JPH0339706U - - Google Patents
Info
- Publication number
- JPH0339706U JPH0339706U JP1989101390U JP10139089U JPH0339706U JP H0339706 U JPH0339706 U JP H0339706U JP 1989101390 U JP1989101390 U JP 1989101390U JP 10139089 U JP10139089 U JP 10139089U JP H0339706 U JPH0339706 U JP H0339706U
- Authority
- JP
- Japan
- Prior art keywords
- light
- optical
- fiber cable
- semiconductor device
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 11
- 239000013307 optical fiber Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000002457 bidirectional effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Optical Communication System (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
第１図は本考案の一実施例を示す光伝送装置の
光半導体装置の断面図、第２図は同じくその光半
導体装置と光フアイバケーブルとの結合状態を示
す図、第３図ａ，ｂは同じくその光フアイバケー
ブルを示す図、第４図は他の実施例の光フアイバ
ケーブルを示す図、第５図は従来の光伝送装置の
光半導体装置の断面図、第６図は同じくその光半
導体装置と光フアイバケーブルとの結合状態を示
す図、第７，８図は同じくその光フアイバケーブ
ルを示す図である。 ２０……パツケージ、２１……発光素子、２２
……受光素子、２３……透光性樹脂、２４……光
半導体装置、２５……光フアイバケーブル、２６
……保持筒、２７……先端、Ａ……発光領域、Ｂ
……受光領域。
光半導体装置の断面図、第２図は同じくその光半
導体装置と光フアイバケーブルとの結合状態を示
す図、第３図ａ，ｂは同じくその光フアイバケー
ブルを示す図、第４図は他の実施例の光フアイバ
ケーブルを示す図、第５図は従来の光伝送装置の
光半導体装置の断面図、第６図は同じくその光半
導体装置と光フアイバケーブルとの結合状態を示
す図、第７，８図は同じくその光フアイバケーブ
ルを示す図である。 ２０……パツケージ、２１……発光素子、２２
……受光素子、２３……透光性樹脂、２４……光
半導体装置、２５……光フアイバケーブル、２６
……保持筒、２７……先端、Ａ……発光領域、Ｂ
……受光領域。
Claims (1)
- 一つのパツケージ内に発光素子と受光素子とが
透光性樹脂にてモールドされて成る光半導体装置
と、該光半導体装置に対して双方向の光伝送を行
う光フアイバケーブルと、該光フアイバケーブル
を保持固定し光半導体装置と光フアイバケーブル
とを光学的に結合する保持筒とを備え、前記保持
筒の先端が、発光素子の発光領域および受光素子
の受光領域を覆うような長円形状とされたことを
特徴とする光伝送装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989101390U JPH0339706U (ja) | 1989-08-29 | 1989-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989101390U JPH0339706U (ja) | 1989-08-29 | 1989-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339706U true JPH0339706U (ja) | 1991-04-17 |
Family
ID=31650345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989101390U Pending JPH0339706U (ja) | 1989-08-29 | 1989-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339706U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003098397A (ja) * | 2001-09-21 | 2003-04-03 | Citizen Electronics Co Ltd | 双方向光伝送デバイス |
-
1989
- 1989-08-29 JP JP1989101390U patent/JPH0339706U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003098397A (ja) * | 2001-09-21 | 2003-04-03 | Citizen Electronics Co Ltd | 双方向光伝送デバイス |