JPH0341765A - Filter for attaching solid-state image sensing element - Google Patents

Abstract

PURPOSE:To increase the area of the contact surface with a filled resin in a filter and to improve the strength of adhesion with the filled resin by providing cut parts at the edge parts of the surface of the filter at the side of a solid- state image sensing element. CONSTITUTION:Cut parts 12a which are cut out obliquely are provided at both edge parts of the surface of a filter 12 in the direction of the width at the side of a solid-state image sensing element 1, A filling resin 3 is filled into a part between the solid-state image sensing element 1 and the filter 12. Thus the filter 12 is bonded, and the generation of interference fringes is prevented. The filling resin 3 is also filled in the cut parts 12a. Since the cut parts 12a are provided at the filter 12, the contact area between the filled resin 3 and the filter 12 is large. Therefore, the strength of adhesion between the filled resin 3 and the filter 12 is high, and the falling off of the filter 12 can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a filter attached to a solid-state image sensor (chip) used in a TV camera or the like.

[Prior Art] FIG. 3(a) is a plan view showing a conventional pasted filter for a solid-state image pickup device, and FIG. 3(b) is a sectional view taken along the line ■-■ in FIG. 3(a). A filling resin 3 is placed on the solid-state image sensor 1.
The filter 2 is attached by. This filling resin 3 has the function of adhering the filter 2 onto the solid-state imaging device 1 and also of preventing interference fringes from occurring.

[Problems to be Solved by the Invention] However, the conventional filter 2 has a flat plate shape and is in contact with the filled resin only on one plane. Therefore, the adhesive area is small and the adhesive strength cannot be said to be sufficient. In addition, the solid-state image sensor 11 filter 2 and filling resin 3
Since the coefficient of thermal expansion of the filter 2 is relatively low, there is a problem that the filter 2 is likely to peel off from the contact surface with the filled resin 3 when stress is applied due to a temperature change.

The present invention has been made in view of such problems, and includes:
It is an object of the present invention to provide a pasted filter for a solid-state image sensor that can increase the adhesive strength between the filter and a filling resin and avoid peeling of the filter.

[Means for Solving the Problems] The adhesive filter for a solid-state image sensor according to the present invention is a filter for a solid-state image sensor that is fixed onto the solid-state image sensor with a filling resin, and the edge of the surface on the solid-state image sensor side. It is characterized in that a notch is provided in the.

[Operations] In the present invention, a notch is provided at the edge of the surface of the filter on the solid-state imaging device side. Therefore, the contact surface area of the filter with the filled resin increases, and the adhesive strength between the filter and the filled resin increases.

This improves resistance to heat stress, so
This prevents the filter from peeling off.

[Example] Next, an example of the present invention will be described with reference to the accompanying drawings.

FIG. 1(a) is a plan view showing a pasted filter for a solid-state image sensor according to the first embodiment of the present invention, and FIG. 1(b) is a sectional view taken along the line II in FIG. 1(a). be.

This embodiment differs from the conventional one in that a notch is provided on the bottom of the filter, and the other structure is basically the same as the conventional one. Components that are the same as those in FIGS. 3(a) and 3(b) are given the same reference numerals, and detailed explanation thereof will be omitted.

The filter 12 according to this embodiment has notches 1 diagonally cut out at both edges in the width direction of the surface on the solid-state image sensor 1 side.
2a is provided. The filling resin 3 is filled between the solid-state image pickup device 1 and the filter 12, and not only adheres the filter 12 but also prevents the generation of interference fringes. This filling resin 3 is also filled in the notch 12a.

In this embodiment, as described above, since the filter 12 is provided with the notch 12a, the contact area between the filled resin 3 and the filter 12 is large. Therefore, the adhesive strength between the filled resin 3 and the filter 12 is high, and the filter 12 can be prevented from falling off.

FIG. 2(a) is a plan view showing an attached filter for a solid-state image sensor according to a second embodiment of the present invention, and FIG. 2(b) is a sectional view taken along the line ■-■ in FIG. 2(a). be.

This embodiment differs from the first embodiment in that the shape of the notch is different, and the other structures are basically the same as the first embodiment. In (b), the same parts as in FIGS. 1(a) and (b) are given the same reference numerals, and detailed explanation thereof will be omitted.

The attached filter 22 for a solid-state image sensor according to this embodiment has V-shaped notches 22a at both edges in the width direction on the solid-state image sensor 1 side. This allows filter 2
The contact area between 2 and the filled resin 3 is further increased compared to the first embodiment.

Therefore, the adhesive strength between the filter 22 and the filled resin 3 is
This is further increased compared to the first embodiment.

[Effects of the Invention] As explained above, according to the present invention, since the notch is provided at the edge of the surface of the filter on the solid-state image sensor side, the contact area between the filter and the filling resin is increased. Improves adhesive strength. Therefore, peeling of the filter due to thermal stress can be avoided.

[Brief explanation of drawings]

FIG. 1(a) is a plan view showing a pasted filter for a solid-state image sensor according to a first embodiment of the present invention, FIG. 1(b) is a cross-sectional view taken along line II in FIG. 1(a), FIG. 2(a) is a plan view showing an attached filter for a solid-state image sensor according to a second embodiment of the present invention, and FIG. 2(b) is a plan view showing the -
■A cross-sectional view taken along the line, Figure 3 (a) is a plan view showing a conventional pasted filter for solid-state image sensor, and Figure 3 (b) is a
It is a sectional view taken along the line ■-■ in Figure (a).

Claims (1)

[Claims] (1) A filter for solid-state imaging devices that is fixed onto the solid-state imaging device with a filling resin, characterized in that a notch is provided at the edge of the surface on the solid-state imaging device side. Paste filter.