JPH0343784B2 - - Google Patents

Info

Publication number
JPH0343784B2
JPH0343784B2 JP57046611A JP4661182A JPH0343784B2 JP H0343784 B2 JPH0343784 B2 JP H0343784B2 JP 57046611 A JP57046611 A JP 57046611A JP 4661182 A JP4661182 A JP 4661182A JP H0343784 B2 JPH0343784 B2 JP H0343784B2
Authority
JP
Japan
Prior art keywords
weight
less
particle size
silica powder
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57046611A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58164250A (ja
Inventor
Kazuyuki Miki
Takeo Oono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP57046611A priority Critical patent/JPS58164250A/ja
Publication of JPS58164250A publication Critical patent/JPS58164250A/ja
Publication of JPH0343784B2 publication Critical patent/JPH0343784B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/473—

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57046611A 1982-03-24 1982-03-24 半導体封止用樹脂組成物 Granted JPS58164250A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57046611A JPS58164250A (ja) 1982-03-24 1982-03-24 半導体封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57046611A JPS58164250A (ja) 1982-03-24 1982-03-24 半導体封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58164250A JPS58164250A (ja) 1983-09-29
JPH0343784B2 true JPH0343784B2 (cg-RX-API-DMAC10.html) 1991-07-03

Family

ID=12752093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57046611A Granted JPS58164250A (ja) 1982-03-24 1982-03-24 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58164250A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181422A (ja) * 1984-09-28 1986-04-25 Toshiba Corp 注型用エポキシ樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition

Also Published As

Publication number Publication date
JPS58164250A (ja) 1983-09-29

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