' substrate surface.
This invention also further relates to a method for uni~ormly laminating a printed circuit to an at least 5 two-dimensional substra~e surface comprising, inserting a ::
~substan~ial por~ion of the thickness of the substrate in .;
Ia cavity means of a pla~en means, positioning a printed circuit on the ~ubstrate suxface, applying uniform pres-sur~ to the printed circuit and substxate ~urface usi~g 10 another plat~n means ha~ing a fluid-filled bellows con-taining another ca~ity means which ~ubstan~ially confines a mold, which is a mirror Lmage of the at least two-dimensional ~ubs~rate surface, and lamina~ing the printed cireuit to the ~ubstrate surface.
This invention further relate~ to a uniform pressure transmitting apparatus for uniformly l~minating a conductor to an at least two-dLmensional substrate : surface~ comprising, (a) a ~ixs~ platen me~ns ha~ing a cylinder ha~ing a plurality of diaphragm~, one diaphragm 20 separates the internal volume of the cylinder a~d:another disphragm, in the ~h~pe of a mold, i8 located ~t the ~:
distal end of the cylinder~ad~scent another platen means, : the mold i8 the murror Lm~ge of the at lea~t two- :
dLmensional ~ubstrate sur~ace and i~ substantially con- :~
25 fined in a cavity maans at the distal end of the cylin-der, the cylinder volume located ad~a~ent the one platen means is con~tructed ~nd arranged to hea~ ~nd presfiuri~e a fl~id m~dium oc~cupying this volume~and ~ransf~r th~
heat and pre~s~re to ~h~:o~her volume ad~a~ent:~h~ distal r~ ~ 30 end of the cylinder, the other platen means includes another ca~i~y mean~ dLmensioned to pro~ect a portion of the thickne~6 of the:~ubstrate, and lamlnating means to ond ~he conductor to the:substra~e.
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WO 90/126~3 2 0 ~ 1 5 ~ 9 PCI`/US90/0213~

This in~ention also rela~es to a uniform pressure transmitting apparatus for uniformly l~minating `:
a printed circ:uit to an at least two-dimen~ional ~ub- :
strate ~urf ace, comprising, a f irs~ platen means having a -5 cylinder ha-ring a plurali~y of diaphragms, one diaphra~m -separates the internal ~olume of ~he cylinder and another . .
diaphragm, in the shape of a mold, is loc:ated at ~he distal end of the cylinder ~d~acent ~no~her platl3n means, ..
the mold is~ the mirror imag~ of the at least two- :
10 dimensional substrate surface, and is substantially con- i~
f ined in a cav.ity means at the distal end of the cylin- . ~
der , ~he cylinder volume located ad~acent the one platen `:
means is constructed and àrranged to heat and pressurize a f luid medi~ occupying this volume and transfer the .
15 hea~ and pre~sure to the other volume adiacen~ the di~tal .
end of the cylinder, the other platen mç!ans includes another cavity means dimensioned to projec:t a portion of --the thicknefis of the ~ubstr~te, ~nd lamina~ing ~neans ~o ~-.
bond the printed circuit to the subBtrat ; ~ 20 This invention also relates to a meth~ ~or , ;
uniformly laminating a conductor ~to an at least two-dimensional substra~e sur~ace ~omprising, in er~ins~a .
~ub~stantial portion of the thicknes~ of an ~t least two- `-: ~ dLmensional~substrate in a cavity means of a pla~en 5 mean~, positioni:ng a conductor oYer the ~ub~trate urface, applying unifo~m pre~sure to the conductor and~
: sub~tra~e surface u~ing another platen meanfi having a cylinder attached~to it~,:whioh cyliiind~r!c~ntaib~ à
: plur~lity of diaphra$ms wi~h one of the diaphra~ms being ii~
; 30 a mold, which is::~he`mirror:image of:the ~ ~ s~rate~
urfa~ce,~heating:and:pres3urizing a fluid in the cylinder "j~
' volume~bordered by~it,~the otber platen means and the~:
other~diaphragm,~t=an~mi~ting th~ heat and pressure~to : WO90/12~83 ~ 0 3 1 5 1 ~ PCT/US90/02138 ~

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; the cylinder volume b~unded by it and the diaphragms and laminatin~ the conductor to the substrate ~urface.
This invention also relates to a method for ~, unifor~ly laminating a prin~ed circuit to ~n at least ~:~
5 two-dimensional substrate surface compri~ing, inserting a substantial portion of the thickness o an a~ least two-; dimensional su~stra~e in a ca~ity mean~ of a platen ~;
means, positioning a printed circuit over ~he substra~e surface, applying uniform pre~sure to the printed circui~ :-10 and substrate surface u~ing another pla~en means ha~ing 8 cylinder attached to it,;which cylinder contains a plurality of diaphra~ms wi~h one of ~he diaphragms being a mold, which is the mirror Lmage of the substra~e surface, heating and pressurizing a flui~ in She cylinder 15 volume bord~red by it f the other platen and thP other diaphragm, transmitting the h~at and pressure to the cylinder volume bounded by ~t and ~he diaphragm~ and l aminating the printed c~rcuit to ~he ~ubstrate 3urf~ce.
: Brie ~
This in~en~ion will hOW ~e deseri ~ d using the drawings which depict sche~atic repre~enta~ions and test results of the spparatu~ an~ process of the presen~
in~ention. These drawing~ are exemplary only. They are ;~
not considered ~o limit the inYention:
~ig. 1 ~hows a:beIlows and diaphragm used to transm~t~pres~ure;
: Fig. 2 shows a ~ombinstion of a cylinder and ~;
diaphragms~u~ed to transmit pressure; ~ j , !`` ' ' ~ Fig 3 ~hows a pri~t~d circuit on a ~ub~rate; m Fig.:4~ and 4B ~how Applicantg ~ earller press .~ ~ and tran~fer mekhod with Fig. 4B further ~howi~g use of i ~ ~ pins to ob~ain~regi~ra~ion:o conductor on the :~ substrate;
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WO ~0/12~83 2 ~ 3 .~ PCr/VSg~/02138 7 ~ ::

~ig~ 5 ~hows results of adhesion ~ces~s performed on a conductive ~urface adhered to a ~ubstrate :;
prepaxed using the pre~s and method in Fig. 4~ and 4B; :
Fig. 6 shows the press and transfer method of 5 ~his inverltion; and ~ ig. 7 ~hows results o~ adhesioa- ~ests perfo~sned on a composite prepared according to the press and m8thod of Fig. 6.
Detailed De~criPtion_of the Invention .
The pre ent invention rèlates to unif orm pre~sure transfer apparatus and a proc:ess for transfer- .-xing a t:onductor or printed circuit carried ~y a re1ease ~.
medium to a ~ubs~rate to obtain unifo:cm solder bond strength. The difficulty in ob~aining uniform~ transfer `.
15 pressure is ~:ompounded where the subs~rate is three- ~
dimensiona1 rat~ler l:han two-dimeIlsiona1. `` -P.pp1icants ' inven~ion is dire ::ted ta:~ a si1icon2 Ii.
or other elas~omeric diaphragm which has ~he s~me contour : .
as the two or three-dimensiona1 ~ubs~rate. Thi~ dia-20 phragm i~ placed at the bottom of A ballows r preferab1y a i~
metallic ~ellows, which wou1d contain a fluid, flowable ~
powder, gel or def ormable e1astomeric powder . ~he ~ontents of the ~ellows would ~e pr~ssuri~ o ~orce ~he diap~ragTn even1y aga~ni6t Q-ten vertic:a1 or c10se to 25 ver~ica1 pro~ectic:~n~ on the substrate. Th~ pxes~ure `~;
., ~
tran~fer m~diium can be heated with~ rod heaters or by heat ~.
tran~fer }~etwe~n platens. ~rhe techniqu~ e1:Lminate~ ~he .
hazard of uqing a b1add~r with hot pressurized fluid which c n burst or ~et f 1uid at F~rsonne1.
30 ` i~ An a1terniative embodiment is directed ~o using a cy1inder :with the lower diaphragm. ~he 1c~wer part of the cylinder wou1d contain ~he f~1uid mentioned ~a~ove. `~.

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W0 90/126~3 2 0 :~ i 5 1 9 PCr/US90/02138 8 :
' The upper portion of the cylinder would con'cain pumped pressurized fluid and would be separa~ed from the lower ,i pc)rtion or section by means of a diaphragm or bellow-lilce ~;
diaphragm . The in-~ention includes f orming the silicc)ne 5 mold at the distal eald of the c:ylinder. The inven~ion also includes placir~g a su})s~antial por~ion of the thickness of the su~strate in a cavity of a plat~n.
The conductor c n include a circui~ alone or com}: ined wi~h other components . For exampl2, adhesive, 10 solder mask, graphics and~or transfer media.
Laminatinq 5P~s ~e A release surf ace carrying at least a circuit c:o~ered }:)y adhesive is contacted wi~h a substra~e such .~ :~
that the circuit i8 acljacent the substrate surface -15 separated therefrom by adhesi~e. Suffi~ient heat and .
pressure are applied to f c~rm a composite s~cructure, using the apparatus in Fig. 3 or Fis~.~ 5, where~y the adhesi~re ~ ~`
is reat::ted . l`hus, ~he circui~ i transf erred ~rom the release ~urface and bonded to the substrate ~urface. In ,.
20 some cases, only partial c:uring and/or reaction need be bbtained. The xeleafi~ ~urface is then ~eparated from the composite st:ructure.
The release surface and the ~ubstrate surface are cc~ntacted at a temperature of f rom ab~ut 100 C to 25 abou~ 230 C and ~ pref era~ly 14 0 ~ to 19 0 C . The surf aces are con~cacted at a pressure of from abou~ 20Q psi to -~
about 1,200 Psi and pr~ferably 500 psi to 700 p~i but not 50 great as to czluse difits~rtion of components.l R pres-. ` sure of 600 pfii is p~eferr13d. ~ nally~ the ~;ubstrat~
~ 30 may be preheated to avoid diEtortion. Pre~sure can be ~;:
: ' : applied f~r about 0.2~ to 5 mimlte~, prefer~bly 3 mislute~
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, . ~ -,~. , 3 2 0 ~ g P~/US90~02138 9 '~

In another embodim~3nt, when the composite is f ormed, they are su~ec~ed to suf f icient pressure during laminativn to cause some compac:tlon of the printed ` -circuit. This causes further densification o~ ~he 5 prin~ed circuit, imprc~ving it~ conductive qualities. It has been l~o~ed tha~ such ~ mpaction does not resul~ in ~m~arin~ of the electric circuit . Thus, the f ine edges a hîeved in printing the elec~ric cir::uit are maintained.
Preferably, compac~ion OI 2:5 to 40~6 of Qriginal prin~ed 10 electric pathway thiclcness i~ obtained.
This invention overcomes many deficiencies in :~
printed circuitry fabricati~n in terms of s~plicity, -~ease of operation, functional utilization snd p~rformance.
Substr ~rfa:~ `
The sub~trate may be any kl-own dielectricr that `~
is, in~ulating or non-conducting ~;ub~trate. ~ The related -~:
application referred to above provid~ a detailed li~t of suitable ~ubstrates which c:an be u~ed in 'Chifi invention. : :~
2 0 Suitable ~ubstrates i~clude ~hose f a~ricated f rom thermo~et ~nd thermopla~tic materialfi and their mix~ures. `:~Pref erred substrates will be~ taught ~elow . They can have two or ~hree d~mensional surf aces . . .Thermoplastics, in gener~l, e~i~it a~ ~ore 25 complex r~nge of chemical, ther~al, and mechanis:al ~.
~eha~rior than t:~aditional thermoset printed ::ircuit board ~:
laminates. This makes material ~3election for printed circuit. u~es e~en more criti~cal. C:urrenb res~n ~ystems typically exhibit one or two ~esi~ d charac:~eristics ~ut 30 in ~7eneral lac3c o~rerall proper~y balance ~o make them ;
: good printed c:ircuit ~upport candidat~36. R~
deficiencies become readily: apparent durins~ embly .~
operat1~ns where ~ub~trate warpage ~ bubbling, dimensional j.

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WO90~1~683 2 0 3 1 ~ 1 9 PCT/US9~/02138 instability and printed circuit delamination are common occurrences.
To address thi~ need, applican~ use engineer-ing resins called polyarylsulfone resin~, These resins 5 offer a highly desirable property balance for circuit board use~ where excellent dimensional stability, warp resistance and bonding of circ~it and subs~ra~e are r~quirement~.
Polyarylsulfone xesins are characterized by ~:
10 inheren~ly high heat distortion temperatures, excellent , dimensional stability, creep resist~nce, low loss AC -~
dielectric properties, and high mechanical s~rength.
Typical ProPerties of Pol~a~ylsulfone Resins Property nits Typical Propert~
15 Tensile Strength psi 13,400 :
Elongation to Break % 2.2 Tensile Modulus p~i 892,000 Flexural Strength p~i 19,300 Heat Deflection ~ :
20Temperature C 215 ~
Density gm/cc 1.55 :
~5~: ' Dielectric Constant 60 Hæ -- 3.86 2S1 ~XZ -- 3.
Dissipation Factor 60 Hz ~ -- 0.0042 1 R~Z __ o.0035 D.~electric Stx~.. ngth ::
301~8~ ~pecimen Volts/mil 398-550 3~ Volume resistivity at 50C : mPg ohm-cm 0.41 x 1011 ~ .

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WO 90/12683 2 g) 3 :~ 5 1 ~ pcr/us9o~o2l38 11 '-'-, :~..........................Polyarylsulfon~ xesins are easily proces~ed ~.
utilizing ~tandard in~ection molding machinery ~nd .',practire. Prior to moldinç~, resins should be dried to `-`,5 obtain optimum performznce in a dehumidified hopper drier or circulating air oven. Utili~ation of hopper drier i~ pr~ferred with an inlet air tempera~ure in the 149 163C range arld an: outlet temperature not less than ~:~
135C. When tray drying is utilized, pellets ~hould be 10 spread into a lay~r 1-2" in depth. It is important in :;
all cases that ~he pellets reach and maintain a minimum ~ .
tamperature of 135C for 3-4 hours. Dried resin ~hould be molded promptly and Aandled carefully ~o preclude moisture rea~so~tion. .`.
The rheological charactexifi~ics of polyarylsulfone refiins provi~e excellent flow for filling thin and intricate wall section~ ~ypically e~countered in printed wiring board s, chip carriers, and rela~
devicesO The resins procèss readily a~ ~tock .`
20 temperatures in ~h~ 360-382C ranges (wave ~oldering grade). Mold temperatures of 110-157C are used .~
typically with the r~sin for wsve ~;olderable mc)ldings. 1 .
Clean polyaryl~ulfone re in &crap may be reground and utilized in fa~ric:ation, proYided it i~ properly dried 25 and kept fre~ of contamination. .~.
~ Polyaryl~ulfone produces warp-free moldin~s that are dimensionally ~table both prior ~o and following the transfer proce~s. Tran~f~rred circui~ry ~xhibit~
t2nacious adhesion to the resin as transfèrred, and --30 maintain~ ies adhesion followiIlg wave ~olderins~.
.¦ : : Additives ~which may be u8ed with the ;thermopla~tic ~nd/o~ th~rmosetting re~;in fo:r ~king the .::printed ci~cui t bo~rd, include reinf orcislg ~nd/or non~ :
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~' ~ ' ' ';'' ;, ~, : ` ' , WO9~/12683 2 ~ 3 1~ PCT~U590/02138 reinforcin~ fillers such as wollastonite, asbestos, talc, a~umina, clay, mica, glass beads, f~med sil~ca, gypsum ,~
~ and the like; and reinforc~ment fibers ~uch as aramid, ::
.. boron, car~on, graphite, and glass. Glass fi~er is the S most widely used reinforeement in the fonm of chopped or milled strands, ribb~n, yarn, filaments, or woven mats.
Mixtures of reinforcing and non-reinforcing fillers may be used, such as a mixture of glass ibers and ~alc or ;
wolla~tonite. These reinforc~ng agents are used in ; 10 amounts of from abou~ 10 ~o a~out 8~ wei~h~ percent, whereas ~he non~reinforcing fillers are us~d in amounts of up to 50 weight percen~. Other:additives include :::
stabilize-s,~pigments t flame re~ardants, plasticizers, : processing aids, coupling agents, lubricants, mold ~:
lS release agen~s, and ~he like. The~e additives ar~ used in amounts which achieYe the de~ired result. :~
Pol~ar~lsulfone Polyarylfiulfone i8 the preferr~ thermoplastic polymer ~ubstrate of the i nvention. It is an amorphous 20 thermoplastic polymer con~aining usli~s of the formula:

~ J ) ~ ~ D

~ and/or ~

~: ~

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~, ~
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WO90/12~3 ~ 3 j 5 1 ~ P ~/US90~213~ i ;

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wherein Rss is independently hydrogen, Cl to C6 al~yl to .
C4 to C8 cycloalkyl, X' is independen~ly Rs6 C :
S R~j 7 .
wherein Rs6 and RS7 are independen~ly hydrogen or Cl ~o `:
Cg al~yl, or \/ . :' ( R5~
(C~al :~.
R5~ .
wherein Rs8 and Rsg are independently hydrogen or Cl to ;`
C8 alkyl, and al is an integer of 3 to 8, -S-,;-O-~ or .~-15 ~ , a is ~n integer ~f 0 ~o 4 and n is independently an ~.
integer of 1 to 3 and wherein the ra~io of unit tI) to the sum of u~ts (II) and/or (III) is greater ~han 1. .;~
The units are a~ched to aach other by an -O- bond. ,.
; A pref~rred pol~mer of ~his inven~ion contains ~`
20 units of th~ formula~
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~SOf~
,', .~,,;, ~ , ~
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WO ~/126~3 PCr/U~gû/021~

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~ '' Another pref erred polyarylsul~one of ~his invention contains units of the f o~ula:

50 ~ . and B~

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These units are a~ctached ~o ~ach ot:her by an -O- b~nd.
~he polyaryl~ul fon~ may b~ xandom or may have 5 an ordered s~ru ::ture . The polyaryl~;ulfones of this invention have a reduced YiSC05ity of from a~out 0 . 4 to greater ~han 2 . 5, as measured in N-me~chylpyrolidone, o other sui~able soiven~, at 25C.
I~aminatinq~a5~
One embodim~ of this inYen~ion is direc~ed to the use of a bellows which assi~t in exerting a uniform pressure across the surface of ~ ~ubs~rate. ~he sur~ac:e can be two~i~ensional or three~ siona~. The bellows, when arranged as shown i~ Figure 1, assists in 15 obtaining a uniform transer pressure of conductor or : printed circuît on a r~lease~medium to a substrate.
Ob~aining such a unifoDm transfer pressure is ; particularly difficult where the su~s~rate for the circuit is three-dimensional.~As shown in the schemat c 20 repres~nta:~ion in Figure 1, heated platen }0 has a ; :
bellows 11 attached to it. ~The bellows can be made of :
metal f;iiled with a conventional f3uid. bf course,`~he bellows can contain the mentioned fluid but also may :
contain a: lowable powder, gel or deformable elast~meric ~ 25 powder. A diaph:ragm 12 i~ at~a~hed to ~he ~ellows. ~q:le j~ ~ diapbra:gm~is constrained in a cavity and is composed of a . ~
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WO90/12~3 ~ 0~ 9 ~ PCT/~9~02~38 ::
I
. 15 '~, silicone elastomer mold which is the mirror image ~f the s~rface of ~he subs~ate to which ~he electric circuitry ;~ is to be bonded. Pre~rably r the mold is sili~one or can be another elastomeric diaphra~m which has the ~ame con- ;
S tour as the two or three-dimensi~nal substrate. The mold ~i is located ~o that during compres~ion movement lateral to the direction of compression is avoided ~o ~he exten~ that uniform pre~sure i8 applied across the surf~ce of the substrate, ~ha~ is, ~he mold is su~stantially confined.
~lso shown in Figure 1 is a heated pla~en 13 which has a cavity 14. ~he cavity permi~s i~sertion of a substantial por~ion of the substrate 15. Only as much of substrate as necessary need pro~ec~ so tha~ the(substrate cannot distort or move laterally during compr~ssion. ~::
15 ~hus, the cavity sub~tantially confines ~he su~strate. :~
;Figure } also shows release medium 16 situated betw~en .
diaphragm 12 and substrate 15 In operation, ~ubstrate 15 is in~erted in cavity ~`:
14. Preferably, heated platen lO fun~tions ~o ~hat ~ellows ~;-20 11 clo3es toward heated pla~en 13 after th~ xel~ase medium16 is interposed ~ tween diaphragm or mold 12 and ~ubs~r~e 15~ The bellows e~er~ a uniform pressure on diaphragm or :~
mold 12 which in turn exerts a uniform pressure on the ~urface of sub~trate 15. The heat, which can be supplied 25 by any conventional means t ef~e~ts a unîfosm ~onding across :~
the ~uxface of the ~ubstrate. Al~o, ~he pres~ure transfer medium can be h ated with rod heaters or by heat transfer ~ betwe,en~he pla~enx, in particular about ~he p~riph~ry of :~
; ~he ~rf fiC2 of tha ~ub&~ra~.
~j 30 The basic: oomponents carried by the release or -:
I : trans~er ~ediums or paper~are the con~uctox and adhesi~
~ There are preferably re components. They ~include in .~ ~ .
,~ ~ ~ :
,., , ~ ':

WO90~12683 2 0 3 1 5 1 9 PCT/~S90/02138 the~order applied to the release paper before transfer:
graphics or legends,sQlde mask, printed circuit and 2dhesive. The first~mentioned compo~ent is infoxmational or educational legends to ~e applied to the ~ubstrate.
S This trsnsfer medium facilitates manufa~ure of the circuit board in an exp2di~ious manner. However, one or more components can b~ applied to the substrate ~eparately. For example, the legends can be applied directly to the circuit board or multiple ~ransfer of 10 circuits can be don~ to the ~ame substrate.
In another em~odiment of the invention, a combination of cylinder and diaphragms are used to pro~ide a uniform pressure across the surface of the ~ubstrate. This is ~hown in Figur~ 2. As ~hown in tha~
lS Figure, heated platen 17 has a cyli~der 18 fixed to it.
The cylinder contain~ two diaphra~ms. One diaphra~m is an i~olation diaphragm o~ bellows-lîke diaphragm 19 which ~eparates a pressurized fluid cvntained in one part 20 of the cylinder 18. The pressurized f~uid ~an be 20 polyglycol. ~he fluid ca~ enter at 2I, exit at 22 and be recycled. Of courfie, this fluid can be hea~ed using con~entional means not ~hown. Diaphragm 23 is located ~t the di~tal end of the:cylinder pro~iding a second portion 24 of the cylinder 18. The secon~ portion ~:~
25 contains a flowable powder or gelled fluid or silica gel cr deformable elastomeric~ powder. This lat~er medi~
tran~fer~ pre~sure exerted from the upper part of the cylinder! ~ia diaphragm~19. Diaphragm 23 is posltioned a~ ~.
the ~l~tal end o cylinder 18. The diaphraqm is : ~30 preférably:composed of a ~ilicone elastomRr as in t~e : previou~ embodimen~nd takes;th~ ~ame contour as the ~urace ~f the ~ub~t~ate lS. Relea~e ~edium ~6 overlays the ~ub8trate lS prior to bonding. ~f course, ~he WO9Otl~683 2 0 3 1 5 1 ~ PCT/US90/02138 ;``

17 ....

relaas~ble medium or paper, as in the previous embodiment, is remov0d after laminating the printed circuit on the substrat2. As in the prevîous ~mbodLment~ `
~he substrate lS iR in erted into a cavity 25 located in -~:
5 heated platen 26.
In operation, sub~trate 15 is inser~ed in he ted platen 26. A release paper is placed in .:
registration on the ~urface o the ubstrate 15.
Cylinder 18 closes toward the subs~rate. When the 10 diaphragm meet~ the substrate 15, pressure and heat are ~.
exerted by the pre~urized fluid in portion 20 of the cylinder 18. That heat and pressure are transferred via isolation di~phragm l9 to the medium in portion 24 of ~ ;
cylinder 13. This în turn provides a uniform pres~ure ;
lS over the surface~of the substrate lS and sssists in l~minating the printed circuit to the substrate uniformly acxoss th~ ~urface of ~he ~ubs~rate, in paxticular, about -;:
the perim~ter of the ~u~strate lS. ;~
~veralll the ~ odiments of this invention :~
~0 provide a technigue wh~ch el~minates the hazard of using a ~ladder with hot pressurized fluid which can bur~t or :~
~et fluid at per~onnel.
Intended Use The tran~fer of circuitry an be made to take 25 place o~ar plana~ or a three-dLmensional substrates ~o .:
the ~xtent the ~urface ifi ~deYelOpable". ~or example, a ~hree-dimensional circuit can be ~ransferred to an `; I ., in~ection molded ~ubstrate.
U-~es or the proeess are aime~ a~ such thr~e-~ 30 dimensional type devices in high volume where the ~peed : oX the printing proce~:for the circuit nnd the ....
e~ficiency~o~;the u~ of in:~e~ion molded ~ub~tr&te can be utilized ~o~t-effectively.

.

: : ' .` ` WO 90/126B3 : 2 ~ 31519 PCr/US90/02138 Specifically, planar or shallow three-.~ di.mensional circuit boards can be ef f iciently produced .~ using the process . Al~o, w~ith some process modif ication,a series of molded pla~tic chip carriexs can be tooled 5 and produced. ~hese pla-~itic chip car:riers utiliz~ a pre-~; molded thermoplastic ~ubstrat~ and :a transfer process to t ~pply the conductors, which a~e subse~uently plated to accommodate wir~ bonding and soldering operations.
These chip carrlers are manufa~tured from the lO same xesin system tha~ is uxed in the circuit boaxds; and .
when they sra used:together, there is no ~h~mal mismatch ~:~
. .
between ~he chip c~rrier and the circuit board.
. ~ automotiv~ use includes molding a t:ircuitry to the in~ide roof portion of an automobile having dome 1 5 light circultry~

; The inYention will now be described w~th examples of the teachings set forth above.: Th~e~ ~
example~ are exemplary and~not exclusive~ They sre not 20 cons~idered 1imit1ng. Concentratio~s:are ~ rcen~ ~y weight unle~s otherwise ind1ca~ed.

The~followlng~inyredien~s:in percen~ by weight~
are blended toge~her at ~room *emSperature 25:~ .81 p~rcent~polyhydroxy ther known as ~:
Phenox~PX~E~
II) 2.75 percent 3,4 ep~xy cy~lohexyl methyl : : .~.;
3,4 epoxy cyclohexyl carboxy~ e:k~own as epoxy ERL-4;22ll ~nd-30 ~ 8~.~47 ~rcent ~ diethylene~ :g~lycol mo~obutyl :~
eth~er:~ icetate~;knv~ a~ butyl Car~lto1 acetate. ~

WO 90/1~8~ ~
_ ` 2 ~ 3 ~ ~ 1 9 Pcl`/us9O/0213~
I

1~

To ~his mixture is added the follcswing ingxedients:
(IV) 82 . 6~ p~3rcent of silver powc~er from Metz ~etallurgical Co. known as ~ETZ EG200ED;
and ~ V) 4 . 35 percent of silver flake also from ~i Metz Metallurgical Co. lcnown as ~ETZ 50S.
More particularly, the phenoxy ~esis~
dissol~red in diethylene glycol monobutyl e~her ace~cate ~:
~0 with agitation. ~he epoxy resin i~ added to this mix~ure ~ ~.
while agitakion is continued. Then, silver powder is added to the mixture under con~inued agitation un~cil it is dispersed to a Hegman grind of 5iX. q~hen, the silver f lake is added until it is also dispersed ~o a s;7rind of 15 5i~ or be~ter. The Yi5CC~Si~y of the mix~ure is 35, 000 cps as cletermined with a Brooksf ield R~ Yiscometer at 24C using a nr~er ~ix ~pindle at 20 rpm. The 2.5/20 ~:
rpm ~JiSCos~y ratio is 4 . The cond.ucti~e m~3tal and '; binder are misced togeth~3r until c:ompletely homogenized ~o 2 O f orm an in}c .
This conduc~ive lnk ~ s screen printed (U . S . ~;
Sie~re ~;i2~3 230), u~ing conve3ltional tec:hniqu~3s, onto VNS
Supen~at rel~ase paper t obtained rom S . D . Warren Co ., Westbrook, 2~ainei to a thic~cness of approxima~ely 1 mil ~S after drying.
The pxin~ed pap~r i~ dried in a f orc~d con~rec~ion ov~n at 96C or ten ~ nu~es . - i Separ~tely, ~n adh~siv~ contai~ g ~he fs~llowiny ingredient~ is pxepared~

~ : .

.
,~.., ~." ~ : ~
`~-.`. :

WO90/12683 2031519 : ~
P~T/US90~021.~

`
,, ' ''' TRADE NAME CHEM CAL NAME ~EW ~WT.%~
PHENOXY PRFE POLYHYDROXY ETHER 18.99 RESIMENE 2040 ~ MEL~MINE FORMALDEHYDE O.95 40 BUTYL CAR8ITOL DIETHYLENE GLYCOL MONO 75.96 ACETATE BUTYL ETH~ ACETATE
,i BLACR SAPL NIGROSINE 8LACK 0~19 45 BENZOIC ACID BENZOIC ~CID 0.05 CABOSIL SILICA 3.~6 ............................. ............................................ .............. : .
Makin~ The Adhesive .
The polyhydroxyether or phenoxy resin is 50 dissolved in the diethylene~glycol monobutyl ether --acetate using high ~peed mixing until all the ~esin :
particles are dissolved- The melamine formaldehyde !'.
resin ls then ~dded. The nigrosine black and benzoic acid are mixed toge~her ~nd ~hen added with hiyh shear 55 agitation. The h~gh ~urface ~rea siliea i~ then added with:high~shear mixi~g. The entrained ~ir is:removed with vacuum. The~iscosity:of ~he adhesive composi~ion measured wi~th ~ RVT Viscometer at 24~C using~a n ~ er ~: six:spindle at 20 rpm is 35,000 cps with a 2.~5/20rpm : 60 ~isc~sity ratio of 4.
The prepared adhe~s~ive i8 screen printed~in : regi~tration:on ;t~p of the conductor surface~of the . print~d circuit~which is:already dxied.: Then, the:
adhesive coated circui~ is placed in a forced convection 65 oven ~t 9~6;C for~10~mi~ute~ until ~he adhesi~e!coa~!ifi dy but not~fulIy cured.
A~ubstrate:i~molded from a~:~c~mp~ition : contslning~78~w~ight p~rcent~of:a polymer containing~the~
following;~unit~

~ W~90/1~6X3 P~T/~S90/02138 21 `:

~so~o<~o;~

'i haYing a reduced vi~c08ity of 0.61 dl/g as mea~ured in N- `-.
me~hyl-pyrxolidinone ~0.2 g~10~ ml) at 25~. The t composition also contains 10 wf2igh~ percent mica and 10 weight percent of chopped glass fibers ~b~ained from 5 Owens Corning. ~ .-The substra~e comp~sition is inje tion molded using conventional co~di~ionsf A 6x6 plaque~which is 0.06" thick is ~old~d. The melt gemperatur~ is 377~
and the mold temperature is 30SF. The injection spe~d 0 i5 35mm/secr and:the in~ctio~ moldi~g pres~ure is 100 bars for 7 ~ec. : -fThe ubffstrate sheet is ~apor polifshed with ~ethylene chloride for about on~ ffsecond -The ~b~trat~ i~ pla~ ~ in a compression platen lS press as ~;hown in Figure~ 4 ~nd 6 wi~h ~he r~laa~e paper ~on~aining~the condu~or ~1.0-I.2 ~il~ dry ~ilm ~:
thickne~) ~nd;the ~dhefii~e printed in the: regi~tration :;
(0.6-0.8 mils dry film thickness). One~of the platens i~
~; fitted with ~ diaphragm or b~llow~a~hown in ~ach~of ~ :~
20 the Figures. Then it i~ molded ~t 600:psi for 3 minutes at 177C af~er the release paper i~: strip ~ d away.:
~The circuit board i8: ~hen ~ured in a~ oYen at 150C or 30 minute~. A~ter cure, the ~oar~ can be 1 soldered wi~h ~ h~nd ~oldering iron or in ~ wa~e ~older :~
.
~ 2~ machine s~k at::246C ~i~h a carrier speed of 6 f~/min. ~
, The electri~a). re~i~tance of~a ~ ~ are ~erp~ntine pR~tern !~: ` wa~ mea~red with ~ ~illiohm ~et~r. Consi~ent~lues:in ~-;
1: : the range of S-10:milliohms/1 ~il ~uare ~re obtained.
:~,.
.
:

:: :

:
. WO90~12683 PCr/US90/02138 2031~

22 ~
~'','.
Comparati~e test~ are oonducted using an ; earlier press shown in Figure~ 4A and 4~ and a press :, according to the teachings of this invention shown in .
Figure 6. In each test, a sub~trate having a ~wo- :
5 dimensional surface is placed on or in a platen. The :~
thicknes~ which protrudes is 20 mils. The rele~e or .`
transfer paper with printed circuit and adhesi~e .
components is plaeed on it. ~The bosrd and transfer -;
medium are compressed by closing the platens. Laminstion 1~ is achieved using a pressure of 600 p~i, a temperature `.
of 177C and a ~ime of three minutes. Then the release - paper is removed, and the circuitized substrate is cur~d -.
; at 150C for ~hlrty minut~s. ~fter cur~, the ~oard can be soldered with a hand ~oldering iron or in a wave ~
15 solder machine set at 246~with a carrier speed of 6 ft/mm.
For bond strqngth~:determination, copper wires `
(.05~inch diameter) arè ~oldered onto 1~4 inch diameter pads of the circuit board. ~fter cooling, th2:wire~ are: :.`
. 20 pulled from ~he boards clamped~onto the base of a .. ~ Chatillon tensile te8ter ~odel UTSM. The wires ~re ~-:
hooked onto the end of a~ANETER~CCU Force Gage XI. The : ;: cir~uit boaxd is then lowered:at tha ~1 ~etting of the Chatillon ~te5tert:~ and the maximum ~orce is m~asured to : 25 break the:bond ~etween the wire and the 1/:4 in~h:pad on a 1/16 inch~ub~tra:te board.~ The ~ample~:obtained~using~
the prior art pre~s ~howed the:non uniform ~est~re~ults ; of ~igure~5~ Those obtained~iusing the proce6s!0f this ~- : in~ntion 8howed the~uniform results~of~ ure 7.~
~ Figure~5~8hows an~average ~en~ile~s~re~gth of 25.0~ lbs~or in other word~ 510~5 psi with 13%~of:the . ~ a~-1ure- ~n the substrat~e.~ Ho~ever, rigure 7 shows an WO90/12683 2 0 3 ~ ~ 3 9 PCT/US90/0213B

average tensile strength 48.1 lbs or 980.6 psi with 91%
of f ailures in the substrate.
~hile these results are ~ery Lmpressive, ea~h I ' figure shows the test r~sults at different locations on a ~:~
; S circuit board like that of Figur~ 3. Each of the ~ixteen circuits were tested. The tensile strength ~ a~urement ~:
for the adhesion bond of each circuit is shown with ~he `~
I bond strength determination for the soldered wire shown in the upper right hand corn~r. Failures are designated 10 n p ~I or ~S~ to indicate plug (plastic board) or snap :`
: (cixcuit interface) failures, respectively. In Figure 5, the prior art technique shows ~he least bond s~rength about the perimeter of the circuit board. Howe~er, Figure 6 according:to this invention shows ~uperior, 15 uniform bond ~trength all ove~ the cîrcuit ~oard comp~red ~o the results of Figure 5 tests.
Exam~le 2 : Example 1 is repeated except tha~ ~o~h ~ide~ ofthe circuit bsard are laminated wi~h a printed circuit.
E~am~e 3 Example 1 is repeated~except that th~ su~face of the circuit board upon which circuitry i8 applied iS
~hxe~-dimensional.
Although the invention h~s been described in 2.5 conj~nction with specific embodiment~, it i8 ~evident ~hat msny alternatives and ~ariations will be appærent ~o : those skilIed in the art in light of the foregoing descriF~ion. This:may include op~ionally plating the printed circuit e~en thou~h ~he circuit i& ~olderable 30 wi~hout thi~ tr:eatment. This may al~o includ~ reversing ~ the platen arr~ngement ~o that the su~strate:i~ abo~
: . ~ ~he platen housing~he mold. Also, bo~h ~ide~ of the substr~te may be proces~ed. ~ccordin~ly, ~he . :

~ ~ : :
:
, WO 90/12683 2 0 3 ~ PCr~US90~021?~

24 :.
.~

invention i~ intended to em~race all of ~he alternatil,res and Yariations that f all within the spirit and scope of the appended claims. ~;

. .
" '''`

~ : :~ ',,`,.

..... .. ..

Claims

1. A uniform pressure transmitting apparatus for uniformly laminating a conductor to an at least two-dimensional substrate surface comprising, (a) a first platen means having a fluid filled bellow with a first cavity means substantially confining a mold which is a mirror image of the at least two-dimensional substrate surface, (b) a second platen means containing a second cavity means dimensioned to protrude a portion of the thickness of the substrate, (c) pressurization means for compressing a conductor overlaid on the substrate surface, and (d) laminating means to bond the conductor to the substrate surface.

2. The transmitting apparatus according to claim 1, wherein the surface of the substrate is three-dimensional.

3. The transmitting apparatus according to claim 1, wherein the mold is composed of silicone rubber.

4. The transmitting apparatus according to claim 1, wherein the substrate is plastic.

5. The transmitting apparatus according to claim 4, wherein the substrate is thermoplastic.

6. The transmitting apparatus according to claim 4, wherein the plastic is polyarylsulfone.

7. The transmitting apparatus according to claim 1, wherein the bellow is made of metal.

8. The apparatus according to claim 1, wherein the fluid contained in the bellows is a liquid flowable powder, gel or deformable elastomer powder.

9. The apparatus according to claim 1, wherein the conductor is a printed circuit.

10. A uniform pressure transmitting apparatus for uniformly laminating a printed circuit to an at least two-dimensional substrate surface comprising, (a) a first platen means having a fluid filled bellows with a first cavity means substantially confining a mold which is a mirror image of the at least two-dimensional substrate surface, (b) a second platen means containing a second cavity means dimensioned to protrude a portion of the thickness of the substrate, (c) pressurization means for compressing a printed circuit positioned on the substrate surface, and (d) laminating means to bond the printed circuit to the substrate surface.

11. A method for uniformly laminating a conductor to an at least two-dimensional substrate surface comprising, inserting a substantial portion of the thickness of the substrate in a cavity means of a platen means, positioning a conductor on the substrate surface, applying a uniform pressure to the conductor and substrate surface using another platen means having a fluid-filled bellows containing another cavity means which substantially confines a mold, which is a mirror image of the at least two-dimensional substrate surface, and laminating the conductor to the substrate surface.

12. The method according to claim 11, wherein the substrate surface is three-dimensional.

13. The method according to claim 11, wherein the lamination is effected with heat.

14. The method according to claim 11, wherein the mold is made of silicone rubber.

15. The method according to claim 11, wherein the substrate is made of plastic.

16. The method according to claim 15, wherein the substrate is made of thermoplastic.

17. The method according to claim 15, wherein the plastic is polyarylsulfone.

18. The method according to claim 11, wherein the bellows is a metal bellows.

19. The method according to claim 11, wherein the fluid is a liquid flowable powder, gel or deformable elastomer powder.

20. The method according to claim 11, wherein the conductor is a printed circuit .

21. A method for uniformly laminating a printed circuit to an at least two-dimensional substrate surface comprising, inserting a substantial portion of the thickness of the substrate in a cavity means of a platen means, positioning a printed circuit on the substrate surface, applying uniform pressure to the printed circuit and substrate surface using another platen means having a fluid-filled bellows containing another cavity means which substantially confines a mold, which is a mirror image of the at least two-dimensional substrate surface, and laminating the printed circuit to the substrate surface.

22. A uniform pressure transmitting apparatus for uniformly laminating a conductor to an at least two-dimensional substrate surface, comprising, (a) a first platen means having a cylinder having a plurality of diaphragms, one diaphragm separates the internal volume of the cylinder and another diaphragm, in the shape of a mold, is located at the distal end of the cylinder adjacent another platen means, the mold is the mirror image of the at least two-dimensional substrate surface and is substantially confined in a cavity means at the distal end of the cylinder, the cylinder volume located adjacent the one platen means is constructed and arranged to heat and pressurize a fluid medium occupying this volume and transfer the heat and pressure to the other volume adjacent the distal end of the cylinder, the other platen means includes another cavity means dimensioned to project a portion of the thickness of the substrate, and laminating means to bond the conductor to the substrate.

23. The apparatus according to claim 22, wherein the substrate surface is three-dimensional.

24. The apparatus according to claim 22, wherein the mold is made of silicone rubber.

25. The apparatus according to claim 22, wherein the substrate is plastic.

26. The apparatus according to claim 25, wherein the substrate is thermoplastic.

27. The apparatus according to claim 25, wherein the substrate is polyarylsulfone.

28. The apparatus according to claim 22, wherein the fluid is polyglycol.

29. The apparatus according to claim 22, wherein the fluid is recycled.

30. The apparatus according to claim 22, wherein the transfer medium is a flowable powder, gelled fluid, silicone gel, or deformable elastomer powder.

31. The apparatus according to claim 22, wherein the conductor is a printed circuit.

32. A uniform pressure transmitting apparatus for uniformly laminating a printed circuit to an at least two-dimensional substrate surface, comprising, a first platen means having a cylinder having a plurality of diaphragms, one diaphragm separates the internal volume of the cylinder and another diaphragm, in the shape of a mold, is located at the distal end of the cylinder adjacent another plated means, the mold is the mirror image of the at least two-dimensional substrate surface, and is substantially confined in a cavity means at the distal end of the cylinder, the cylinder volume located adjacent the one platen means is constructed and arranged to heat and pressurize a fluid medium occupying this volume and transfer the heat and pressure to the other volume adjacent the distal end of the cylinder, the other platen means includes another cavity means dimensioned to project a portion of the thickness of the substrate, and laminating means to bond the printed circuit to the substrate.

33. A method for uniformly laminating a conductor to an at least two-dimensional substrate surface comprising, inserting a substantial portion of a thickness of an at least two-dimensional substrate in a cavity means of a platen means, positioning a conductor over the substrate surface, applying uniform pressure to the conductor and substrate surface using another platen means having a cylinder attached to it, which cylinder contains a plurality of diaphragms with one of the diaphragms being a mold, which is the mirror image of the substrate surface, heating and pressurizing a fluid in the cylinder volume bordered by it, the other platen means and the other diaphragm, transmitting the heat and pressure to the cylinder volume bounded by it and the diaphragms and laminating the conductor to the substrate surface.

34. The method according to claim 33, wherein the substrate surface is three-dimensional.

35. The method according to claim 33, wherein the mold is a silicone rubber mold.

36. The method according to claim 33, wherein the substrate is plastic.

37. The method according to claim 36, wherein the substrate is thermoplastic.

38. The method according to claim 36, wherein the plastic is polyarylsulfone.

39. The method according to claim 33, wherein the fluid is a polyglycol.

40. The method according to claim 33, wherein the fluid is recycled.

41. The method according to claim 33, wherein the transfer medium is a flowable powder, gelled fluid, silicone gel or deformable elastomer powder.

42. The method according to claim 33, wherein the conductor is a printed circuit.

43. A method for uniformly laminating a printed circuit to an at least two-dimensional substrate surface comprising, inserting A substantial portion of a thickness of an at least two-dimensional substrate in a cavity means of a platen means, positioning a printed circuit over the substrate surface, applying uniform pressure to the printed circuit and substrate surface using another platen means having a cylinder attached to it, which cylinder contains a plurality of diaphragms with one of the diaphragms being a mold, which is the mirror image of the substrate surface, heating and pressurizing a fluid in the cylinder volume bordered by it, the other platen and the other diaphragm, transmitting the heat and pressure to the cylinder volume bounded by it and the diaphragm and laminating the printed circuit to the substrate surface.