JPH0348258U - - Google Patents
Info
- Publication number
- JPH0348258U JPH0348258U JP10823689U JP10823689U JPH0348258U JP H0348258 U JPH0348258 U JP H0348258U JP 10823689 U JP10823689 U JP 10823689U JP 10823689 U JP10823689 U JP 10823689U JP H0348258 U JPH0348258 U JP H0348258U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- pattern
- dividing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000004593 Epoxy Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図は第１図の分割部を分割した状態の要部を拡
大して示す斜視図、第３図はこの考案の他の実施
例を示す斜視図、第４図は従来の斜視図、第５図
は第４図の要部を拡大して示す斜視図である。
１１……基板、１１ａ，１１ｂ……分割基板、
１４……分割部、１４Ａ……スルーホール、１２
ａ……脱落防止パターン。
Fig. 1 is a perspective view showing one embodiment of this invention, Fig. 2 is an enlarged perspective view showing the main part of the divided portion in Fig. 1, and Fig. 3 is another embodiment of this invention. FIG. 4 is a perspective view showing an example, FIG. 4 is a conventional perspective view, and FIG. 5 is a perspective view showing an enlarged main part of FIG. 4. 11... Board, 11a, 11b... Divided board,
14...Divided part, 14A...Through hole, 12
a... Falling prevention pattern.
Claims (1)
材料の絶縁基板に導電性のパターンを固着して形
成したプリント基板と、このプリント基板の所望
箇所に形成した分割部と、この分割部の分割ライ
ン上に形成するとともに前記パターンの一部に一
体形成したスルーホールとを備え、前記分割部を
分割したとき前記スルーホールが前記回路パター
ンから脱落しないようにしてなることを特徴とす
るプリント基板。 (2) 少なくとも前記スルーホールと一体形成し
たパターンは前記プリント基板の両面に固着して
なることを特徴とする請求項(1)記載のプリント
基板。 (3) 分割ライン上に形成されたスルーホール部
が分割後に捨てる基板側に接続された状態で分割
を可能とするため、前記スルーホールと捨て基板
のパターンを接続してなることを特徴とする請求
項(1)記載のプリント基板。[Scope of Claim for Utility Model Registration] (1) A printed circuit board formed by fixing a conductive pattern to an insulating substrate made of a material such as rigid epoxy or glass epoxy, and a divided portion formed at a desired location on this printed circuit board. and a through hole formed on the dividing line of the dividing part and integrally formed with a part of the pattern, so that the through hole does not fall off from the circuit pattern when the dividing part is divided. Characteristic printed circuit board. (2) The printed circuit board according to claim (1), wherein at least the pattern integrally formed with the through hole is fixed to both surfaces of the printed circuit board. (3) In order to enable division with the through-hole portion formed on the dividing line connected to the side of the substrate to be discarded after division, the through-hole is connected to the pattern of the discarded substrate. The printed circuit board according to claim (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10823689U JPH0348258U (en) | 1989-09-14 | 1989-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10823689U JPH0348258U (en) | 1989-09-14 | 1989-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348258U true JPH0348258U (en) | 1991-05-08 |
Family
ID=31656888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10823689U Pending JPH0348258U (en) | 1989-09-14 | 1989-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348258U (en) |
-
1989
- 1989-09-14 JP JP10823689U patent/JPH0348258U/ja active Pending