JPH0340947B2 - - Google Patents
Info
- Publication number
- JPH0340947B2 JPH0340947B2 JP57104111A JP10411182A JPH0340947B2 JP H0340947 B2 JPH0340947 B2 JP H0340947B2 JP 57104111 A JP57104111 A JP 57104111A JP 10411182 A JP10411182 A JP 10411182A JP H0340947 B2 JPH0340947 B2 JP H0340947B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- measurement
- shield plate
- chuck top
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57104111A JPS58220438A (ja) | 1982-06-17 | 1982-06-17 | 半導体ウエハ測定載置台 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57104111A JPS58220438A (ja) | 1982-06-17 | 1982-06-17 | 半導体ウエハ測定載置台 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58220438A JPS58220438A (ja) | 1983-12-22 |
| JPH0340947B2 true JPH0340947B2 (enExample) | 1991-06-20 |
Family
ID=14372012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57104111A Granted JPS58220438A (ja) | 1982-06-17 | 1982-06-17 | 半導体ウエハ測定載置台 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58220438A (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH067562B2 (ja) * | 1986-12-01 | 1994-01-26 | 東京エレクトロン株式会社 | プロ−バ用載置台の構造 |
| JPS63151039A (ja) * | 1986-12-16 | 1988-06-23 | Hitachi Electronics Eng Co Ltd | 誘電体絶縁層ステ−ジによるウエハlsiの検査方法 |
| US4884026A (en) * | 1987-06-24 | 1989-11-28 | Tokyo Electron Limited | Electrical characteristic measuring apparatus |
| JPH0762691B2 (ja) * | 1987-06-24 | 1995-07-05 | 東京エレクトロン株式会社 | 電気特性測定装置 |
| US5084671A (en) * | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
| JP3565496B2 (ja) * | 2000-04-13 | 2004-09-15 | イビデン株式会社 | セラミックヒータ、静電チャックおよびウエハプローバ |
| JP2006128351A (ja) * | 2004-10-28 | 2006-05-18 | Tokyo Seimitsu Co Ltd | 容量測定システム及び容量測定方法 |
| JP4912056B2 (ja) * | 2006-06-22 | 2012-04-04 | 株式会社東京精密 | プローバ用チャック |
| JP4965287B2 (ja) * | 2007-03-14 | 2012-07-04 | 東京エレクトロン株式会社 | 載置台 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1565811A (en) * | 1976-06-28 | 1980-04-23 | Minnesota Mining & Mfg | Luminescent phosphor materials |
| JPS5938449B2 (ja) * | 1977-06-03 | 1984-09-17 | 株式会社日立製作所 | パネル装置 |
-
1982
- 1982-06-17 JP JP57104111A patent/JPS58220438A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58220438A (ja) | 1983-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6902941B2 (en) | Probing of device elements | |
| US6917195B2 (en) | Wafer probe station | |
| CN103323486B (zh) | 一种高阻值材料的塞贝克系数的测试芯片 | |
| CN102034794A (zh) | 测试结构及测试半导体衬底的方法 | |
| US8323991B2 (en) | Method for detecting stress migration properties | |
| US20120249176A1 (en) | Test structure and measurement method thereof | |
| JPH0340947B2 (enExample) | ||
| Grosse et al. | Microfabricated sensor platform with through-glass vias for bidirectional 3-omega thermal characterization of solid and liquid samples | |
| JPH0436625A (ja) | 等温端子ブロック | |
| CN102082107B (zh) | 芯片测温方法 | |
| TW544830B (en) | A method of testing an integrated circuit | |
| TWI704354B (zh) | 探針卡、具有其的晶圓檢測設備及使用其的裸晶測試流程 | |
| US3787764A (en) | Solid dielectric capacitance gauge for measuring fluid pressure having temperature compensation and guard electrode | |
| JP3741885B2 (ja) | 半導体素子の金属配線パッケージレベルテストパターン及びテスト方法 | |
| JPH067562B2 (ja) | プロ−バ用載置台の構造 | |
| JPH0762691B2 (ja) | 電気特性測定装置 | |
| US6864676B2 (en) | Substrate-holding device for testing circuit arrangements on substrates | |
| CN118688246B (zh) | 一种材料导热系数和热阻的测量方法 | |
| JP4912056B2 (ja) | プローバ用チャック | |
| JP2618926B2 (ja) | 電気的特性測定システム | |
| JPS618939A (ja) | 半導体装置 | |
| JPH07235577A (ja) | 配線評価装置およびその使用方法 | |
| KR100430419B1 (ko) | 반도체 소자의 전기적 특성 검사방법 | |
| JPH02166746A (ja) | 測定装置 | |
| JPH109963A (ja) | 測温抵抗体素子によるシリコンウェハー等の温度計測構造 |