JPH034043Y2 - - Google Patents
Info
- Publication number
- JPH034043Y2 JPH034043Y2 JP1984160238U JP16023884U JPH034043Y2 JP H034043 Y2 JPH034043 Y2 JP H034043Y2 JP 1984160238 U JP1984160238 U JP 1984160238U JP 16023884 U JP16023884 U JP 16023884U JP H034043 Y2 JPH034043 Y2 JP H034043Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- standard
- wiring
- package body
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984160238U JPH034043Y2 (US06368395-20020409-C00050.png) | 1984-10-23 | 1984-10-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984160238U JPH034043Y2 (US06368395-20020409-C00050.png) | 1984-10-23 | 1984-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6175136U JPS6175136U (US06368395-20020409-C00050.png) | 1986-05-21 |
JPH034043Y2 true JPH034043Y2 (US06368395-20020409-C00050.png) | 1991-02-01 |
Family
ID=30718163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984160238U Expired JPH034043Y2 (US06368395-20020409-C00050.png) | 1984-10-23 | 1984-10-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH034043Y2 (US06368395-20020409-C00050.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5324208U (US06368395-20020409-C00050.png) * | 1976-08-06 | 1978-03-01 | ||
JPS5462782A (en) * | 1977-10-27 | 1979-05-21 | Sharp Corp | Package method of semiconductor device |
-
1984
- 1984-10-23 JP JP1984160238U patent/JPH034043Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5324208U (US06368395-20020409-C00050.png) * | 1976-08-06 | 1978-03-01 | ||
JPS5462782A (en) * | 1977-10-27 | 1979-05-21 | Sharp Corp | Package method of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6175136U (US06368395-20020409-C00050.png) | 1986-05-21 |
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