JPH0348267B2 - - Google Patents
Info
- Publication number
- JPH0348267B2 JPH0348267B2 JP59226344A JP22634484A JPH0348267B2 JP H0348267 B2 JPH0348267 B2 JP H0348267B2 JP 59226344 A JP59226344 A JP 59226344A JP 22634484 A JP22634484 A JP 22634484A JP H0348267 B2 JPH0348267 B2 JP H0348267B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- metal
- sputtering
- plate electrode
- cooling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59226344A JPS61104073A (ja) | 1984-10-26 | 1984-10-26 | スパツタリング装置のスパツタガン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59226344A JPS61104073A (ja) | 1984-10-26 | 1984-10-26 | スパツタリング装置のスパツタガン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61104073A JPS61104073A (ja) | 1986-05-22 |
| JPH0348267B2 true JPH0348267B2 (enExample) | 1991-07-23 |
Family
ID=16843695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59226344A Granted JPS61104073A (ja) | 1984-10-26 | 1984-10-26 | スパツタリング装置のスパツタガン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61104073A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2680799B1 (fr) * | 1991-09-03 | 1993-10-29 | Elf Aquitaine Ste Nale | Element de cible pour pulverisation cathodique, procede de preparation dudit element et cibles, notamment de grande surface, realisees a partir de cet element. |
| JP4877156B2 (ja) * | 2007-08-28 | 2012-02-15 | 住友金属鉱山株式会社 | スパッタリングカソード及び成膜方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60135572A (ja) * | 1983-12-26 | 1985-07-18 | Hitachi Ltd | スパツタリング方法 |
-
1984
- 1984-10-26 JP JP59226344A patent/JPS61104073A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61104073A (ja) | 1986-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |