JPH0349966U - - Google Patents

Info

Publication number
JPH0349966U
JPH0349966U JP10998889U JP10998889U JPH0349966U JP H0349966 U JPH0349966 U JP H0349966U JP 10998889 U JP10998889 U JP 10998889U JP 10998889 U JP10998889 U JP 10998889U JP H0349966 U JPH0349966 U JP H0349966U
Authority
JP
Japan
Prior art keywords
taping
housing
chip component
case
protruding lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10998889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10998889U priority Critical patent/JPH0349966U/ja
Publication of JPH0349966U publication Critical patent/JPH0349966U/ja
Pending legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は本考案に係る電気部品のテ
ーピング包装体の実施例を示す部分断面図とトツ
プテープを除く平面図、第3図及び第4図は他の
実施例の同様な断面及び平面図、第5図乃至第8
図は従来の異なるチツプ部品のテーピング包装状
態を示す平面及び部分断面図である。 10,20…テーピング包装体、11,21…
テーピング部材、12,22…ケース部、13,
23…チツプ部品、14,24…リード部分、1
6,26…トツプテープ、17,27…段差。
1 and 2 are a partial sectional view and a plan view excluding the top tape showing an embodiment of a taped package for electrical components according to the present invention, and FIGS. 3 and 4 are similar sectional views and a plan view of another embodiment, respectively. Plan view, Figures 5 to 8
The figures are a plan view and a partial sectional view showing different conventional taping packaging states of chip parts. 10, 20... Taping package, 11, 21...
Taping member, 12, 22...Case portion, 13,
23... Chip part, 14, 24... Lead part, 1
6, 26...Top tape, 17, 27...Step.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 突出するリードを有するチツプ部品を収納する
エンボスケース部を有するテーピング部材とケー
ス用カバーのトツプテープから成るテーピング包
装体において、前記ケース部に前記チツプ部品の
突出したリード部を収納する段差部を形成したこ
とを特徴とするテーピング包装体。
In a taping package consisting of a taping member having an embossed case portion for housing a chip component having a protruding lead and a top tape of a case cover, a stepped portion for housing the protruding lead portion of the chip component is formed in the case portion. A taping package characterized by:
JP10998889U 1989-09-19 1989-09-19 Pending JPH0349966U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10998889U JPH0349966U (en) 1989-09-19 1989-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10998889U JPH0349966U (en) 1989-09-19 1989-09-19

Publications (1)

Publication Number Publication Date
JPH0349966U true JPH0349966U (en) 1991-05-15

Family

ID=31658546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10998889U Pending JPH0349966U (en) 1989-09-19 1989-09-19

Country Status (1)

Country Link
JP (1) JPH0349966U (en)

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