JPH0342699B2 - - Google Patents

Info

Publication number
JPH0342699B2
JPH0342699B2 JP60098281A JP9828185A JPH0342699B2 JP H0342699 B2 JPH0342699 B2 JP H0342699B2 JP 60098281 A JP60098281 A JP 60098281A JP 9828185 A JP9828185 A JP 9828185A JP H0342699 B2 JPH0342699 B2 JP H0342699B2
Authority
JP
Japan
Prior art keywords
cap
low melting
melting point
point glass
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60098281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61256656A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60098281A priority Critical patent/JPS61256656A/ja
Publication of JPS61256656A publication Critical patent/JPS61256656A/ja
Publication of JPH0342699B2 publication Critical patent/JPH0342699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H10W70/682—
    • H10W72/07551—
    • H10W72/50—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP60098281A 1985-05-08 1985-05-08 半導体装置 Granted JPS61256656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60098281A JPS61256656A (ja) 1985-05-08 1985-05-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60098281A JPS61256656A (ja) 1985-05-08 1985-05-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS61256656A JPS61256656A (ja) 1986-11-14
JPH0342699B2 true JPH0342699B2 (index.php) 1991-06-28

Family

ID=14215542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60098281A Granted JPS61256656A (ja) 1985-05-08 1985-05-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS61256656A (index.php)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63275147A (ja) * 1987-05-07 1988-11-11 Nec Corp 気密封止形半導体装置の製造方法
US7242088B2 (en) * 2000-12-29 2007-07-10 Intel Corporation IC package pressure release apparatus and method
JP5595196B2 (ja) * 2010-09-16 2014-09-24 日本電波工業株式会社 圧電デバイス
JP7177328B2 (ja) * 2017-09-29 2022-11-24 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
JPS61256656A (ja) 1986-11-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees