JPH08161931A - Conductive paste, and conductive body and multilayer ceramic board using it - Google Patents
Conductive paste, and conductive body and multilayer ceramic board using itInfo
- Publication number
- JPH08161931A JPH08161931A JP6299757A JP29975794A JPH08161931A JP H08161931 A JPH08161931 A JP H08161931A JP 6299757 A JP6299757 A JP 6299757A JP 29975794 A JP29975794 A JP 29975794A JP H08161931 A JPH08161931 A JP H08161931A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive
- conductor
- conductive paste
- multilayer ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、多層セラミック基板の
導電性材料として有用な導電ペースト、それを用いた導
電体および多層セラミック基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste useful as a conductive material for a multilayer ceramic substrate, a conductor using the same, and a multilayer ceramic substrate.
【０００２】[0002]
【従来の技術】電子機器の小型化にともない、電子回路
を構成する各種電子部品を実装するためにセラミック基
板が汎用されている。最近では、実装密度をさらに高め
るために、その表面に導電性材料を含むペーストで回路
パターンを形成したセラミックグリーンシートを複数枚
積層し、この積層物を焼成して一体化した多層セラミッ
ク基板が実用化されている。そして、この多層のセラミ
ック基板間の電気的接続は、一般的には、以下に示す方
式でバイアホールを形成して行なっている。2. Description of the Related Art With the miniaturization of electronic devices, ceramic substrates have been widely used for mounting various electronic components constituting electronic circuits. Recently, in order to further increase the packaging density, a multilayer ceramic substrate has been put into practical use by stacking multiple ceramic green sheets on the surface of which circuit patterns are formed with a paste containing a conductive material Has been converted. The electrical connection between the multi-layered ceramic substrates is generally performed by forming via holes by the method described below.
【０００３】即ち、まずセラミックグリーンシートにド
リルまたはパンチでバイアホールをあけ、その中に導電
ペーストを充填させる。さらに、グリーンシート表面に
スクリーン印刷などにより導電ペーストで回路を形成す
る。その後、このグリーンシートを複数枚積層し圧着さ
せ、適当な基板サイズにカットして焼成する。このと
き、グリーンシート上およびバイアホール内の導電ペー
ストもグリーンシートと同時に焼結させて、多層セラミ
ック基板内の回路導通を図っている。That is, first, a via hole is made in a ceramic green sheet with a drill or a punch, and a conductive paste is filled therein. Further, a circuit is formed on the surface of the green sheet with a conductive paste by screen printing or the like. After that, a plurality of these green sheets are laminated, pressure-bonded, cut into an appropriate substrate size, and fired. At this time, the conductive paste on the green sheet and in the via hole is also sintered at the same time as the green sheet to achieve circuit conduction in the multilayer ceramic substrate.
【０００４】そして、この導電ペースト中の導電性粉末
としては、比抵抗が小さくマイグレーションが起こりに
くく、しかも安価なＣｕがよく用いられ、そのＣｕ粉末
をエチルセルロース樹脂などを樹脂分とする有機ビヒク
ル中に混合分散させたペーストが用いられている。As the conductive powder in this conductive paste, Cu is often used because it has a small specific resistance, does not easily migrate, and is inexpensive, and the Cu powder is used in an organic vehicle containing ethyl cellulose resin as a resin component. A mixed and dispersed paste is used.
【０００５】[0005]
【発明が解決しようとする課題】上記したように、多層
セラミック基板の製造においては、セラミックグリーン
シートとＣｕペーストとが同時に焼成される。ところ
が、この焼成時のセラミックグリーンシートとＣｕペー
ストとの焼成収縮挙動に差がある。即ち、Ｃｕの焼結に
よる収縮がセラミックのそれよりも低温で先に起こる。
このため、焼結後に、多層セラミック層と層間導体との
間にデラミネーションが発生したり、バイアホール内部
にクラックが発生したりして、多層セラミック基板の信
頼性を低下させるという問題点を有していた。As described above, in manufacturing a multilayer ceramic substrate, the ceramic green sheet and the Cu paste are simultaneously fired. However, there is a difference in firing shrinkage behavior between the ceramic green sheet and the Cu paste during firing. That is, shrinkage due to sintering of Cu occurs first at a lower temperature than that of ceramics.
Therefore, after sintering, there is a problem that delamination occurs between the multilayer ceramic layer and the inter-layer conductor or cracks occur inside the via hole, which reduces the reliability of the multilayer ceramic substrate. Was.
【０００６】そこで、本発明の目的は、多層セラミック
基板の導電性材料として用いたとき、多層セラミック基
板のデラミネーションやクラックの発生を防止すること
ができる導電ペースト、それを用いた導電体および多層
セラミック基板を提供することにある。Therefore, an object of the present invention is to provide a conductive paste which, when used as a conductive material for a multilayer ceramic substrate, can prevent the occurrence of delamination and cracks in the multilayer ceramic substrate, a conductor using the same, and a multilayer structure. It is to provide a ceramic substrate.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、本発明の導電ペーストは、導電性粉末と有機ビヒク
ルとからなり、前記導電性粉末として、Ｃｕを９９．５
〜９０ｗｔ％、Ｎｉを０．５〜１０ｗｔ％含むことを特
徴とする。In order to achieve the above object, the conductive paste of the present invention comprises a conductive powder and an organic vehicle, and Cu is 99.5 as the conductive powder.
.About.90 wt%, and 0.5 to 10 wt% Ni.
【０００８】また、導電性粉末と有機ビヒクルとからな
り、前記導電性粉末として、Ｃｕを９９．５〜９５ｗｔ
％、Ｐｄを０．５〜５ｗｔ％含むことを特徴とする。Further, it is composed of a conductive powder and an organic vehicle, and 99.5 to 95 wt% of Cu is used as the conductive powder.
%, Pd is contained in an amount of 0.5 to 5 wt%.
【０００９】また、導電性粉末と有機ビヒクルとからな
り、前記導電性粉末として、Ｃｕを９９．５〜８０ｗｔ
％、Ｗを０．５〜２０ｗｔ％含むことを特徴とする。Further, the conductive powder and the organic vehicle are used, and 99.5 to 80 wt% of Cu is used as the conductive powder.
%, W is contained in an amount of 0.5 to 20 wt%.
【００１０】また、導電性粉末と有機ビヒクルとからな
り、前記導電性粉末として、Ｃｕを９９．５〜８０ｗｔ
％、Ｍｏを０．５〜２０ｗｔ％含むことを特徴とする。Further, it is composed of a conductive powder and an organic vehicle, and 99.5 to 80 wt% of Cu is used as the conductive powder.
%, Mo is contained in an amount of 0.5 to 20 wt%.
【００１１】そして、本発明の導電ペースト中の導電性
粉末それぞれの平均粒径は０．５〜５μｍが好ましい。The average particle size of each conductive powder in the conductive paste of the present invention is preferably 0.5 to 5 μm.
【００１２】さらに、上記目的を達成するため、本発明
の導電体は、Ｃｕ粉末が９９．５〜９０ｗｔ％、Ｎｉ粉
末が０．５〜１０ｗｔ％の混合焼付け膜からなることを
特徴とする。Further, in order to achieve the above object, the conductor of the present invention is characterized by comprising a mixed baking film containing 99.5 to 90 wt% of Cu powder and 0.5 to 10 wt% of Ni powder.
【００１３】また、Ｃｕ粉末が９９．５〜９５ｗｔ％、
Ｐｄ粉末が０．５〜５ｗｔ％の混合焼付け膜からなるこ
とを特徴とする。Further, Cu powder is 99.5 to 95 wt%,
The Pd powder is composed of a mixed baking film of 0.5 to 5 wt%.
【００１４】また、Ｃｕ粉末が９９．５〜８０ｗｔ％、
Ｗ粉末が０．５〜２０ｗｔ％の混合焼付け膜からなるこ
とを特徴とする。Further, Cu powder is 99.5-80 wt%,
The W powder is composed of a mixed baking film of 0.5 to 20 wt%.
【００１５】また、Ｃｕ粉末が９９．５〜８０ｗｔ％、
Ｍｏ粉末が０．５〜２０ｗｔ％の混合焼付け膜からなる
ことを特徴とする。Further, the Cu powder is 99.5-80 wt%,
The Mo powder is composed of a mixed baking film of 0.5 to 20 wt%.
【００１６】さらに、上記目的を達成するため、本発明
の多層セラミック基板は、Ｃｕ粉末が９９．５〜９０ｗ
ｔ％、Ｎｉ粉末が０．５〜１０ｗｔ％の混合焼付け膜か
らなる導電体が導体回路に用いられていることを特徴と
する。Further, in order to achieve the above object, the multilayer ceramic substrate of the present invention contains Cu powder at 99.5 to 90 w.
It is characterized in that a conductor made of a mixed baking film of t% and Ni powder of 0.5 to 10 wt% is used in a conductor circuit.
【００１７】また、Ｃｕ粉末が９９．５〜９５ｗｔ％、
Ｐｄ粉末が０．５〜５ｗｔ％の混合焼付け膜からなる導
電体が導体回路に用いられていることを特徴とする。Further, Cu powder is 99.5 to 95 wt%,
It is characterized in that a conductor made of a mixed baking film containing 0.5 to 5 wt% of Pd powder is used in a conductor circuit.
【００１８】また、Ｃｕ粉末が９９．５〜８０ｗｔ％、
Ｗ粉末が０．５〜２０ｗｔ％の混合焼付け膜からなる導
電体が導体回路に用いられていることを特徴とする。Further, Cu powder is 99.5-80 wt%,
It is characterized in that a conductor made of a mixed baking film containing 0.5 to 20 wt% of W powder is used in a conductor circuit.
【００１９】また、Ｃｕ粉末が９９．５〜８０ｗｔ％、
Ｍｏ粉末が０．５〜２０ｗｔ％の混合焼付け膜からなる
導電体が導体回路に用いられていることを特徴とする。Further, Cu powder is 99.5-80 wt%,
It is characterized in that a conductor made of a mixed baking film containing 0.5 to 20 wt% of Mo powder is used in a conductor circuit.
【００２０】[0020]
【作用】本発明の導電性粉末を有する導電ペーストを用
いれば、Ｃｕに添加された高融点金属であるＮｉ、Ｐ
ｄ、ＷまたはＭｏによってＣｕの焼結が妨げられ、Ｃｕ
の焼成収縮開始温度が高温側にずれる。このため、Ｃｕ
の焼成収縮挙動がセラミックグリーンシートのそれに近
づく。When the conductive paste containing the conductive powder of the present invention is used, Ni and P, which are refractory metals added to Cu, are used.
Sintering of Cu is hindered by d, W or Mo.
The firing shrinkage starting temperature of is shifted to the high temperature side. Therefore, Cu
The firing shrinkage behavior of is close to that of the ceramic green sheet.
【００２１】さらに、導電性粉末の粒径を本発明の範囲
内とすることによって、スクリーン印刷に最適の導電ペ
ーストとなる。Further, by setting the particle size of the conductive powder within the range of the present invention, it becomes a conductive paste most suitable for screen printing.
【００２２】[0022]
【実施例】以下、本発明の導電ペーストおよびそれを用
いた多層セラミック基板について、その実施例を説明す
る。まず、セラミック材料としてＢａＯ−Ａｌ2 Ｏ3 −
ＳｉＯ2 系からなるガラス複合材料を準備し、その粉末
にポリビニールブチラールなどの有機バインダおよびト
ルエンなどの有機溶剤を加え混練してスラリーを得た。
得られたスラリーをドクターブレード法によりシート状
に成形して、セラミックグリーンシートを作製した。こ
のセラミックグリーンシートにバイアホールをパンチで
あけた。EXAMPLES Examples of the conductive paste of the present invention and a multilayer ceramic substrate using the same will be described below. First, BaO-Al 2 O 3 as the ceramic material -
An SiO 2 glass composite material was prepared, and an organic binder such as polyvinyl butyral and an organic solvent such as toluene were added to the powder and kneaded to obtain a slurry.
The obtained slurry was formed into a sheet by the doctor blade method to prepare a ceramic green sheet. Via holes were punched in this ceramic green sheet.
【００２３】一方、導電ペーストを以下の通り作製し
た。即ち、導電性粉末として、平均粒径０．５μｍ、１
μｍ、３μｍおよび５μｍのＣｕ粉末と、平均粒径０．
５μｍ、１μｍ、５μｍのＮｉ粉末、Ｐｄ粉末、Ｗ粉末
およびＭｏ粉末を準備した。次に、これら導電性粉末
に、エチルセルロース系樹脂およびアルキッド樹脂から
なる有機バインダとテルピネオール系などの溶剤からな
る有機ビヒクルを添加し、三本ロールで混練して表１に
示す導電性粉末を有する導電ペーストを得た。なお、こ
の場合、導電性粉末（Ｃｕ、Ｎｉ、Ｐｄ、ＷおよびＭ
ｏ）１００重量部に対して、有機ビヒクル１０〜１００
重量部を添加した。On the other hand, a conductive paste was prepared as follows. That is, as the conductive powder, the average particle size is 0.5 μm, 1
Cu powder of 3 μm, 3 μm and 5 μm, and an average particle size of 0.
5 μm, 1 μm and 5 μm Ni powder, Pd powder, W powder and Mo powder were prepared. Next, to these conductive powders, an organic binder composed of an ethyl cellulose resin and an alkyd resin and an organic vehicle composed of a solvent such as a terpineol system are added, and the mixture is kneaded with a three-roll to prepare the conductive powder having the conductive powder shown in Table 1. I got a paste. In this case, the conductive powder (Cu, Ni, Pd, W and M
o) 10 to 100 parts by weight of organic vehicle
Parts by weight were added.
【００２４】次に、セラミックグリーンシート中のバイ
アホールにこの導電ペーストを充填し乾燥させた後、同
じペーストを用いてセラミックグリーンシート上にスク
リーン印刷により回路を形成した。そして、これらセラ
ミックグリーンシートを複数枚積層して圧着した後、所
定寸法に切断した。その後、Ｎ2 雰囲気中、９００〜１
０００℃で１〜２時間焼成して多層セラミック基板を得
た。Next, after filling this via paste in the ceramic green sheet with this conductive paste and drying it, a circuit was formed by screen printing on the ceramic green sheet using the same paste. Then, a plurality of these ceramic green sheets were laminated, pressure-bonded, and then cut into a predetermined size. Then, in N 2 atmosphere, 900-1
A multilayer ceramic substrate was obtained by firing at 000 ° C for 1 to 2 hours.
【００２５】得られた多層セラミック基板の切断面を光
学顕微鏡により観察し、層間導体部分のデラミネーショ
ンの有無、およびバイアホール部分のクラックの有無を
調べた。その結果を表１に示す。なお、表１において、
バイアホールの確認結果で「（基板割れ）」とは、バイ
アホール内の導電体の膨脹により、セラミック基板側に
割れが発生していたものである。また、表１において、
＊印を付したものは本発明の範囲外のものであり、その
他は、本発明の範囲内のものである。The cross section of the obtained multilayer ceramic substrate was observed with an optical microscope to examine the presence or absence of delamination in the interlayer conductor portion and the presence or absence of cracks in the via hole portion. Table 1 shows the results. In addition, in Table 1,
“(Substrate crack)” in the confirmation result of the via hole means that the ceramic substrate side is cracked due to the expansion of the conductor in the via hole. In addition, in Table 1,
Those marked with * are outside the scope of the present invention, and others are within the scope of the present invention.
【００２６】[0026]
【表１】 [Table 1]
【００２７】表１より明らかな通り、Ｃｕ粉末を９９．
５〜９０ｗｔ％、Ｎｉ粉末を０．５〜１０ｗｔ％含む導
電ペーストをセラミック多層基板の導電性材料として用
いることにより、試料番号４〜７に示すように、層間導
体部分にデラミネーションやバイアホール部分にクラッ
クのないセラミック多層基板が得られた。なお、Ｃｕ粉
末の含有量が９０ｗｔ％未満、即ちＮｉ粉末含有量が１
０ｗｔ％を超える場合には、試料番号８に示すように、
バイアホール内の導電体の膨脹によりセラミック基板側
に割れが発生した。As is clear from Table 1, Cu powder was added to 99.
By using a conductive paste containing 5 to 90 wt% and Ni powder of 0.5 to 10 wt% as the conductive material of the ceramic multilayer substrate, as shown in sample numbers 4 to 7, delamination and via hole portions are formed in the interlayer conductor portions. A ceramic multilayer substrate without cracks was obtained. The Cu powder content is less than 90 wt%, that is, the Ni powder content is 1
When it exceeds 0 wt%, as shown in sample number 8,
The expansion of the conductor in the via hole caused cracks on the ceramic substrate side.
【００２８】また、Ｃｕ粉末を９９．５〜９５ｗｔ％、
Ｐｄ粉末を０．５〜５ｗｔ％含む導電ペーストをセラミ
ック多層基板の導電性材料として用いることにより、試
料番号９、１０に示すように、層間導体部分にデラミネ
ーションやバイアホール部分にクラックのないセラミッ
ク多層基板が得られた。なお、Ｃｕ粉末の含有量が９５
ｗｔ％未満、即ちＰｄ粉末含有量が５ｗｔ％を超える場
合には、試料番号１１に示すように、バイアホール内の
導電体の膨脹によりセラミック基板側に割れが発生し
た。In addition, 99.5-95 wt% of Cu powder,
By using a conductive paste containing Pd powder in an amount of 0.5 to 5 wt% as a conductive material for the ceramic multi-layer substrate, as shown in Sample Nos. 9 and 10, a ceramic having no delamination in the interlayer conductor portion or cracks in the via hole portion A multilayer substrate was obtained. The content of Cu powder is 95
When the content of Pd powder was less than 5% by weight, that is, when the content of Pd powder was more than 5% by weight, cracking occurred on the ceramic substrate side due to expansion of the conductor in the via hole, as shown in Sample No. 11.
【００２９】また、Ｃｕ粉末を９９．５〜８０ｗｔ％、
Ｗ粉末を０．５〜２０ｗｔ％含む導電ペーストをセラミ
ック多層基板の導電性材料として用いることにより、試
料番号１２〜１４に示すように、層間導体部分にデラミ
ネーションやバイアホール部分にクラックのないセラミ
ック多層基板が得られた。なお、Ｃｕ粉末の含有量が８
０ｗｔ％未満、即ちＷ粉末含有量が２０ｗｔ％を超える
場合には、試料番号１５に示すように、バイアホール内
の導電体の膨脹によりセラミック基板側に割れが発生し
た。In addition, 99.5-80 wt% of Cu powder,
By using a conductive paste containing 0.5 to 20 wt% of W powder as the conductive material of the ceramic multilayer substrate, as shown in sample numbers 12 to 14, ceramics without delamination in the interlayer conductor portion and cracks in the via hole portion A multilayer substrate was obtained. The content of Cu powder is 8
When the content of W powder was less than 0 wt%, that is, when the content of W powder exceeded 20 wt%, cracks occurred on the ceramic substrate side due to the expansion of the conductor in the via hole, as shown in Sample No. 15.
【００３０】また、Ｃｕ粉末を９９．５〜８０ｗｔ％、
Ｍｏ粉末を０．５〜２０ｗｔ％含む導電ペーストをセラ
ミック多層基板の導電性材料として用いることにより、
試料番号１６〜１８に示すように、層間導体部分にデラ
ミネーションやバイアホール部分にクラックのないセラ
ミック多層基板が得られた。なお、Ｃｕ粉末の含有量が
８０ｗｔ％未満、即ちＭｏ粉末含有量が２０ｗｔ％を超
える場合には、試料番号１９に示すように、バイアホー
ル内の導電体の膨脹によりセラミック基板側に割れが発
生した。Further, Cu powder is 99.5-80 wt%,
By using a conductive paste containing 0.5 to 20 wt% of Mo powder as the conductive material of the ceramic multilayer substrate,
As shown in Sample Nos. 16 to 18, ceramic multilayer substrates without delamination in the interlayer conductor portion and cracks in the via hole portion were obtained. When the content of Cu powder is less than 80 wt%, that is, the content of Mo powder exceeds 20 wt%, cracks occur on the ceramic substrate side due to expansion of the conductor in the via hole, as shown in sample number 19. did.
【００３１】一方、Ｃｕ粉末の含有量が９９．５ｗｔ％
を超える、即ちＮｉ，Ｐｄ，ＷまたはＭｏ粉末の含有量
が０．５ｗｔ％未満の場合には、これら高融点金属粉末
の添加により焼結を妨げて、Ｃｕ粉末の焼成収縮開始温
度を高温側にずらす効果がほとんど得られない。On the other hand, the content of Cu powder is 99.5 wt%.
When the content of Ni, Pd, W or Mo powder is less than 0.5 wt%, addition of these refractory metal powders hinders the sintering, and the firing shrinkage start temperature of the Cu powder is set to the high temperature side. Almost no shifting effect is obtained.
【００３２】さらに、導電ペースト中の導電性粉末の平
均粒径を、０．５〜５μｍとすることにより、スクリー
ン印刷用として最適な導電ペーストを得ることができ
る。即ち、導電性粉末の平均粒径が０．５μｍ未満の場
合には、導電ペーストのチクソトロピック性が増大し流
動性が低下して、バイアホール内への導電ペーストの充
填性がよくない。一方、導電性粉末の平均粒径が５μｍ
を超える場合は、導電性成分のミクロ的な分散が悪く、
焼結時の反応が不均一となる。Further, by setting the average particle size of the conductive powder in the conductive paste to 0.5 to 5 μm, the conductive paste most suitable for screen printing can be obtained. That is, when the average particle diameter of the conductive powder is less than 0.5 μm, the thixotropic property of the conductive paste increases and the fluidity decreases, and the filling property of the conductive paste into the via hole is not good. On the other hand, the average particle size of the conductive powder is 5 μm
If it exceeds, the microscopic dispersion of the conductive component is poor,
The reaction during sintering becomes non-uniform.
【００３３】なお、上記実施例においては、導電ペース
トの有機ビヒクルとして、エチルセルロース系樹脂およ
びアルキッド樹脂からなる有機バインダとテルピネオー
ル系などの溶剤からなるものを用いているが、本発明は
これのみに限定されるものではない。即ち、通常厚膜ペ
ーストに用いられている有機ビヒクルの中から、セラミ
ックグリーンシートのバインダとの組み合わせで選定し
て用いることができる。In the above embodiments, the organic vehicle of the conductive paste is an organic binder composed of ethyl cellulose resin and alkyd resin and a solvent such as terpineol, but the present invention is not limited to this. It is not something that will be done. That is, it can be selected and used from the organic vehicles usually used for thick film paste in combination with the binder of the ceramic green sheet.
【００３４】また、上記実施例には示していないが、導
電ペーストに、公知の硼珪酸鉛系、硼珪酸亜鉛系などの
ガラスフリットを添加することにより、導電体とセラミ
ックとの密着性を向上させることができる。Although not shown in the above embodiment, the adhesion of the conductor to the ceramic is improved by adding a known glass frit such as lead borosilicate or zinc borosilicate to the conductive paste. Can be made.
【００３５】[0035]
【発明の効果】以上の説明で明らかなように、本発明の
導電性粉末を有する導電ペーストは、Ｃｕペーストに高
融点金属であるＮｉ、Ｐｄ、ＷまたはＭｏを添加して、
Ｃｕの焼結開始温度を高温側にずらしたものである。こ
のため、この導電ペーストを多層セラミック基板の導電
性材料として用いることにより、Ｃｕの焼成収縮挙動を
セラミックグリーンシートの焼成収縮挙動に近づけるこ
とができる。したがって、焼結時の焼成収縮挙動の違い
によるクラックやデラミネーションの発生を防止するこ
とができる。As is clear from the above description, the conductive paste having the conductive powder of the present invention is obtained by adding the refractory metal Ni, Pd, W or Mo to the Cu paste,
The sintering start temperature of Cu is shifted to the high temperature side. Therefore, by using this conductive paste as the conductive material of the multilayer ceramic substrate, the firing shrinkage behavior of Cu can be brought close to the firing shrinkage behavior of the ceramic green sheet. Therefore, it is possible to prevent the occurrence of cracks and delamination due to the difference in firing shrinkage behavior during sintering.
【００３６】また、導電性成分の粒径を本発明の範囲内
とすることによって、スクリーン印刷に最適な導電ペー
ストを得ることができる。By setting the particle diameter of the conductive component within the range of the present invention, a conductive paste most suitable for screen printing can be obtained.
【００３７】また、本発明の導電ペーストを焼付けた導
電体は、クラックのないバイアホールおよびデラミネー
ションのない層間導電体、並びにそれらを有する多層セ
ラミック基板を得ることができる。Further, the conductor obtained by baking the conductive paste of the present invention makes it possible to obtain a via hole having no cracks and an interlayer conductor having no delamination, and a multilayer ceramic substrate having them.
【００３８】さらに、本発明によれば、個々の金属粉末
と有機ビヒクルとを混合したものであり、予め合金化し
た金属粉末を用いることがないので、容易に安価な導電
ペーストおよび導電体を得ることができる。Further, according to the present invention, the individual metal powder and the organic vehicle are mixed, and the metal powder pre-alloyed is not used. Therefore, an inexpensive conductive paste and conductor can be easily obtained. be able to.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/46 Ｈ 6921−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location H05K 3/46 H 6921-4E
Claims (13)
前記導電性粉末として、Ｃｕを９９．５〜９０ｗｔ％、
Ｎｉを０．５〜１０ｗｔ％含むことを特徴とする導電ペ
ースト。1. A conductive powder and an organic vehicle,
As the conductive powder, Cu is 99.5 to 90 wt%,
A conductive paste containing 0.5 to 10 wt% of Ni.
前記導電性粉末として、Ｃｕを９９．５〜９５ｗｔ％、
Ｐｄを０．５〜５ｗｔ％含むことを特徴とする導電ペー
スト。2. A conductive powder and an organic vehicle,
As the conductive powder, Cu is 99.5 to 95 wt%,
A conductive paste containing 0.5 to 5 wt% of Pd.
前記導電性粉末として、Ｃｕを９９．５〜８０ｗｔ％、
Ｗを０．５〜２０ｗｔ％含むことを特徴とする導電ペー
スト。3. A conductive powder and an organic vehicle,
As the conductive powder, Cu is 99.5 to 80 wt%,
A conductive paste containing 0.5 to 20 wt% of W.
前記導電性粉末として、Ｃｕを９９．５〜８０ｗｔ％、
Ｍｏを０．５〜２０ｗｔ％含むことを特徴とする導電ペ
ースト。4. A conductive powder and an organic vehicle,
As the conductive powder, Cu is 99.5 to 80 wt%,
A conductive paste containing 0.5 to 20 wt% of Mo.
平均粒径が０．５〜５μｍであることを特徴とする請求
項１〜４のうちいずれかに記載の導電ペースト。5. The conductive paste according to claim 1, wherein the conductive powder in the conductive paste has an average particle diameter of 0.5 to 5 μm.
粉末が０．５〜１０ｗｔ％の混合焼付け膜からなること
を特徴とする導電体。6. Cu powder is 99.5 to 90 wt%, Ni
A conductor characterized in that the powder is composed of a mixed baking film of 0.5 to 10 wt%.
粉末が０．５〜５ｗｔ％の混合焼付け膜からなることを
特徴とする導電体。7. Cu powder 99.5-95 wt%, Pd
A conductor characterized in that the powder is composed of a mixed baking film of 0.5 to 5 wt%.
末が０．５〜２０ｗｔ％の混合焼付け膜からなることを
特徴とする導電体。8. A conductor comprising a mixed baked film containing 99.5 to 80 wt% of Cu powder and 0.5 to 20 wt% of W powder.
粉末が０．５〜２０ｗｔ％の混合焼付け膜からなること
を特徴とする導電体。9. A Cu powder is 99.5-80 wt%, and Mo is
A conductor characterized in that the powder is composed of a mixed baking film of 0.5 to 20 wt%.
ｉ粉末が０．５〜１０ｗｔ％の混合焼付け膜からなる導
電体が導体回路に用いられていることを特徴とする多層
セラミック基板。10. Cu powder of 99.5 to 90 wt%, N
A multilayer ceramic substrate, wherein a conductor made of a mixed baking film containing i powder of 0.5 to 10 wt% is used in a conductor circuit.
ｄ粉末が０．５〜５ｗｔ％の混合焼付け膜からなる導電
体が導体回路に用いられていることを特徴とする多層セ
ラミック基板。11. Cu powder is 99.5 to 95 wt%, P
A multilayer ceramic substrate characterized in that a conductor composed of a mixed baking film containing 0.5 to 5 wt% of d powder is used in a conductor circuit.
粉末が０．５〜２０ｗｔ％の混合焼付け膜からなる導電
体が導体回路に用いられていることを特徴とする多層セ
ラミック基板。12. Cu powder 99.5-80 wt%, W
A multi-layer ceramic substrate, wherein a conductor made of a mixed baking film having a powder content of 0.5 to 20 wt% is used in a conductor circuit.
ｏ粉末が０．５〜２０ｗｔ％の混合焼付け膜からなる導
電体が導体回路に用いられていることを特徴とする多層
セラミック基板。13. Cu powder 99.5-80 wt%, M
o A multilayer ceramic substrate characterized in that a conductor made of a mixed baking film containing 0.5 to 20 wt% of powder is used in a conductor circuit.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29975794A JP3467873B2 (en) | 1994-12-02 | 1994-12-02 | Method for manufacturing multilayer ceramic substrate |
| KR1019950046127A KR100227412B1 (en) | 1994-12-02 | 1995-12-01 | Conductive paste |
| US09/377,476 US6086793A (en) | 1994-12-02 | 1999-08-19 | Method of producing electrically conductive pastes and materials using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29975794A JP3467873B2 (en) | 1994-12-02 | 1994-12-02 | Method for manufacturing multilayer ceramic substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08161931A true JPH08161931A (en) | 1996-06-21 |
| JP3467873B2 JP3467873B2 (en) | 2003-11-17 |
Family
ID=17876613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29975794A Expired - Lifetime JP3467873B2 (en) | 1994-12-02 | 1994-12-02 | Method for manufacturing multilayer ceramic substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3467873B2 (en) |
| KR (1) | KR100227412B1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11135900A (en) * | 1997-10-28 | 1999-05-21 | Kyocera Corp | Aluminum nitride wiring board and production thereof |
| JP2000077805A (en) * | 1998-08-31 | 2000-03-14 | Kyocera Corp | Wiring board and manufacture thereof |
| JP2010045212A (en) * | 2008-08-13 | 2010-02-25 | Tdk Corp | Laminated ceramic electronic component and its manufacturing method |
| JP2010045209A (en) * | 2008-08-13 | 2010-02-25 | Tdk Corp | Method of manufacturing laminated ceramic electronic component |
| JP2013045900A (en) * | 2011-08-24 | 2013-03-04 | Kyocera Corp | Wiring board |
| JP2015050133A (en) * | 2013-09-04 | 2015-03-16 | 旭硝子株式会社 | Conductive paste and substrate with conductive film |
| US20180147673A1 (en) * | 2015-09-04 | 2018-05-31 | Heraeus Deutschland GmbH & Co. KG | Metal paste and use thereof for joining components |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3697401B2 (en) * | 2001-02-22 | 2005-09-21 | 株式会社ノリタケカンパニーリミテド | Conductor paste and method for producing the same |
| KR100390638B1 (en) * | 2001-07-09 | 2003-07-07 | 남애전자 주식회사 | Electrically conductive silicone paste |
-
1994
- 1994-12-02 JP JP29975794A patent/JP3467873B2/en not_active Expired - Lifetime
-
1995
- 1995-12-01 KR KR1019950046127A patent/KR100227412B1/en not_active IP Right Cessation
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11135900A (en) * | 1997-10-28 | 1999-05-21 | Kyocera Corp | Aluminum nitride wiring board and production thereof |
| JP2000077805A (en) * | 1998-08-31 | 2000-03-14 | Kyocera Corp | Wiring board and manufacture thereof |
| JP2010045212A (en) * | 2008-08-13 | 2010-02-25 | Tdk Corp | Laminated ceramic electronic component and its manufacturing method |
| JP2010045209A (en) * | 2008-08-13 | 2010-02-25 | Tdk Corp | Method of manufacturing laminated ceramic electronic component |
| JP2013045900A (en) * | 2011-08-24 | 2013-03-04 | Kyocera Corp | Wiring board |
| JP2015050133A (en) * | 2013-09-04 | 2015-03-16 | 旭硝子株式会社 | Conductive paste and substrate with conductive film |
| US20180147673A1 (en) * | 2015-09-04 | 2018-05-31 | Heraeus Deutschland GmbH & Co. KG | Metal paste and use thereof for joining components |
| JP2018526526A (en) * | 2015-09-04 | 2018-09-13 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | Metal paste and its use for joining components |
| US11045910B2 (en) | 2015-09-04 | 2021-06-29 | Heraeus Deutschland GmbH & Co. KG | Metal paste and use thereof for joining components |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3467873B2 (en) | 2003-11-17 |
| KR960025833A (en) | 1996-07-20 |
| KR100227412B1 (en) | 1999-11-01 |
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