JPS61104073A - スパツタリング装置のスパツタガン - Google Patents

スパツタリング装置のスパツタガン

Info

Publication number
JPS61104073A
JPS61104073A JP59226344A JP22634484A JPS61104073A JP S61104073 A JPS61104073 A JP S61104073A JP 59226344 A JP59226344 A JP 59226344A JP 22634484 A JP22634484 A JP 22634484A JP S61104073 A JPS61104073 A JP S61104073A
Authority
JP
Japan
Prior art keywords
target
sputtering
metal
plate electrode
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59226344A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0348267B2 (enExample
Inventor
Yasuhiko Nakayama
中山　靖彦
Kunyu Sumita
住田　勲勇
Ikuo Sakai
郁夫 坂井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59226344A priority Critical patent/JPS61104073A/ja
Publication of JPS61104073A publication Critical patent/JPS61104073A/ja
Publication of JPH0348267B2 publication Critical patent/JPH0348267B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP59226344A 1984-10-26 1984-10-26 スパツタリング装置のスパツタガン Granted JPS61104073A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59226344A JPS61104073A (ja) 1984-10-26 1984-10-26 スパツタリング装置のスパツタガン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59226344A JPS61104073A (ja) 1984-10-26 1984-10-26 スパツタリング装置のスパツタガン

Publications (2)

Publication Number Publication Date
JPS61104073A true JPS61104073A (ja) 1986-05-22
JPH0348267B2 JPH0348267B2 (enExample) 1991-07-23

Family

ID=16843695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59226344A Granted JPS61104073A (ja) 1984-10-26 1984-10-26 スパツタリング装置のスパツタガン

Country Status (1)

Country Link
JP (1) JPS61104073A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2680799A1 (fr) * 1991-09-03 1993-03-05 Elf Aquitaine Element de cible pour pulverisation cathodique, procede de preparation dudit element et cibles, notamment de grande surface, realisees a partir de cet element.
JP2009052094A (ja) * 2007-08-28 2009-03-12 Sumitomo Metal Mining Co Ltd スパッタリングカソード及び成膜方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60135572A (ja) * 1983-12-26 1985-07-18 Hitachi Ltd スパツタリング方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60135572A (ja) * 1983-12-26 1985-07-18 Hitachi Ltd スパツタリング方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2680799A1 (fr) * 1991-09-03 1993-03-05 Elf Aquitaine Element de cible pour pulverisation cathodique, procede de preparation dudit element et cibles, notamment de grande surface, realisees a partir de cet element.
JP2009052094A (ja) * 2007-08-28 2009-03-12 Sumitomo Metal Mining Co Ltd スパッタリングカソード及び成膜方法

Also Published As

Publication number Publication date
JPH0348267B2 (enExample) 1991-07-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees