JPH0349661B2 - - Google Patents

Info

Publication number
JPH0349661B2
JPH0349661B2 JP59054074A JP5407484A JPH0349661B2 JP H0349661 B2 JPH0349661 B2 JP H0349661B2 JP 59054074 A JP59054074 A JP 59054074A JP 5407484 A JP5407484 A JP 5407484A JP H0349661 B2 JPH0349661 B2 JP H0349661B2
Authority
JP
Japan
Prior art keywords
thin film
electrode
compound thin
compound
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59054074A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60196952A (ja
Inventor
Yasunori Taga
Takeshi Oowaki
Hideya Yamadera
Masayuki Tanemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Central R&D Labs Inc
Original Assignee
Toyota Central R&D Labs Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Central R&D Labs Inc filed Critical Toyota Central R&D Labs Inc
Priority to JP59054074A priority Critical patent/JPS60196952A/ja
Publication of JPS60196952A publication Critical patent/JPS60196952A/ja
Publication of JPH0349661B2 publication Critical patent/JPH0349661B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Wire Bonding (AREA)
  • Hall/Mr Elements (AREA)
JP59054074A 1984-03-19 1984-03-19 Νｉ化合物薄膜用の薄膜電極 Granted JPS60196952A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59054074A JPS60196952A (ja) 1984-03-19 1984-03-19 Νｉ化合物薄膜用の薄膜電極

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59054074A JPS60196952A (ja) 1984-03-19 1984-03-19 Νｉ化合物薄膜用の薄膜電極

Publications (2)

Publication Number Publication Date
JPS60196952A JPS60196952A (ja) 1985-10-05
JPH0349661B2 true JPH0349661B2 (enExample) 1991-07-30

Family

ID=12960469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59054074A Granted JPS60196952A (ja) 1984-03-19 1984-03-19 Νｉ化合物薄膜用の薄膜電極

Country Status (1)

Country Link
JP (1) JPS60196952A (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4980560A (enExample) * 1972-11-30 1974-08-03
AT373188B (de) * 1981-12-30 1983-12-27 Karl Neumayer Ges M B H Loetfaehiger eisendraht

Also Published As

Publication number Publication date
JPS60196952A (ja) 1985-10-05

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