JPH0340929B2 - - Google Patents
Info
- Publication number
- JPH0340929B2 JPH0340929B2 JP13080084A JP13080084A JPH0340929B2 JP H0340929 B2 JPH0340929 B2 JP H0340929B2 JP 13080084 A JP13080084 A JP 13080084A JP 13080084 A JP13080084 A JP 13080084A JP H0340929 B2 JPH0340929 B2 JP H0340929B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electronic component
- lead wire
- leadless
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 26
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13080084A JPS6110298A (ja) | 1984-06-25 | 1984-06-25 | リ−ドレス電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13080084A JPS6110298A (ja) | 1984-06-25 | 1984-06-25 | リ−ドレス電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6110298A JPS6110298A (ja) | 1986-01-17 |
| JPH0340929B2 true JPH0340929B2 (fr) | 1991-06-20 |
Family
ID=15043001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13080084A Granted JPS6110298A (ja) | 1984-06-25 | 1984-06-25 | リ−ドレス電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6110298A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010122764A1 (fr) | 2009-04-20 | 2010-10-28 | パナソニック株式会社 | Matériau de soudure et ensemble composant électronique |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62186519A (ja) * | 1986-02-13 | 1987-08-14 | 松下電器産業株式会社 | 電子部品 |
-
1984
- 1984-06-25 JP JP13080084A patent/JPS6110298A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010122764A1 (fr) | 2009-04-20 | 2010-10-28 | パナソニック株式会社 | Matériau de soudure et ensemble composant électronique |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6110298A (ja) | 1986-01-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |