JPH0350149A - Production of ceramic green sheet - Google Patents

Production of ceramic green sheet

Info

Publication number
JPH0350149A
JPH0350149A JP1186856A JP18685689A JPH0350149A JP H0350149 A JPH0350149 A JP H0350149A JP 1186856 A JP1186856 A JP 1186856A JP 18685689 A JP18685689 A JP 18685689A JP H0350149 A JPH0350149 A JP H0350149A
Authority
JP
Japan
Prior art keywords
powder
green sheet
solvent
sheet
surface roughness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1186856A
Other languages
Japanese (ja)
Inventor
Koji Yamada
浩嗣 山田
Kiichi Yoshiara
喜市 吉新
Isao Kitamura
北村 勲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1186856A priority Critical patent/JPH0350149A/en
Publication of JPH0350149A publication Critical patent/JPH0350149A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To obtain the above sheet which has a flat surface and is improved in surface roughness after calcination by specifying a solvent at the time of using a slurry consisting of glass powder, powder of alumina, etc., plasticizers such as DOP and toluene as a solvent. CONSTITUTION:The slurry consisting, by weight %, of 40 to 60% glass powder, 60 to 40% ceramic powder of alumina or mullite powder, IBMA(isobutyl methacrylate) or DOP(dioctyl phthalate) as a binder and isobutyl acetate as the solvent is used. The toluene used heretofore is substd. with the isobutyl acetate in such a manner, by which the surface of a green sheet is additionally flattened. The surface roughness after calcination is correspondingly improved and there is no need for polishing the green sheet even in the case of using the sheet as a white board; for example, the formation of copper-polyimide wirings with which fine wiring is possible is facilitated in the case of using the sheet as a multilayered substrate.

Description

【発明の詳細な説明】 [産業上の利用分野] この発明は1例えばセラミック多層配線回路基板に用い
られるセラミックグリーンシートのm遣方法に係り、特
にAu、^g、Ag−Pd、Cuなどの低融点金属を導
体に用いるための低温焼成基板用のグリーンシートの製
造方法に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing ceramic green sheets used, for example, in ceramic multilayer wiring circuit boards, and particularly relates to a method for using ceramic green sheets such as Au, ^g, Ag-Pd, Cu, etc. The present invention relates to a method of manufacturing a green sheet for a low temperature fired substrate using a low melting point metal as a conductor.

[従来の技術] 従来例えば特開昭57−206088号公報に示されて
いるように、セラミックグリーンシートは、主成分であ
るアルミナ粉末と焼結助剤としてのガラス粉末に分散剤
と溶剤とを加えて24hrボールミルして粉砕、混合を
行った後、バインダーと可塑剤とを加えて再び24hr
ボールミルして混合を行いスラリーとし、その後、脱泡
してスラリーの粘度を調整し、これをシリコンでコーテ
ィングしたマイラーシート上に流しドクターブレードと
上記のシートのギャップによりグリーンシート厚を調整
して作られる。低温焼成基板に用いられているセラミッ
クグリーンシートの組成は、アルミナ粉末40〜60重
量%、ガラス粉末60〜40重量%、バインダーとてメ
タクリル系のIBMA(イソブチルメタアクリレート)
、可塑剤としてDBP(ジブチルメタアクリレート)、
溶剤として使用されているのがトルエンである。
[Prior Art] Conventionally, as shown in Japanese Patent Application Laid-Open No. 57-206088, ceramic green sheets are produced by adding a dispersant and a solvent to alumina powder as the main component and glass powder as a sintering aid. In addition, after pulverizing and mixing with a ball mill for 24 hours, a binder and a plasticizer were added and the mixture was heated again for 24 hours.
Ball mill the mixture to make a slurry, then defoamer to adjust the viscosity of the slurry, pour this onto a Mylar sheet coated with silicone, and adjust the thickness of the green sheet using the gap between the doctor blade and the above sheet. It will be done. The composition of the ceramic green sheet used for the low-temperature fired substrate is 40-60% by weight of alumina powder, 60-40% by weight of glass powder, and methacrylic-based IBMA (isobutyl methacrylate) as a binder.
, DBP (dibutyl methacrylate) as a plasticizer,
Toluene is used as a solvent.

セラミック多層配線回路基板では、上記の方法で作成し
たグリーンシートに層間導通をはかるためにスルーホー
ルを形成し、スクリーン印刷によってスルーホール部へ
導体ペーストを充填し、配線パタ−ンもスクリーン印刷
で形成する。そして、所望の枚数のグリーンシートを積
層し加熱圧着(120℃150にに1cm2)すること
で一体化し、約900℃で焼成してセラミック多層配線
基板としていた。
In ceramic multilayer wiring circuit boards, through holes are formed in the green sheet created by the above method to ensure interlayer conduction, and conductive paste is filled into the through holes by screen printing, and the wiring pattern is also formed by screen printing. do. Then, a desired number of green sheets were laminated and integrated by heat-pressing (1 cm2 at 120° C., 150° C.), and fired at about 900° C. to form a ceramic multilayer wiring board.

[発明が解決しようとする課題] 従来のセラミック多層回路基板は上記の方法で作成され
るので、グリーンシートの厚さの均一性や表面粗さの小
さいことが必要となるが、上記に記した低温焼成基板用
の組成では、溶剤としてトルエンを使用するため、グリ
ーンシートの乾燥速度が早く、表面粗さが大きくなりや
すく、また、ピンホールもできやすくなると共に、取り
扱う上でもベンゼンに近い毒性をもち安全の面からみて
も好ましくないなどの課題があった。
[Problems to be Solved by the Invention] Conventional ceramic multilayer circuit boards are produced by the method described above, so it is necessary for the green sheet to have uniform thickness and small surface roughness. In the composition for low-temperature firing substrates, toluene is used as a solvent, so the green sheet dries quickly, the surface roughness tends to increase, pinholes are more likely to form, and the toxicity is similar to that of benzene when handling. There were issues such as being unfavorable from a rice cake safety standpoint.

この発明は、かかる課題を解消するためになされたもの
で、表面がより平坦になり、焼成後の表面粗さも向上し
、白板として使用する場合においても研磨をする必要が
なく経済性もよくなり、例えば多層基板として用いるこ
とのできるセラミックグリーンシートの製造方法を得る
ことを目的とする。
This invention was made in order to solve these problems, and the surface becomes flatter, the surface roughness after firing is improved, and even when used as a white board, there is no need to polish it, making it more economical. An object of the present invention is to obtain a method for manufacturing a ceramic green sheet that can be used, for example, as a multilayer substrate.

[課題を解決するための手段] この発明のセラミックグリーンシートの製造方法は、ガ
ラス粉末40〜60重量%、アルミナ粉末およびムライ
ト粉末の内の少なくとも一種のセラミックス粉末60〜
40重量%、バインダーとしてIBMA(イソブチルメ
タアクリレート)、可塑剤としてDBP (ジブチルフ
タレート)およびDOP (ジオクチルフタレート)の
内の少なくとも一種、並びに溶剤として酢酸イソブチル
で構成されたスラリーを用いるものである。
[Means for Solving the Problems] The method for producing a ceramic green sheet of the present invention includes 40 to 60% by weight of glass powder, 60 to 60% by weight of ceramic powder of at least one of alumina powder and mullite powder.
40% by weight, IBMA (isobutyl methacrylate) as a binder, at least one of DBP (dibutyl phthalate) and DOP (dioctyl phthalate) as a plasticizer, and isobutyl acetate as a solvent.

[作用] 従来、溶剤として用いていたトルエンを酢酸イソブチル
に代えることによりグリーンシートの表面粗さが向上し
、それに伴い焼成後のセラミック多層回路基板の表面粗
さも向上し、この基板の上に写真製版法による微細配線
が可能な数μm厚の銅−ポリイミド配線の形成が容易と
なる。
[Effect] By replacing toluene, which was conventionally used as a solvent, with isobutyl acetate, the surface roughness of the green sheet is improved, and the surface roughness of the ceramic multilayer circuit board after firing is also improved. It becomes easy to form copper-polyimide wiring with a thickness of several μm, which allows fine wiring by plate making.

[実施例] 以下、この発明を実施例により具体的に説明する。[Example] Hereinafter, the present invention will be specifically explained with reference to Examples.

実施例1 アルミナ粉末(商品名人CLM−27.住友アルミニウ
ム製)を250g、ガラス粉末(SiO,AIO,Ca
O,BO,BaO。
Example 1 250 g of alumina powder (trade name: Meijin CLM-27, manufactured by Sumitomo Aluminum), glass powder (SiO, AIO, Ca
O, BO, BaO.

MgO,ZrOにより構成されたガラス粉末)を250
g、そして溶剤の酢酸イソブチルを250g加えてボー
ルミルにより24時間粉砕した。その後、バインダーと
してメタクリル系のII3MAを135g、可塑剤とし
てDBPを15.加えて再びボールミルを24時間行い
混合し、スラリーを作成した0次に、このスラリーをシ
ート成形が可能な粘度に脱泡(脱溶剤量は120cc)
 シて。
Glass powder composed of MgO, ZrO) at 250
g, and 250 g of isobutyl acetate as a solvent were added thereto, and the mixture was ground in a ball mill for 24 hours. After that, 135 g of methacrylic II3MA was added as a binder, and 15 g of DBP was added as a plasticizer. In addition, the ball mill was again used for 24 hours to mix and create a slurry.Next, this slurry was defoamed to a viscosity that can be molded into a sheet (the amount of solvent removed was 120cc).
Shite.

ドクターブレード法により厚さ0.20〜0.25層m
0この発明の一実施例によるセラミックグリーンシート
を得、その表面粗さを表1に示す。
Thickness 0.20~0.25m by doctor blade method
A ceramic green sheet according to an embodiment of the present invention was obtained, and its surface roughness is shown in Table 1.

比較例1〜3 セラミックグリーンシートを作製する際、溶剤の違いに
よってグリーンシートの表面粗さにどのような差が生じ
るかを調べた。即ち、トルエン(比較例1)、メチルエ
チルケトン(比較例2)、およびセルソルブアセテート
(比較例3)の溶剤をそれぞれ用いる他は実施例1と同
様にして各々セラミックグリーンシートを作成し、その
表面粗さを表1に示す、なお、ここで使用した溶剤は、
溶剤としての条件であるバインダー材料(IBMA)を
完全に溶解させ、かつシート成形上の問題から沸点が8
0℃から150℃の間であることを満たすものである。
Comparative Examples 1 to 3 When producing ceramic green sheets, it was investigated what kind of difference occurred in the surface roughness of the green sheets depending on the difference in solvent. That is, ceramic green sheets were prepared in the same manner as in Example 1 except that toluene (Comparative Example 1), methyl ethyl ketone (Comparative Example 2), and Cellsolve Acetate (Comparative Example 3) were used as solvents. The solvents used here are shown in Table 1.
The conditions for the solvent are to completely dissolve the binder material (IBMA) and to have a boiling point of 8 due to sheet forming problems.
The temperature must be between 0°C and 150°C.

表1 上記実施例1と比較例1〜3の結果より、#酸イソブチ
ルを溶剤として用いたグリーンシートが表面粗さの小さ
いことがわかり、プロセスの面からみると、セルソルブ
アセテートを使用した場合、沸点が高いために脱泡に時
間がかかり、シート成形時にもシートがなかなか乾燥し
ない欠点をもち、取り扱いの面からみると、トルエンと
メチルエチルケトンは劇物に指定されているので生産に
用いるのは好ましくない、また、上記実施例1および比
較例1〜3のグリーンシートを大気中900℃で1時間
焼成して得られた焼結体の表面粗さを表2に示したが、
やはりグリーンシートの表面粗さが焼結体へも影響して
いるのがわかる。
Table 1 From the results of Example 1 and Comparative Examples 1 to 3 above, it can be seen that the green sheet using isobutyl #acid as a solvent has a small surface roughness, and from a process perspective, when Cellsolve Acetate is used Due to its high boiling point, it takes time to defoam, and the sheet does not dry easily during sheet molding.From a handling standpoint, toluene and methyl ethyl ketone are designated as deleterious substances, so they cannot be used in production. Table 2 shows the surface roughness of the sintered bodies obtained by firing the green sheets of Example 1 and Comparative Examples 1 to 3 in the atmosphere at 900°C for 1 hour.
It can be seen that the surface roughness of the green sheet also affects the sintered body.

表2 実施例2 次に、実施例1におけるアルミナ粉末の代わりにムライ
ト粉末を使用する他は実施例1と同様にしてスラリーを
作製してグリーンシート成形を行い、その表面粗さを表
3に示す。
Table 2 Example 2 Next, a slurry was prepared in the same manner as in Example 1 except that mullite powder was used instead of the alumina powder in Example 1, and green sheet molding was performed. The surface roughness of the slurry is shown in Table 3. show.

比較例4〜6 比較例1〜3におけるアルミナ粉末の代わりにムライト
粉末を使用しする他は各々比較例1〜3と同様にしてセ
ラミックグリーンシートを作成し、その表面粗さを表3
に示す。
Comparative Examples 4 to 6 Ceramic green sheets were prepared in the same manner as in Comparative Examples 1 to 3, except that mullite powder was used instead of the alumina powder in Comparative Examples 1 to 3, and the surface roughness was measured as shown in Table 3.
Shown below.

表3 実施例2と比較例4〜6の結果から、#酸イソブチルを
使用した場合が、他の溶剤、トルエン、メチルエチルケ
トン、セルソルブアセテートを使用した場合に比べて最
も小さいことが解る。
Table 3 From the results of Example 2 and Comparative Examples 4 to 6, it can be seen that the case where #acid isobutyl is used is the smallest compared to the cases where other solvents, toluene, methyl ethyl ketone, and cellosolve acetate are used.

又、上記実施例では可里剤としてDBP (ジブチルフ
タレート)を用いた場合を示したが、DOP(ジオクチ
ルフタレート)を用いてもよい。
Further, in the above embodiment, a case was shown in which DBP (dibutyl phthalate) was used as the lubricating agent, but DOP (dioctyl phthalate) may also be used.

なお、ガラス粉末およびセラミック粉末の混合量が上記
範囲以外ではグリーンシートの特性が低下する。
Note that if the mixed amounts of glass powder and ceramic powder are outside the above range, the properties of the green sheet will deteriorate.

[発明の効果] 以上説明した通り、この発明は、ガラス粉末40〜60
重量%、アルミナ粉末およびムライト粉末の内の少なく
とも一種のセラミックス粉末60〜40重量%、バイン
ダーとしてIBMA(イソブチルメタアクリレート)、
可塑剤としてDBP (ジブチルフタレート)およびD
OP (ジオクチルフタレート)の内の少なくとも一種
、並びに溶剤として#酸イソブチルで構成されたスラリ
ーを用いることにより、表面がより平坦になり、焼成後
の表面粗さも向上し、白板として使用する場合において
も研磨をする必要がなく経済性もよくなり1例えば多J
W基板として泪いる場合には、微細配線が可能な銅−ポ
リイミド配線の形成を容易にできるセラミックグリーン
シートの製造方法を得ることができる。
[Effects of the Invention] As explained above, the present invention has a glass powder of 40 to 60
60-40% by weight of at least one ceramic powder selected from alumina powder and mullite powder, IBMA (isobutyl methacrylate) as a binder,
DBP (dibutyl phthalate) and D as plasticizers
By using a slurry composed of at least one type of OP (dioctyl phthalate) and #acid isobutyl as a solvent, the surface becomes flatter and the surface roughness after firing is improved, even when used as a white board. There is no need for polishing, making it more economical. For example, multi-J
When used as a W substrate, it is possible to obtain a method for manufacturing a ceramic green sheet that facilitates the formation of copper-polyimide wiring that allows fine wiring.

Claims (1)

【特許請求の範囲】[Claims]  ガラス粉末40〜60重量%、アルミナ粉末およびム
ライト粉末の内の少なくとも一種のセラミツクス粉末6
0〜40重量%、バインダーとしてIBMA(イソブチ
ルメタアクリレート)、可塑剤としてDBP(ジブチル
フタレート)およびDOP(ジオクチルフタレート)の
内の少なくとも一種、並びに溶剤として酢酸イソブチル
で構成されたスラリーを用いるセラミックグリーンシー
トの製造方法。
40 to 60% by weight of glass powder, at least one ceramic powder selected from alumina powder and mullite powder 6
Ceramic green sheet using a slurry composed of 0 to 40% by weight, IBMA (isobutyl methacrylate) as a binder, at least one of DBP (dibutyl phthalate) and DOP (dioctyl phthalate) as a plasticizer, and isobutyl acetate as a solvent. manufacturing method.
JP1186856A 1989-07-18 1989-07-18 Production of ceramic green sheet Pending JPH0350149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1186856A JPH0350149A (en) 1989-07-18 1989-07-18 Production of ceramic green sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1186856A JPH0350149A (en) 1989-07-18 1989-07-18 Production of ceramic green sheet

Publications (1)

Publication Number Publication Date
JPH0350149A true JPH0350149A (en) 1991-03-04

Family

ID=16195851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1186856A Pending JPH0350149A (en) 1989-07-18 1989-07-18 Production of ceramic green sheet

Country Status (1)

Country Link
JP (1) JPH0350149A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07162150A (en) * 1993-12-03 1995-06-23 Matsushita Electric Ind Co Ltd Glass ceramic multilayered board
JP2002241201A (en) * 2001-02-15 2002-08-28 Fumakilla Ltd Insecticide having activity-displaying function
JP2003078245A (en) * 2001-08-30 2003-03-14 Kyocera Corp Method of manufacturing multilayer wiring substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07162150A (en) * 1993-12-03 1995-06-23 Matsushita Electric Ind Co Ltd Glass ceramic multilayered board
JP2002241201A (en) * 2001-02-15 2002-08-28 Fumakilla Ltd Insecticide having activity-displaying function
JP2003078245A (en) * 2001-08-30 2003-03-14 Kyocera Corp Method of manufacturing multilayer wiring substrate

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