JPS62188164U - - Google Patents
Info
- Publication number
- JPS62188164U JPS62188164U JP7741086U JP7741086U JPS62188164U JP S62188164 U JPS62188164 U JP S62188164U JP 7741086 U JP7741086 U JP 7741086U JP 7741086 U JP7741086 U JP 7741086U JP S62188164 U JPS62188164 U JP S62188164U
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- emitting element
- receiving element
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000005871 repellent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
第1図は本考案に係る光結合素子の一実施例の
縦断面図、第2図及び第3図はそれぞれ異なる従
来例の縦断面図である。 1:リードフレーム、2:発光素子、3:受光
素子、5:透光性樹脂、6:遮光性樹脂、7:光
反性性樹脂。
縦断面図、第2図及び第3図はそれぞれ異なる従
来例の縦断面図である。 1:リードフレーム、2:発光素子、3:受光
素子、5:透光性樹脂、6:遮光性樹脂、7:光
反性性樹脂。
Claims (1)
- 一平面内に並列配置された発光素子及び受光素
子対が樹脂モールドされてなる光結合素子におい
て、前記発光素子及び受光素子間の光伝達部を透
光性樹脂で充填して小さく結合し、前記光伝達部
上を前記透光性樹脂とほぼ同じ熱膨張係数でかつ
光反射特性を有する樹脂で大きく被覆し、更に外
部周辺を遮光性樹脂で被覆してなることを特徴と
する光結合素子。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7741086U JPS62188164U (ja) | 1986-05-20 | 1986-05-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7741086U JPS62188164U (ja) | 1986-05-20 | 1986-05-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62188164U true JPS62188164U (ja) | 1987-11-30 |
Family
ID=30925390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7741086U Pending JPS62188164U (ja) | 1986-05-20 | 1986-05-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62188164U (ja) |
-
1986
- 1986-05-20 JP JP7741086U patent/JPS62188164U/ja active Pending