JPH08162762A - Glass ceramic multilayer circuit board - Google Patents
Glass ceramic multilayer circuit boardInfo
- Publication number
- JPH08162762A JPH08162762A JP6323995A JP32399594A JPH08162762A JP H08162762 A JPH08162762 A JP H08162762A JP 6323995 A JP6323995 A JP 6323995A JP 32399594 A JP32399594 A JP 32399594A JP H08162762 A JPH08162762 A JP H08162762A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- powder
- circuit board
- multilayer circuit
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子機器に使用される
ガラスセラミック多層回路基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass ceramic multilayer circuit board used in electronic equipment.
【０００２】[0002]
【従来の技術】従来、ガラスセラミック多層回路基板
は、絶縁体層としてアルミナを用い、回路配線用導体に
タングステン、モリブデンを用いて１６００℃程度の高
温度で焼成して作製されたが、近年、低温で焼成できる
ガラスセラミック系基板の開発が進められた。この低温
焼成基板を作製するには、絶縁体層として、非晶質ガラ
スまたは結晶化ガラスの粉末（以下、これをシートガラ
ス粉末という）と、アルミナ等のセラミック粉末との混
合粉末（以下、これをガラスセラミック粉末という）に
バインダーを加えたものをスラリー状にしてドクターブ
レード法でシート成形したガラスセラミックグリーンシ
ートを用い、回路配線パターンは、銀粉とビヒクルから
なる導体組成物をスクリーン印刷法等で該グリーンシー
ト上に塗布する。そして、これを複数枚積層して８００
〜９５０℃で焼成することによって作製する。2. Description of the Related Art Conventionally, a glass-ceramic multilayer circuit board was manufactured by using alumina as an insulating layer and using tungsten and molybdenum as a conductor for circuit wiring at a high temperature of about 1600 ° C. The development of glass-ceramic substrates that can be fired at low temperatures was promoted. In order to produce this low-temperature fired substrate, a powder mixture of amorphous glass or crystallized glass (hereinafter, referred to as sheet glass powder) and ceramic powder such as alumina (hereinafter Glass ceramic powder) with a binder added to form a slurry into a glass-ceramic green sheet formed by the doctor blade method.The circuit wiring pattern uses a conductor composition consisting of silver powder and vehicle by screen printing or the like. Apply on the green sheet. Then, stack a plurality of these to 800
It is prepared by firing at ˜950 ° C.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記ガラスセ
ラミックグリーンシートと上記回路配線とを同時焼成す
る際に、銀粉とガラスセラミック粉末の焼結挙動の違い
から、基板の変形やシート層がはがれて膨らむデラミ等
の不具合が発生して多層回路基板の歩留りを低下させ
る。そこで本発明は、変形が可及的に少なく、シート層
のデラミ等の発生がなく、従って、良好な歩留りで作製
することができるガラスセラミック多層回路基板を提供
することを目的とする。However, when the glass-ceramic green sheet and the circuit wiring are simultaneously fired, the deformation of the substrate and the peeling of the sheet layer due to the difference in the sintering behavior of the silver powder and the glass-ceramic powder. Problems such as bulging delamination occur and the yield of the multilayer circuit board is reduced. Therefore, it is an object of the present invention to provide a glass-ceramic multilayer circuit board which is deformed as little as possible and does not cause sheet layer delamination and the like, and can therefore be manufactured with a good yield.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するため
の本発明のガラスセラミック多層回路基板は、軟化点が
Ｔi ℃のシートガラス粉末を用いたガラスセラミックグ
リーンシートと回路配線とを同時焼成して得られる多層
回路基板において、軟化点をＴc ℃として、Ｔi −３０
≦Ｔc ≦Ｔi ＋３０を満足する非晶質ガラス粉末を１０
〜２０重量％含み、残部が銀粉である組成物から、該回
路配線がなることを特徴とする。In the glass ceramic multilayer circuit board of the present invention for solving the above problems, a glass ceramic green sheet using a sheet glass powder having a softening point of T i ° C and a circuit wiring are simultaneously fired. in a multilayer circuit board obtained by the softening point as T c ℃, T i -30
10 amorphous glass powders satisfying ≦ T c ≦ T i +30
It is characterized in that the circuit wiring is made of a composition containing ˜20% by weight and the balance being silver powder.
【０００５】[0005]
【作用】本発明の、軟化点がＴi ℃のシートガラス粉末
を用いたガラスセラミックグリーンシートと回路配線と
を同時焼成して得られる多層回路基板において、軟化点
をＴc ℃として、Ｔi −３０≦Ｔc ≦Ｔi ＋３０を満足
する非晶質ガラス粉末（以下、これを添加ガラス粉末と
いう）を銀粉に添加した組成物から、該回路配線がな
る。添加ガラス粉末を添加することにより、上記基板
は、焼成による変形を極めて起し難くなる。これは、添
加ガラス粉末が、従来の銀粉とガラスセラミック粉末の
焼結挙動の違いに比べて、上記組成物とガラスセラミッ
ク粉末の焼結挙動の違いを著しく少なくするものと推察
される。これを更に述べる。In the multilayer circuit board of the present invention obtained by co-firing the glass ceramic green sheet using the sheet glass powder having the softening point of T i ° C and the circuit wiring, the softening point is T c ° C and T i is The circuit wiring is made of a composition in which an amorphous glass powder satisfying −30 ≦ T c ≦ T i +30 (hereinafter, referred to as additive glass powder) is added to silver powder. By adding the additive glass powder, the substrate is extremely unlikely to be deformed by firing. It is presumed that this is because the added glass powder significantly reduces the difference in the sintering behavior between the composition and the glass ceramic powder as compared with the difference in the conventional sintering behavior between the silver powder and the glass ceramic powder. This will be further described.
【０００６】すなわち、従来の銀粉とガラスセラミック
粉末の焼結挙動の違いは、夫々の焼結開始温度および焼
成収縮量の違いといえる。これに対して、上記組成物の
焼結は、添加ガラス粉末が銀粉の焼結を抑制すると共
に、焼成温度が上昇すると添加ガラス粉末が軟化流動し
て銀粉同士を近付けさせることにより、収縮が生じる。
つまり、上記組成物の収縮は、銀粉の焼結開始温度とは
ほとんど無関係に、しかも添加ガラス粉末の挙動に依存
して生じる。しかるに、この添加ガラス粉末の軟化点Ｔ
c は、シートガラス粉末の軟化点Ｔi と上記の関係を満
足する。従って、上記組成物の焼結挙動と、シートガラ
ス粉末を含むガラスセラミック粉末の焼結挙動とは、著
しく類似してくるものと考えられる。That is, it can be said that the difference in the sintering behavior between the conventional silver powder and the glass ceramic powder is the difference in the sintering start temperature and the firing shrinkage amount. On the other hand, in the sintering of the composition, the added glass powder suppresses the sintering of the silver powder, and when the firing temperature rises, the added glass powder softens and flows to bring the silver powders closer to each other, thereby causing shrinkage. .
That is, the shrinkage of the composition occurs almost independently of the sintering start temperature of the silver powder and also depends on the behavior of the added glass powder. However, the softening point T of this added glass powder
c satisfies the above relationship with the softening point T i of the sheet glass powder. Therefore, it is considered that the sintering behavior of the above composition and the sintering behavior of the glass ceramic powder containing the sheet glass powder are remarkably similar to each other.
【０００７】添加ガラス粉末の軟化点Ｔc ℃がシートガ
ラス粉末の軟化点Ｔi ℃より３０℃を超えて低下したり
上昇すると、焼成による変形が起こり易くなる。また、
添加ガラス粉末が結晶化ガラス材であると、焼成で生成
した液相が焼成後の冷却の際結晶化を起こして変形が生
じ易い。添加ガラス粉末の添加量が１０重量％未満で
は、上記添加ガラス粉末の作用が稀薄になり、一方、２
０重量％を超えると、配線抵抗が著しく高くなる。本発
明で用いる銀粉は、平均粒径を２〜５μｍとするのが好
ましい。平均粒径が２μｍ未満になると上記添加ガラス
粉末の作用を十分発揮させるのに要する該添加ガラス粉
末の添加量が多きに過ぎ易くなり、一方、平均粒径が５
μｍを超えると焼成収縮量が極めて小さくなり変形が起
こり易いだけでなく、配線抵抗が高いため該添加ガラス
粉末を十分添加することができ難くなる。If the softening point T c ° C of the added glass powder falls or rises above the softening point T i ° C of the sheet glass powder by more than 30 ° C, deformation due to firing tends to occur. Also,
When the added glass powder is a crystallized glass material, the liquid phase generated by firing is likely to be crystallized during cooling after firing to cause deformation. If the added amount of the added glass powder is less than 10% by weight, the action of the added glass powder is diminished.
If it exceeds 0% by weight, the wiring resistance becomes extremely high. The silver powder used in the present invention preferably has an average particle size of 2 to 5 μm. If the average particle size is less than 2 μm, the added amount of the added glass powder required to sufficiently exert the action of the added glass powder tends to be too large, while the average particle size is 5
If it exceeds μm, the amount of shrinkage during firing becomes extremely small and deformation is likely to occur, and since the wiring resistance is high, it becomes difficult to sufficiently add the added glass powder.
【０００８】銀粉と添加ガラス粉末はビヒクルと混練し
てペースト状とされ、１５０〜４００メッシュのスクリ
ーンを用いてスクリーン印刷によってグリーンシート上
に塗布される。従って用いる添加ガラス粉末の粒径はこ
のスクリーンを円滑に通過し得るものならばよく、１０
μｍ以下の粒子をほとんど、例えば８０重量％以上含む
ものが好ましい。ビヒクルはエチルセルロース、メタク
リレート樹脂等をタピネオール、ブチルカルビトール、
酢酸−２−ｎ−ブトキシエチル、トルエンなどの溶剤に
溶解したものを使用できる。例えばエチルセルロース１
５〜２０重量部をタピネオール８５〜８０重量部中に溶
解したもの等が適当である。スクリーン印刷により回路
配線を形成するための好適な特性をもったペーストを得
るためには、ビヒクルは固形分１００重量部に対し１５
〜３０重量部とするのがよい。The silver powder and the added glass powder are kneaded with the vehicle to form a paste, which is applied onto the green sheet by screen printing using a screen of 150 to 400 mesh. Therefore, the particle size of the added glass powder used may be 10 so long as it can smoothly pass through this screen.
It is preferable that most of the particles have a particle size of μm or less, for example, 80 wt% or more. Vehicles include ethyl cellulose, methacrylate resin, etc., tapineol, butyl carbitol,
What was dissolved in a solvent such as 2-n-butoxyethyl acetate and toluene can be used. For example, ethyl cellulose 1
It is suitable to dissolve 5 to 20 parts by weight of tapineol in 85 to 80 parts by weight. In order to obtain a paste having suitable characteristics for forming circuit wiring by screen printing, the vehicle is 15 parts by weight based on 100 parts by weight of solid content.
It is preferable that the amount is ˜30 parts by weight.
【０００９】[0009]
［実施例１〜５、比較例１〜９］ＺｎＯを３０．７重量
％、Ａｌ2Ｏ3を８．４重量％、Ｂ2Ｏ3を７．３重量％お
よびＣａＯを１．９重量％含み、残部がＳｉＯ2 である
組成の結晶化シートガラス粉末（平均粒径２．２μｍ、
軟化点Ｔi ７１５℃）とアルミナ粉末（平均粒径１．１
μｍ、昭和電工社製、製品名ＡＬ−４５−１）とを重量
比５０／５０で混合し、得られたガラスセラミック粉末
１００重量部にポリビニルブチラール９重量部、フタル
酸ジイソブチル７重量部、オレイン酸１重量部、エタノ
ール６０重量部を加えてボールミルで２４時間混合しス
ラリーとした。スラリーは脱泡処理した後ドクターブレ
ード法にて厚さ２２０μｍのグリーンシートを作成し
た。導体組成物は、銀粉（平均粒径２．６μｍ）９０重
量部と表１に示す軟化点Ｔc を有する添加ガラス粉末
（平均粒径５μｍ、１０μｍ以下の粒子含有量９０重量
％）を１０重量部の割合で混合した固形分１００重量部
をエチルセルロース１２重量部、ポリビニルブチラール
２重量部、タピネオール８６重量部からなるビヒクル２
０重量部と混練して作成した。[Examples 1 to 5 and Comparative Examples 1 to 9] ZnO 30.7 wt%, Al 2 O 3 8.4 wt%, B 2 O 3 7.3 wt% and CaO 1.9 wt%. Crystallized sheet glass powder having a composition containing SiO 2 and the balance being SiO 2 (average particle size: 2.2 μm,
Softening point T i 715 ° C.) and alumina powder (average particle size 1.1
μm, manufactured by Showa Denko KK, product name AL-45-1) in a weight ratio of 50/50, and mixed with 100 parts by weight of the obtained glass ceramic powder, 9 parts by weight of polyvinyl butyral, 7 parts by weight of diisobutyl phthalate, and olein. 1 part by weight of acid and 60 parts by weight of ethanol were added and mixed in a ball mill for 24 hours to obtain a slurry. After defoaming the slurry, a 220 μm thick green sheet was prepared by the doctor blade method. The conductor composition was composed of 90 parts by weight of silver powder (average particle diameter 2.6 μm) and 10 parts by weight of added glass powder having a softening point T c shown in Table 1 (average particle diameter 5 μm, content of particles having particle size of 10 μm or less 90% by weight). Vehicle 2 comprising 12 parts by weight of ethyl cellulose, 2 parts by weight of polyvinyl butyral, and 86 parts by weight of tapineol mixed with 100 parts by weight of solid content mixed in a ratio of 1 part by weight.
It was prepared by kneading with 0 part by weight.
【００１０】ガラスセラミック多層回路基板は、上記グ
リーンシート上に上記導体組成物で配線パターンを印刷
しこれを積層して５層とし、１００ｋｇ／ｃｍ2 、９０
℃の条件で加圧成形することにより作成した。この成形
体を８７５℃で焼成した。このようにして作製した基板
の変形量、面積抵抗値、焼結開始温度を測定した。また
基板内部にデラミ等の不具合がないかを観察によって確
認した。変形量は、大きさ２ｃｍ角の配線パターン部を
表面粗さ計で測定し、変形量の許容範囲は、表面部品の
実装等から１０μｍ以下とした。また、面積抵抗値は５
ｍΩ／□以下を合格とした。試験結果を表１にまとめて
示す。なお、デラミ等の観察の結果、比較例８において
デラミが観察された以外は、いずれも良好であった。The glass-ceramic multilayer circuit board is printed with a wiring pattern on the green sheet with the conductor composition, and the wiring pattern is laminated to form 5 layers, which are 100 kg / cm 2 , 90.
It was prepared by pressure molding under the condition of ° C. The compact was fired at 875 ° C. The deformation amount, the sheet resistance value, and the sintering start temperature of the substrate thus manufactured were measured. Moreover, it was confirmed by observation whether there was any defect such as delamination inside the substrate. The amount of deformation was measured with a surface roughness meter on a wiring pattern portion having a size of 2 cm square, and the allowable range of the amount of deformation was set to 10 μm or less from the mounting of surface parts. The sheet resistance value is 5
A value of mΩ / □ or less was determined to be acceptable. The test results are summarized in Table 1. As a result of the observation of delamination and the like, all were good except that delamination was observed in Comparative Example 8.
【００１１】[0011]
【表１】 [Table 1]
【００１２】［実施例６〜９、比較例１０、１１］使用
する銀粉の平均粒径を表２に示すようにした以外は、実
施例１と同様に試験した。結果を表２に示す。なお、デ
ラミ等の観察の結果、いずれの実施例および比較例にお
いても、良好であった。[Examples 6 to 9 and Comparative Examples 10 and 11] The same tests as in Example 1 were carried out except that the average particle size of the silver powder used was as shown in Table 2. Table 2 shows the results. In addition, as a result of observation of delamination and the like, it was good in all Examples and Comparative Examples.
【００１３】[0013]
【表２】 [Table 2]
【００１４】［実施例１０〜１１、比較例１２〜１５］
使用する銀粉と添加ガラス粉末との混合割合を表３に示
すようにした以外は、実施例１と同様に試験した。結果
を表３に示す。なお、デラミ等の観察の結果、いずれの
実施例および比較例においても、良好であった。[Examples 10 to 11, Comparative Examples 12 to 15]
The test was performed in the same manner as in Example 1 except that the mixing ratio of the silver powder and the added glass powder used was as shown in Table 3. The results are shown in Table 3. In addition, as a result of observation of delamination and the like, it was good in all Examples and Comparative Examples.
【００１５】[0015]
【表３】 [Table 3]
【００１６】表１から、添加ガラス粉末の軟化点Ｔc を
６８９〜７４３℃にする、すなわちシートガラス粉末の
軟化点Ｔi である７１５℃より２６℃の範囲以内とする
ことによって同時焼成する際にガラスセラミック粉末と
銀粉の焼結挙動の違いから生じる変形を少なくする効果
が十分得られることが分かる。ただし、結晶化ガラス粉
末を銀粉に添加した場合はこの効果が不十分である。ま
た、表２および表３から、この効果を十分得るために
は、銀粉の平均粒径や添加ガラス粉末の銀粉への添加割
合に適切な範囲が存在することが分かる。From Table 1, when co-firing is performed by setting the softening point T c of the added glass powder to 689 to 743 ° C., that is, within the range of 26 ° C. from 715 ° C. which is the softening point T i of the sheet glass powder. It can be seen that the effect of reducing the deformation caused by the difference in the sintering behavior of the glass ceramic powder and the silver powder can be sufficiently obtained. However, this effect is insufficient when the crystallized glass powder is added to the silver powder. Further, from Tables 2 and 3, it is understood that in order to sufficiently obtain this effect, the average particle diameter of the silver powder and the addition ratio of the added glass powder to the silver powder have appropriate ranges.
【００１７】[0017]
【発明の効果】本発明によれば、ガラスセラミックグリ
ーンシートと回路配線とを同時焼成した際に変形やデラ
ミ等の不具合のない高品質のガラスセラミック多層回路
基板を安価に提供することができる。According to the present invention, it is possible to inexpensively provide a high-quality glass-ceramic multilayer circuit board which is free from defects such as deformation and delamination when the glass-ceramic green sheet and circuit wiring are co-fired.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０４Ｂ 35/64 Ｃ２２Ｃ 32/00 Ａ Ｈ０５Ｋ 1/09 Ｃ 7726−4Ｅ 3/12 Ｂ 7511−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI Technical display location C04B 35/64 C22C 32/00 A H05K 1/09 C 7726-4E 3/12 B 7511-4E
Claims (3)
ラスセラミックグリーンシートと回路配線とを同時焼成
して得られる多層回路基板において、 軟化点をＴc ℃として、Ｔi −３０≦Ｔc ≦Ｔi ＋３０
を満足する非晶質ガラス粉末を１０〜２０重量％含み、
残部が銀粉である組成物から、該回路配線がなることを
特徴とするガラスセラミック多層回路基板。1. A multilayer circuit board obtained by co-firing a glass ceramic green sheet using glass powder having a softening point of T i ℃ and circuit wiring, wherein T i -30 ≦, where T c ℃ is the softening point. T c ≤T i +30
Containing 10 to 20% by weight of amorphous glass powder satisfying
A glass-ceramic multilayer circuit board, wherein the circuit wiring is made of a composition in which the balance is silver powder.
求項１に記載のガラスセラミック多層回路基板。2. The glass-ceramic multilayer circuit board according to claim 1, wherein the silver powder has an average particle size of 2 to 5 μm.
下の粒子を８０重量％以上含む請求項１または２に記載
のガラスセラミック多層回路基板。3. The glass-ceramic multilayer circuit board according to claim 1, wherein the amorphous glass powder contains 80% by weight or more of particles having a particle diameter of 10 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6323995A JPH08162762A (en) | 1994-12-02 | 1994-12-02 | Glass ceramic multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6323995A JPH08162762A (en) | 1994-12-02 | 1994-12-02 | Glass ceramic multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08162762A true JPH08162762A (en) | 1996-06-21 |
Family
ID=18160955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6323995A Pending JPH08162762A (en) | 1994-12-02 | 1994-12-02 | Glass ceramic multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08162762A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100497824B1 (en) * | 2002-07-19 | 2005-07-01 | 상 추엔 웨이팅 머신 컴패니 리미티드 | Manufacturing method for tempered glass circuit board |
| EP1265464A3 (en) * | 2001-06-08 | 2005-09-07 | Hitachi, Ltd. | Electronic component and method of manufacturing the same |
| JPWO2013088957A1 (en) * | 2011-12-16 | 2015-04-27 | エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ | Multi-layer glass ceramic substrate with built-in resistor |
| WO2016006513A1 (en) * | 2014-07-09 | 2016-01-14 | 東洋紡株式会社 | Electro-conductive paste |
-
1994
- 1994-12-02 JP JP6323995A patent/JPH08162762A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1265464A3 (en) * | 2001-06-08 | 2005-09-07 | Hitachi, Ltd. | Electronic component and method of manufacturing the same |
| KR100497824B1 (en) * | 2002-07-19 | 2005-07-01 | 상 추엔 웨이팅 머신 컴패니 리미티드 | Manufacturing method for tempered glass circuit board |
| JPWO2013088957A1 (en) * | 2011-12-16 | 2015-04-27 | エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ | Multi-layer glass ceramic substrate with built-in resistor |
| US9648743B2 (en) | 2011-12-16 | 2017-05-09 | Snaptrack, Inc. | Multilayer glass ceramic substrate with embedded resistor |
| WO2016006513A1 (en) * | 2014-07-09 | 2016-01-14 | 東洋紡株式会社 | Electro-conductive paste |
| JP6079888B2 (en) * | 2014-07-09 | 2017-02-15 | 東洋紡株式会社 | Conductive paste |
| CN106575538A (en) * | 2014-07-09 | 2017-04-19 | 东洋纺株式会社 | Electro-conductive paste |
| JPWO2016006513A1 (en) * | 2014-07-09 | 2017-04-27 | 東洋紡株式会社 | Conductive paste |
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