JPH0339536B2 - - Google Patents

Info

Publication number
JPH0339536B2
JPH0339536B2 JP61005937A JP593786A JPH0339536B2 JP H0339536 B2 JPH0339536 B2 JP H0339536B2 JP 61005937 A JP61005937 A JP 61005937A JP 593786 A JP593786 A JP 593786A JP H0339536 B2 JPH0339536 B2 JP H0339536B2
Authority
JP
Japan
Prior art keywords
resin
solder
component
manufactured
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61005937A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62164757A (ja
Inventor
Kyoji Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinto Paint Co Ltd
Original Assignee
Shinto Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinto Paint Co Ltd filed Critical Shinto Paint Co Ltd
Priority to JP593786A priority Critical patent/JPS62164757A/ja
Publication of JPS62164757A publication Critical patent/JPS62164757A/ja
Publication of JPH0339536B2 publication Critical patent/JPH0339536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP593786A 1986-01-14 1986-01-14 導電性回路を形成する方法 Granted JPS62164757A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP593786A JPS62164757A (ja) 1986-01-14 1986-01-14 導電性回路を形成する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP593786A JPS62164757A (ja) 1986-01-14 1986-01-14 導電性回路を形成する方法

Publications (2)

Publication Number Publication Date
JPS62164757A JPS62164757A (ja) 1987-07-21
JPH0339536B2 true JPH0339536B2 (enrdf_load_stackoverflow) 1991-06-14

Family

ID=11624810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP593786A Granted JPS62164757A (ja) 1986-01-14 1986-01-14 導電性回路を形成する方法

Country Status (1)

Country Link
JP (1) JPS62164757A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06267784A (ja) * 1992-11-04 1994-09-22 Du Pont Kk 導電性樹脂ペースト及びそれにより成る端子電極を有した積層セラミックチップコンデンサ
WO2013090344A1 (en) 2011-12-13 2013-06-20 Ferro Corporation Electrically conductive polymeric compositons, contacts, assemblies, and methods
EP2918371A1 (en) * 2014-03-11 2015-09-16 Heraeus Precious Metals North America Conshohocken LLC Solderable conductive polymer thick film composition

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170658A (ja) * 1984-02-15 1985-09-04 Toshiba Chem Corp 導電性ペ−スト

Also Published As

Publication number Publication date
JPS62164757A (ja) 1987-07-21

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