JPH0344581A - Electronic circuit package - Google Patents

Abstract

PURPOSE:To suffice needs by preparation of only one kind of jig for probe pins by a method wherein a wiring pattern connecting terminals of an electronic circuit element is connected to a probe pin contact element which can be brought into contact with probe pins. CONSTITUTION:A jig 9 for probe pins of an in-circuit tester 8 is so provided that positions of accommodation of probe pins 81 are aligned with positions of testing probe pin contact parts 22 of an electronic circuit package 1. When the electronic circuit package 1 is set on the jig 9 for probe pins, each of the testing probe pins 81 comes into contact with each of the testing probe pin contact parts 22 corresponding thereto and execution of a test from the in-circuit tester 8 is enabled. In this case, only one kind of jig for probe pins wherein the positions of accommodation of the testing probe pins thereof correspond to prescribed regular reference positions in a printed wiring board needs to be prepared.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic circuit package, and particularly to an electronic circuit package suitable for an in-circuit test method.

[Conventional technology]

When testing a conventional electronic circuit package using an in-circuit tester, a plurality of test probe pins of the tester are brought into contact with each terminal of the electronic circuit element in correspondence with each other, and from these test probe pins, Electronic circuit elements and wiring patterns connected to the electronic circuit elements are tested.

[Problem to be solved by the invention]

When testing the conventional electronic circuit package described above using an in-circuit tester, a probe pin jig is used to align the position of each test probe pin with the position of each terminal of the corresponding electronic circuit element. There must be.

However, since the positions of the terminals of electronic circuit elements differ depending on the type of electronic circuit package, it is necessary to prepare probe pin jigs for each type of electronic circuit package.

Furthermore, when electronic circuit elements are mounted on both sides of the printed wiring board, 70-bubin jigs are also required on both sides.

Furthermore, there is a problem in that depending on the terminal spacing and terminal shape of the electronic circuit element, it may be impossible to bring the test probe pin into contact with the electronic circuit element.

An object of the present invention is to provide a probe pin jig for specifying the position of test probe pins, regardless of the type of electronic circuit package, terminal spacing, and terminal shape of electronic circuit elements when using an in-circuit tester. An object of the present invention is to provide an electronic circuit package that requires only one type of electronic circuit package.

[Means to solve the problem]

The electronic circuit package of the present invention includes an electronic circuit element and a printed wiring board having a plurality of wiring patterns connecting terminals of the electronic circuit element. A plurality of test probe pin contact parts that can be contacted with test probe pins of an external testing machine are provided on the reference position, and each of the wiring patterns and each of the test probe pin contact parts are connected in correspondence with each other. .

〔Example〕 Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram showing the implementation of one embodiment of the present invention. In the electronic circuit package 1 of this embodiment, the test probe pin contact portions 22 are linearly provided at regular intervals vertically and horizontally, and each wiring pattern 21 is connected to the corresponding test probe pin contact portion 22 or each connector terminal 23. It includes a printed wiring board 2 connected to each other, and electronic circuit elements 3 to 7 whose terminals are connected to each wiring pattern 21 in correspondence with each other.

FIG. 2 is a schematic cross-sectional view showing the arrangement of a trench for testing the electronic circuit package 1 of this embodiment using the in-circuit tester 8. The probe pin jig 9 of the in-circuit tester 8 adjusts the storage position of the test probe pin 81 to the test probe pin contact portion 2 of the electronic circuit package l.
It is provided according to the position of 2. Electronic circuit package】
When placed on the probe pin jig 9, each test belobe bin 81 comes into contact with the corresponding test probe pin contact portion 22, and testing from the in-circuit tester 8 becomes possible.

Next, a test method will be explained using an example in which the electronic circuit element 6 is tested.

The terminal 61a of the electronic circuit element 6 is connected to the terminal 71a of the electronic circuit element 7 and the terminal 31a of the electronic circuit element 3 by the wiring pattern 21a, and the test probe pin contact part 2
2a. The terminal 61b is connected to wiring pattern 2.
1b to the terminal 51a of the electronic circuit element 5,
It is connected to the test probe pin contact portion 22b. The terminal 61c is connected to the test probe pin contact portion 22c by the wiring pattern 21c.

The electronic circuit package 1 is placed on the probe pin jig 9 of the in-circuit tester 8, and signals are input to the test probe pin contact portion 22a and the test probe pin contact portion 22b via the corresponding test belobe bin 81. The electronic circuit element 6 can be tested by determining the output signal of the test probe pin contact portion 22c.

Similarly, for other electronic circuit elements, the wiring pattern 21
Testing is possible if there is only one test probe pin contact portion 22 for each test probe pin.

〔Effect of the invention〕

As explained above, according to the electronic circuit package of the present invention, in the 5 printed wiring board, the wiring pattern connecting each terminal of the electronic circuit element can be contacted with the test probe pin and placed at a constant regular reference position. When testing with an in-circuit tester, the probe pin is connected to the contact part of the test probe pin provided on the There is an advantage that only one type of jig needs to be prepared in which the storage position of the test probe pin corresponds to a certain regular reference position on the printed wiring board.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the implementation of an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view showing the arrangement when testing the electronic circuit package of this embodiment using an in-circuit tester. 1... Electronic circuit package, 2... Printed wiring board, 3, 4.5, 6.7... Electronic circuit element, 8...
In-circuit testing machine, 9... Probe pin jig,
21.21a, 21b, 21cm...Wiring pattern, 2
2.22a, 22b, 22cm--Test probe pin contact portion, 23... Connector terminal, 31a. 51a, 61a, 61b, 61c, 71a...terminals,
81...Test probe pin.

Claims (1)

[Claims] In an electronic circuit package including an electronic circuit element and a printed wiring board having a plurality of wiring patterns connecting terminals of the electronic circuit element, an external testing machine is installed on a prespecified reference position of the printed wiring board. What is claimed is: 1. An electronic circuit package comprising: a plurality of test probe pin contact portions capable of contacting the test probe pins; and each of the wiring patterns and each of the test probe pin contact portions are connected in correspondence with each other.