JPH0340950B2 - - Google Patents
Info
- Publication number
- JPH0340950B2 JPH0340950B2 JP22761482A JP22761482A JPH0340950B2 JP H0340950 B2 JPH0340950 B2 JP H0340950B2 JP 22761482 A JP22761482 A JP 22761482A JP 22761482 A JP22761482 A JP 22761482A JP H0340950 B2 JPH0340950 B2 JP H0340950B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- cap
- package
- glass
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000007665 sagging Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22761482A JPS59121858A (ja) | 1982-12-28 | 1982-12-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22761482A JPS59121858A (ja) | 1982-12-28 | 1982-12-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59121858A JPS59121858A (ja) | 1984-07-14 |
| JPH0340950B2 true JPH0340950B2 (enrdf_load_html_response) | 1991-06-20 |
Family
ID=16863691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22761482A Granted JPS59121858A (ja) | 1982-12-28 | 1982-12-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59121858A (enrdf_load_html_response) |
-
1982
- 1982-12-28 JP JP22761482A patent/JPS59121858A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59121858A (ja) | 1984-07-14 |
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