JPH03137602A - Color filter for solid-state image pickup element - Google Patents

Abstract

PURPOSE:To relieve stress produced in the central part of a solid-state image pickup element and to prevent the occurrence of defects in image quality by forming a film of coloring matter on the surface of a substrate, fixing protrusions on the periphery of the film and adhering the image pickup element. CONSTITUTION:A flat thin film 2 of coloring matter is formed on one side of the glass substrate 1 of a color filter 3 and protrusions 5 are fixed on the four corners of the periphery of the film 2. The protrusions 5 are allowed to coincide with the prescribed positions of the surface of a solid-state image pickup element 4 and one side of the element 4 with a dropped adhesive is adhered. Since stress produced in the central part of the adhered side of the element 4 can be relieved by the protrusions 5, the damage of a diffusion layer is prevented and the occurrence of defects in image quality due to the damage is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a color filter for a solid-state imaging device used in a solid-state imaging device.

[Conventional technology]

FIG. 3 shows an example of a conventional color filter for a solid-state image sensor.

11 is a glass substrate, and 12 is a thin, flat dye film formed on one surface of the glass substrate 11.

This glass MFill and the pigment film 12 constitute a color filter 13.

The surface of the dye film 12 of this color filter 13 and one surface of the solid-state image sensor 14 are bonded together once through an adhesive.

[Problem to be solved by the invention]

However, in the above configuration, the solid-state image sensor 14
When adhering the color filter 13 to the color filter 13, since the dye 1012 that forms the adhesion surface of the color filter 13 is flat and uniform, the pressure applied during adhesion is directly transmitted as stress to the entire surface of the solid state 1 image element 14 through the adhesive. Solid-state image sensor 14
This has caused damage to the diffusion layer of the solid-state imaging device, resulting in defects in the image quality of the finished solid-state imaging device.

An object of the present invention is to provide a color filter for a solid-state image sensor that can reduce the stress applied to the central surface of the solid-state image sensor when the solid-state image sensor and the dye film of the color filter are bonded together.

(Means for solving i!1lffl) The color filter for a solid-state image pickup device of the present invention has a dye film formed on one surface of a substrate, and a convex portion provided around the dye film.

(Function) The color filter for a solid-state image sensor of the present invention has a protrusion on the periphery of a dye film formed on one surface of a substrate, and is bonded to the solid-state image sensor via an adhesive, thereby causing stress applied during adhesion. can be received by the convex portion provided on the surface of the pigment film.

[Example] An embodiment of the present invention will be described based on FIG.

In the color filter 3, a thin, flat dye film 2 is provided on one surface of a glass substrate 1, and convex portions 5 are formed at the four corners of the dye film 2. Then, the surface of the pigment film 2 provided with the convex portions 5 is lowered in the direction of the arrow in the figure, and the convex portions 5 are aligned at a specified position just before they contact the surface of the solid-state image sensor 4. , the surface of the dye film 2 and one side of the solid-state imaging element 4 onto which adhesive has been dropped in advance are adhered with high accuracy.

In this way, by providing the convex portions 5 at the four corners of the surface of the dye film 2 and adhering it to the solid-state imaging device 4 via an adhesive, stress applied to the effective surface of the central part of the adhesive surface of the solid-state imaging device 4 can be reduced. can be made small, the thickness of the adhesive layer can be made uniform and flat, and the diffusion layer of the solid-state image sensor 4 will not be damaged and image quality defects will not occur.

Note that the shape and position of the convex portion 5 are as shown in FIG.
without contacting the effective surface at the center of the adhesive surface of the solid-state monolithic image element 4;
As long as the color filter 3 to be adhered has a shape that is not oblique (lJ1), it may be provided at any position around the periphery.

〔Effect of the invention〕

The color filter for solid-state imaging of the present invention has a convex portion on the periphery of the surface of the dye film of the color filter and is bonded to the solid-state imaging device using an adhesive, thereby effectively utilizing the central portion of the bonding surface of the solid-state imaging device. It reduces the stress applied to the surface and does not damage the expansion layer of the solid-state image sensor and cause M'ff defects.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of one embodiment of a color filter for a solid-state image sensor according to the present invention, FIG. 2 is a plan view of another embodiment, and FIG. 3 is a perspective view of a conventional color filter. l...Glass substrate, 2...Dye film, 3...Glass filter, 5...Convex portion Fig. 3 Fig. 1/

Claims (1)

[Claims] A color filter for solid-state imaging devices that has a dye film formed on one surface of a substrate and a convex portion around the dye film.