JPH0343785B2 - - Google Patents

Info

Publication number
JPH0343785B2
JPH0343785B2 JP58044419A JP4441983A JPH0343785B2 JP H0343785 B2 JPH0343785 B2 JP H0343785B2 JP 58044419 A JP58044419 A JP 58044419A JP 4441983 A JP4441983 A JP 4441983A JP H0343785 B2 JPH0343785 B2 JP H0343785B2
Authority
JP
Japan
Prior art keywords
insulating film
film
semiconductor device
bonding pad
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58044419A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59172258A (ja
Inventor
Shigeo Ishii
Kazuhiro Tsurumaru
Shunichiro Shigematsu
Izumi Tezuka
Eiji Minamimura
Isao Sakamoto
Kazuo Shimizu
Shizuo Kondo
Keisuke Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Microcomputer System Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Microcomputer System Ltd, Hitachi Ltd filed Critical Hitachi Microcomputer System Ltd
Priority to JP58044419A priority Critical patent/JPS59172258A/ja
Publication of JPS59172258A publication Critical patent/JPS59172258A/ja
Publication of JPH0343785B2 publication Critical patent/JPH0343785B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/147—
    • H10W74/121—
    • H10W74/137—
    • H10W70/60—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/884—
    • H10W72/90—
    • H10W72/934—
    • H10W72/983—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58044419A 1983-03-18 1983-03-18 半導体装置 Granted JPS59172258A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58044419A JPS59172258A (ja) 1983-03-18 1983-03-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58044419A JPS59172258A (ja) 1983-03-18 1983-03-18 半導体装置

Publications (2)

Publication Number Publication Date
JPS59172258A JPS59172258A (ja) 1984-09-28
JPH0343785B2 true JPH0343785B2 (show.php) 1991-07-03

Family

ID=12690968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58044419A Granted JPS59172258A (ja) 1983-03-18 1983-03-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS59172258A (show.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4832996A (en) * 1988-02-24 1989-05-23 Motorola, Inc. Semiconductor die for plastic encapsulation having an adhesion promoter

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56150830A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS59172258A (ja) 1984-09-28

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