JPH0339536B2 - - Google Patents
Info
- Publication number
- JPH0339536B2 JPH0339536B2 JP61005937A JP593786A JPH0339536B2 JP H0339536 B2 JPH0339536 B2 JP H0339536B2 JP 61005937 A JP61005937 A JP 61005937A JP 593786 A JP593786 A JP 593786A JP H0339536 B2 JPH0339536 B2 JP H0339536B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- solder
- component
- manufactured
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- 239000011230 binding agent Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Description
〔産業上の利用分野〕
本発明は、成型板に本発明の導電性組成物を用
いて回路をスクリーン印刷等の方法で形成するこ
とにより、従来からある銅張積層板のエツチング
によるプリント基板の機能を持たせることを可能
とする半田付け可能な導電性回路を形成する方法
に関するものである。
〔従来の技術〕
従来、半田可能な導電性組成物としては、ガラ
スフリツトを結合剤とする焼成型銀ペースト（焼
成温度700〜900℃）が実用化されている。
また、結合剤として有機高分子を用いた半田付
け可能な導電性組成物としては、個体タンタルコ
ンデンサー用処法（特公昭51−31244号あるいは
特公昭60−44533号）が知られている。
〔発明が解決しようとする問題点〕
しかしながら、前述個体タンタルコンデンサー
用組成物は、導電性回路形成用に適用するには、
樹脂成分が熱可塑性であるため耐薬品性・耐溶剤
性・耐湿性に弱点があり、実用化に至つていな
い。
〔問題を解決するための手段〕
本発明者は、結合剤として有機高分子を用いた
半田付け性の良い導電性組成物について鋭意研究
を重ねた結果、樹脂結合剤の成分として、分子量
1600以上のビスフエノール骨格エポキシ樹脂と架
橋樹脂成分との混合系に銀粉を分散した組成物が
半田付け性の良いことを見い出し、この知見に基
づいて本発明を完成した。
本発明は、
(a) 分子量1600以上のビスフエノール骨格を有す
るエポキシ樹脂及び架橋樹脂成分より成る熱硬
化性樹脂結合成分３〜15重量部
(b) 銀粉85〜97重量部
(c) 溶剤
を主成分とする、半田付け可能な導電性組成物を
樹脂基板に印刷することにより導電性回路を形成
する方法である。
本発明において用いられるビスフエノール骨格
を有するエポキシ樹脂は、分子量1600以上のもの
としては、例えばエピコート1004、エピコート
1007、エピコート1009、エピコートOL−53−Ｂ
−40（以上、油化シエルエポキシ社製）がある。
また、上記エポキシ樹脂の変性品も使用でき、そ
のようなものとして臭素化エポキシZX−808（東
都化成社製）がある。
また、架橋樹脂成分としては、メラミン樹脂、
尿素樹脂、フエノール樹脂、イソシアネート等、
通常のエポキシ樹脂の硬化剤が使用できる。この
ようなものとしては、例えばメラン＃27（メラミ
ン樹脂・日立化成社製）、ベツカミンＰ−138（尿
素樹脂・大日本インキ社製）、プライオーフエン
4170（フエノール樹脂・大日本インキ社製）、バー
ノツクＤ−500（ブロツクイソシアネート・大日本
インキ社製）等が利用できる。
また、銀粉はフレーク状あるいは球状のもの単
独あるいは混合して使用できる。粒径は特に限定
されないがスクリーン印刷性を考慮すると15μｍ
以下が好ましい。このようなものとしては、例え
ば、シルコートAGC−Ｂ（フレーク状、福田金属
箔粉工業社製）、シルコートAGC−AO（球状・福
田金属箔粉工業社製）がある。
また、溶剤はエポキシ樹脂及び架橋樹脂成分を
溶解するものであればよいが、スクリーン印刷を
考慮した場合、エチレングリコールモノブチルエ
ーテルやジエチレングリコールモノブチルエーテ
ルが好ましい。
また、上記成分以外に硬化促進剤、流動性調整
剤を併用することに何ら制約を受けない
〔実施例〕
(1) 第１表に示す試験例１から７の組成物を３本
ロールミルで分散した試料とした。この試料を
用いて紙フエノール基板（板厚1.0mm）に、ス
クリーン印刷で20×20mmのパターンを印刷し、
150℃で30分乾燥し半田付け性評価の試験板と
した。
試験板の導電性皮膜部分にフラツクスを塗布
し、205℃の半田浴（Sn／Pb／Ag＝62／36／
２）に３秒間浸漬後、引き上げ皮膜部分が半田
で被膜された割合即ち半田濡れ性を測定した。
一方、半田強度測定用試験板として第１図に
示すように２×２mmのパターンを印刷し、150
℃で30分乾燥して作成し、φ0.6mmのハンダメツ
キ銅線を半田付けし引張強度を測定し、半田強
度とした。
試験例１は、半田濡れ性が劣るが、試験例２
から試験例７は良好な半田濡れ性を示した。即
ち、分子量1600以上のエポキシ樹脂を使つた試
験例２から７は良好な半田濡れ性を示した。
(2) 試験例８〜13についても試験例１から７と同
様に、試料・試験板を作成し評価結果を第２表
に示す。
乾燥皮膜中の銀粉量が85％以上で良好な半田
濡れ性が得られた。但し、銀粉量が98％になる
と、半田濡れ性は良好であるが、半田強度が著
しく低下し実用に耐えない価であつた。
[Industrial Application Field] The present invention enables the production of printed circuit boards by conventional etching of copper-clad laminates by forming a circuit on a molded board using a method such as screen printing using the conductive composition of the present invention. The present invention relates to a method of forming a solderable conductive circuit that can be provided with a function. [Prior Art] Conventionally, as a solderable conductive composition, a sintered silver paste (sintered at a temperature of 700 to 900° C.) using glass frit as a binder has been put into practical use. Furthermore, as a solderable conductive composition using an organic polymer as a binder, a method for solid tantalum capacitors (Japanese Patent Publication No. 31244/1983 or Japanese Patent Publication No. 44533/1983) is known. [Problems to be Solved by the Invention] However, the above-mentioned solid tantalum capacitor composition cannot be applied to forming a conductive circuit.
Since the resin component is thermoplastic, it has weaknesses in chemical resistance, solvent resistance, and moisture resistance, and has not been put into practical use. [Means for Solving the Problem] As a result of extensive research into conductive compositions with good solderability that use organic polymers as binders, the inventors have found that, as a component of the resin binder, molecular weight
It was discovered that a composition in which silver powder is dispersed in a mixed system of a 1600 or more bisphenol skeleton epoxy resin and a crosslinked resin component has good solderability, and based on this knowledge, the present invention was completed. The present invention comprises (a) 3 to 15 parts by weight of a thermosetting resin binding component consisting of an epoxy resin having a bisphenol skeleton having a molecular weight of 1600 or more and a crosslinked resin component, (b) 85 to 97 parts by weight of silver powder, and (c) a solvent as the main component. This is a method of forming a conductive circuit by printing a solderable conductive composition as a component on a resin substrate. The epoxy resin having a bisphenol skeleton used in the present invention has a molecular weight of 1600 or more, such as Epicote 1004, Epicote
1007, Epicote 1009, Epicote OL-53-B
-40 (manufactured by Yuka Ciel Epoxy Co., Ltd.).
Modified products of the above epoxy resins can also be used, such as brominated epoxy ZX-808 (manufactured by Toto Kasei Co., Ltd.). In addition, as a crosslinked resin component, melamine resin,
Urea resin, phenolic resin, isocyanate, etc.
Common epoxy resin hardeners can be used. Examples of such materials include Melan #27 (melamine resin, manufactured by Hitachi Chemical Co., Ltd.), Betsukamine P-138 (urea resin, manufactured by Dainippon Ink Co., Ltd.), and Plyophen resin.
4170 (phenolic resin, manufactured by Dainippon Ink Co., Ltd.), Burnok D-500 (blocked isocyanate, manufactured by Dainippon Ink Co., Ltd.), etc. can be used. Furthermore, silver powder in the form of flakes or spheres can be used alone or in combination. Particle size is not particularly limited, but considering screen printability, it is 15μm
The following are preferred. Examples of such materials include Silcoat AGC-B (flake shape, manufactured by Fukuda Metal Foil and Powder Industries Co., Ltd.) and Silcoat AGC-AO (spherical shape, manufactured by Fukuda Metal Foil and Powder Industries Co., Ltd.). Further, the solvent may be any solvent as long as it dissolves the epoxy resin and the crosslinked resin component, but in consideration of screen printing, ethylene glycol monobutyl ether and diethylene glycol monobutyl ether are preferable. In addition, there are no restrictions on the use of curing accelerators and fluidity modifiers in addition to the above components [Example] (1) The compositions of Test Examples 1 to 7 shown in Table 1 are dispersed in a three-roll mill. The sample was Using this sample, a 20 x 20 mm pattern was printed on a paper phenol substrate (board thickness 1.0 mm) by screen printing.
It was dried at 150°C for 30 minutes and used as a test board for evaluating solderability. Flux was applied to the conductive film part of the test board, and the solder bath at 205℃ (Sn/Pb/Ag=62/36/
After dipping in 2) for 3 seconds, the rate at which the film was pulled up and coated with solder, that is, the solder wettability was measured. On the other hand, as a test plate for measuring solder strength, a 2 x 2 mm pattern was printed as shown in Figure 1.
It was prepared by drying at ℃ for 30 minutes, soldered with a solder-plated copper wire of φ0.6 mm, and its tensile strength was measured, which was defined as solder strength. Test example 1 has poor solder wettability, but test example 2
Test Example 7 showed good solder wettability. That is, Test Examples 2 to 7 using epoxy resins with a molecular weight of 1600 or more showed good solder wettability. (2) For Test Examples 8 to 13, samples and test plates were prepared in the same manner as Test Examples 1 to 7, and the evaluation results are shown in Table 2. Good solder wettability was obtained when the amount of silver powder in the dried film was 85% or more. However, when the amount of silver powder was 98%, the solder wettability was good, but the solder strength was significantly lowered, and the value was not suitable for practical use.
【表】【table】
【表】【table】
本発明の導電性組成物を使うと、従来銅張積層
板からエツチングにより製造していたプリント基
板が、スクリーン印刷で直接樹脂基板に回路印刷
できるので、半田付け性の良い新工法プリント基
板が、簡略工程で得られる
また、成型体へ直接印刷することにより、従来
の基板が不要となり、小型化等の新展開が得られ
る。
By using the conductive composition of the present invention, printed circuit boards that were conventionally manufactured from copper-clad laminates by etching can be printed directly on resin boards by screen printing, so new printed circuit boards with good solderability can be created. It can be obtained through a simple process.Also, by directly printing on the molded body, the conventional substrate is no longer necessary, and new developments such as miniaturization can be achieved.
第１図は半田強度測定用試験板の概略図であ
る。
１……紙フエノール基板、２……導電性組成物
皮膜、３……半田メツキ銅線、４……引張方向。
FIG. 1 is a schematic diagram of a test plate for measuring solder strength. 1... Paper phenol substrate, 2... Conductive composition film, 3... Solder plated copper wire, 4... Tensile direction.
Claims (1)
有するエポキシ樹脂及び架橋樹脂成分より成る
熱硬化性樹脂結合成分３〜15重量部 (b) 銀粉85〜97重量部 (c) 溶剤 を主成分とする半田付け可能な導電性組成物を樹
脂基板に印刷することにより導電性回路を形成す
る方法。[Scope of Claims] 1 (a) 3 to 15 parts by weight of a thermosetting resin binding component consisting of an epoxy resin having a bisphenol skeleton having a molecular weight of 1600 or more and a crosslinked resin component (b) 85 to 97 parts by weight of silver powder (c) A method of forming a conductive circuit by printing a solderable conductive composition containing a solvent as a main component onto a resin substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP593786A JPS62164757A (en) | 1986-01-14 | 1986-01-14 | Solderable, electrically conductive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP593786A JPS62164757A (en) | 1986-01-14 | 1986-01-14 | Solderable, electrically conductive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62164757A JPS62164757A (en) | 1987-07-21 |
| JPH0339536B2 true JPH0339536B2 (en) | 1991-06-14 |
Family
ID=11624810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP593786A Granted JPS62164757A (en) | 1986-01-14 | 1986-01-14 | Solderable, electrically conductive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62164757A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06267784A (en) * | 1992-11-04 | 1994-09-22 | Du Pont Kk | Conductive resin paste and laminated ceramic chip capacitor with terminal electrode consisting of same |
| WO2013090344A1 (en) | 2011-12-13 | 2013-06-20 | Ferro Corporation | Electrically conductive polymeric compositons, contacts, assemblies, and methods |
| EP2918371A1 (en) | 2014-03-11 | 2015-09-16 | Heraeus Precious Metals North America Conshohocken LLC | Solderable conductive polymer thick film composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60170658A (en) * | 1984-02-15 | 1985-09-04 | Toshiba Chem Corp | Electrically conductive paste |
-
1986
- 1986-01-14 JP JP593786A patent/JPS62164757A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60170658A (en) * | 1984-02-15 | 1985-09-04 | Toshiba Chem Corp | Electrically conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62164757A (en) | 1987-07-21 |
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