JPS6028264A - Solid-state image-pickup device - Google Patents
Solid-state image-pickup deviceInfo
- Publication number
- JPS6028264A JPS6028264A JP58136104A JP13610483A JPS6028264A JP S6028264 A JPS6028264 A JP S6028264A JP 58136104 A JP58136104 A JP 58136104A JP 13610483 A JP13610483 A JP 13610483A JP S6028264 A JPS6028264 A JP S6028264A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- filter
- ccd
- solid
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims 1
- 239000008188 pellet Substances 0.000 abstract description 30
- 238000000034 method Methods 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000000758 substrate Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 2
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、Ｃ０Ｄ（チャージカップルド・デバイス）
等の電荷転送素子を用いた固体撮像装置の構造に係シ、
特にＣＯＤ素子又はその上に載せるフィルターの構造に
関するものである。[Detailed Description of the Invention] This invention is a C0D (charge coupled device)
Regarding the structure of a solid-state imaging device using a charge transfer device such as
In particular, it relates to the structure of a COD element or a filter mounted thereon.
固体撮像素子にフィルターを貼シ合わせる場合、固体撮
像素子（以下ＣＣＤベレット）とフィルターとの平行度
及び接着剤の厚さが問題とな９、この厚さは薄ければ薄
い方が良い。When attaching a filter to a solid-state image sensor, the parallelism between the solid-state image sensor (hereinafter referred to as a CCD pellet) and the filter and the thickness of the adhesive are issues9, and the thinner the thickness, the better.
従来のＣＣＤベレット及びフィルターは第１図、第２図
に示すような構造であった。つまシ、ＣＣＤベレット１
は撮像部となる感光部２、外部への電極数シ出し域とな
る。ボンディングパット３又、なるべく画素に影響しな
い部分に複数の例えば、十字型標点４がこの例で一対設
けられている。Conventional CCD pellets and filters had structures as shown in FIGS. 1 and 2. Tsumashi, CCD pellet 1
is the photosensitive section 2 which becomes the imaging section, and the area where the number of electrodes is exposed to the outside. In this example, a pair of a plurality of, for example, cross-shaped markers 4 are provided on the bonding pad 3 and in a portion that does not affect the pixels as much as possible.
フィルター５は透明硝子基板の一面でＣＯＤ感光部に相
当する位置にストライプ又はドツト状フィルター６ｔ−
形成し、ＣＣＤベレットとフィルターの貼り合わせて位
置合わせに用いる例えば十字型標点７が形成されている
。標点７は、ＣＣＤベレット１とフィルター５の平行を
とるために少々くとも一対を設ける。このような構造を
もつＣＣＤベレットとフィルターを接着剤を用いて貼シ
合わせると、ＣＣＤベレットとフィルターの平行度が確
実に出せない場合がある。The filter 5 is a striped or dot-shaped filter 6t- at a position corresponding to the COD photosensitive area on one surface of the transparent glass substrate.
For example, a cross-shaped reference point 7 is formed for use in positioning the CCD pellet and the filter by bonding them together. At least one pair of reference points 7 is provided to keep the CCD pellet 1 and filter 5 parallel. When a CCD pellet having such a structure and a filter are pasted together using an adhesive, it may not be possible to ensure parallelism between the CCD pellet and the filter.
一般にＣＣＤベレットはｌＱｍｍ角程度と大きく、従っ
てフィルターも同程度に大きく、平行度が完全に出せな
くて、少しの傾きがあってもフィルターの両端では相当
大きい開きになる。また前記接着剤の厚さは薄ければ薄
い程良いが、例えば数ミクロンの厚さに制御しようとす
れば、ＣＣＤベレットとフィルター相互に悪影響を及ぼ
し易ずく、また工数増があシ、生産性、価格面でも不利
をまぬがれることが出来ないという欠点が有った。Generally, the CCD pellet is large, about 1Q mm square, and therefore the filter is also about the same size, and it is not possible to achieve perfect parallelism, so even if there is a slight inclination, there will be a considerably large gap at both ends of the filter. In addition, the thinner the adhesive, the better, but if you try to control the thickness to a few microns, for example, it is likely to have a negative effect on the CCD pellet and the filter, and also increase the number of man-hours and reduce productivity. However, it also had the disadvantage of being unable to avoid disadvantages in terms of price.
本発明はこれらの欠点を解決するために左されたもので
、本発明によればＣ，ＣＤペレット又はその上に域せる
フィルターに合計３個以上の突起を有することを特徴と
し、これによｆｉｃｃＤペレットと接着剤を介して貼シ
合わせるフィルクーとの平行度を確実に出し、かつ接着
剤の厚さを１０ミクロン前後に制御することが可能な構
造をもつ固体撮像装置を提供する。The present invention was developed to solve these drawbacks, and according to the present invention, the C and CD pellets or the filter that can be placed on them have a total of three or more protrusions. To provide a solid-state imaging device having a structure in which the parallelism between a ficcD pellet and a film bonded together through an adhesive can be ensured, and the thickness of the adhesive can be controlled to about 10 microns.
次に本発明を図面により具体的に説明する。Next, the present invention will be specifically explained with reference to the drawings.
第３図は３個の突起８を有するＣＣＤベレットの斜視図
である。この様な突起８が例えば熱硬化性樹脂を点状塗
布又は、コート後部分エツチングすることによシ１０１
０ミクロン前後成しておけば、ＣＣＤペレット上に接着
剤を塗布後例えば吸着ノズルなどでフィルターを吸着し
々からＣＣＤベレット上へ降下させ、貼り合わせを行な
う場合、ＣＣＤペレットとフィルターの平行度は確実に
出すことが可能でかつ、接着剤の厚さを１０ミクロン前
後に制御することが可能となる。前記ＣＣＤペレット１
上の突起８を形成するためには、種々の方法があるが、
前記の方法の他に例えば金属やガラスをＣ９Ｖ、Ｄや蒸
着又はスパッタしエツチング法によシ突起を残すことに
よ膜形成する方法もある。第３図では３個の突起８を形
成した場合を示したが、３個以上の突起が形成してあっ
ても良いのはもちろんである。同様にフィルターの一面
でストライプ又はドツト状フィルターが形成しである面
に３個以上の突起が形成してらっても良い。FIG. 3 is a perspective view of a CCD pellet with three protrusions 8. Such protrusions 8 can be formed 101 by, for example, applying a thermosetting resin in dots or partially etching the resin after coating.
If the diameter is around 0 micron, then the parallelism between the CCD pellet and the filter will be fine when the adhesive is applied to the CCD pellet and the filter is adsorbed using a suction nozzle, and then lowered onto the CCD pellet and bonded together. It is possible to reliably dispense the adhesive and to control the thickness of the adhesive to around 10 microns. Said CCD pellet 1
There are various methods for forming the upper protrusion 8.
In addition to the above-mentioned method, there is also a method of forming a film by leaving protrusions using C9V, D, vapor deposition, or sputtering and etching of metal or glass. Although FIG. 3 shows the case where three protrusions 8 are formed, it goes without saying that three or more protrusions may be formed. Similarly, a stripe or dot-shaped filter may be formed on one surface of the filter, and three or more protrusions may be formed on the other surface.
この場合は、例えばガゼインなどによシ３〜１０ミクロ
ン前後の突起を形成する。In this case, protrusions of about 3 to 10 microns are formed using casein, for example.
また、前記ＣＣＤベレットと前記フィルターの組み合わ
せ、つまシ例えば、ＣＣＤベレット上には２個の突起が
形成され、フィルター上には１個の突起が形成された構
造の固体撮像装置でも前記欠点が解決されるのは言うま
でもない。Further, the above-mentioned drawbacks can also be solved in a solid-state imaging device having a combination of the CCD pellet and the filter, for example, a structure in which two protrusions are formed on the CCD pellet and one protrusion is formed on the filter. Needless to say, it will happen.
第４図は前記ＣＣＤベレット上に前記フィルターを接着
剤９を介して貼シ合わせた状態の９１１面図である。FIG. 4 is a 911-plane view of the filter attached to the CCD pellet with an adhesive 9 interposed therebetween.
以上、説明したように、本発明による構造をもつＣＣＤ
ベレットとフィルターを使用した固体撮像装置ではＣＣ
Ｄペレットとフィルターの平行度は確実に出すことが可
能でかつ、接着剤の厚さは数ミクロンないし１０ミクロ
ン前後に制御することが可能であるので高性能の特性を
示し、かつ工数が減少し、生産性、価格面でも有利にな
る。As explained above, the CCD having the structure according to the present invention
In solid-state imaging devices using pellets and filters, CC
It is possible to ensure parallelism between the D pellet and the filter, and the thickness of the adhesive can be controlled from several microns to around 10 microns, so it exhibits high performance characteristics and reduces man-hours. , it will be advantageous in terms of productivity and price.
第１図は、従来の構造をもつＣＣＤベレットの一面を示
す平面図、第２図は従来の構造をもつフィルターの一面
を示す平面図、第３図は、本発明による構造をもつＣＣ
Ｄベレットの一面を示す斜視図、第４図は本発明による
構造をもつＣＣＤベレットとフィルターを接着剤を介し
て貼シ合わせた状態を示す側面図、でおる。
なお図において、■・−・・・・固体撮像素子、２・・
・・・・感光部、３・・・・・・ポンディング・パッド
部、４・・・・・・固体撮像素子上の目自せ用標点、５
・・・・・・フィルター基板、６・・・・・・ストライ
プ又はトッド状のフィルター、７・・・・・・フィルタ
ー基板上の目合せ標点、８・・・・・・固体撮像素子上
の突起、９・・・・・・接着剤、１０・・・・・・フィ
ルター基板上の突起、である。FIG. 1 is a plan view showing one side of a CCD pellet having a conventional structure, FIG. 2 is a plan view showing one side of a filter having a conventional structure, and FIG. 3 is a plan view showing one side of a CCD pellet having a conventional structure.
FIG. 4 is a perspective view showing one side of the D pellet, and FIG. 4 is a side view showing a state in which a CCD pellet having a structure according to the present invention and a filter are bonded together via an adhesive. In the figure, ■... Solid-state image sensor, 2...
...Photosensitive section, 3...Pounding pad section, 4...Seal reference point on the solid-state image sensor, 5
... Filter substrate, 6 ... Stripe or tod-shaped filter, 7 ... Alignment mark on filter substrate, 8 ... On solid-state image sensor 9...Adhesive, 10...Protrusion on the filter substrate.
Claims (1)
学フィルターに３個以上の突起部が設けられていること
を特徴とする固体撮像Ｒ置。A solid-state imaging device, characterized in that a solid-state imaging device or an optical filter mounted on the main surface of the solid-state imaging device is provided with three or more protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58136104A JPS6028264A (en) | 1983-07-26 | 1983-07-26 | Solid-state image-pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58136104A JPS6028264A (en) | 1983-07-26 | 1983-07-26 | Solid-state image-pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6028264A true JPS6028264A (en) | 1985-02-13 |
Family
ID=15167368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58136104A Pending JPS6028264A (en) | 1983-07-26 | 1983-07-26 | Solid-state image-pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028264A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0597U (en) * | 1991-06-17 | 1993-01-08 | 博義 小野 | Pak for sake |
| JPH0748267A (en) * | 1993-08-04 | 1995-02-21 | Asahi Breweries Ltd | Crude-drug extract containing ginkgo-leaf extract and prunus mume immature fruit extract and health drink containing the crude-drug extract |
| JP2003007881A (en) * | 2001-06-25 | 2003-01-10 | Sony Corp | Semiconductor device and mounting method of the same |
-
1983
- 1983-07-26 JP JP58136104A patent/JPS6028264A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0597U (en) * | 1991-06-17 | 1993-01-08 | 博義 小野 | Pak for sake |
| JPH0748267A (en) * | 1993-08-04 | 1995-02-21 | Asahi Breweries Ltd | Crude-drug extract containing ginkgo-leaf extract and prunus mume immature fruit extract and health drink containing the crude-drug extract |
| JP2003007881A (en) * | 2001-06-25 | 2003-01-10 | Sony Corp | Semiconductor device and mounting method of the same |
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