JPH0338649U - - Google Patents

Info

Publication number
JPH0338649U
JPH0338649U JP1989098981U JP9898189U JPH0338649U JP H0338649 U JPH0338649 U JP H0338649U JP 1989098981 U JP1989098981 U JP 1989098981U JP 9898189 U JP9898189 U JP 9898189U JP H0338649 U JPH0338649 U JP H0338649U
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
discontinuous
discontinuous part
wiring conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989098981U
Other languages
Japanese (ja)
Other versions
JP2502851Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989098981U priority Critical patent/JP2502851Y2/en
Publication of JPH0338649U publication Critical patent/JPH0338649U/ja
Application granted granted Critical
Publication of JP2502851Y2 publication Critical patent/JP2502851Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の半導体装置の基板
の斜視図、第２図は本考案の別の実施例の半導体
装置の基板要部の斜視図、第３図は本考案のさら
に別の実施例の半導体装置の基板要部の平面図で
ある。 １…熱良導性基板、２…絶縁層、３…配線導体
、４…ろう付け可能面、６…幅の狭い配線導体、
７…細い導線、８…温度検出用素子。 FIG. 1 is a perspective view of a substrate of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a perspective view of a main part of a substrate of a semiconductor device according to another embodiment of the present invention, and FIG. 3 is a perspective view of a substrate of a semiconductor device according to another embodiment of the present invention. FIG. 2 is a plan view of a main part of a substrate of a semiconductor device according to an embodiment of the present invention. 1... thermally conductive substrate, 2... insulating layer, 3... wiring conductor, 4... brazing surface, 6... narrow wiring conductor,
7...Thin conducting wire, 8...Temperature detection element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を含む電子部品が基板上に搭載され
、その基板上に設けられた配線導体によつて接続
されるものにおいて、配線導体の一部に不連続部
が形成され、その不連続部に導電材料よりなる高
抵抗部が介在することを特徴とする半導体装置。 In devices where electronic components including semiconductor elements are mounted on a substrate and connected by wiring conductors provided on the substrate, a discontinuous part is formed in a part of the wiring conductor, and the discontinuous part is conductive. A semiconductor device characterized in that a high resistance part made of a material is interposed.
JP1989098981U 1989-08-24 1989-08-24 Semiconductor device Expired - Lifetime JP2502851Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989098981U JP2502851Y2 (en) 1989-08-24 1989-08-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989098981U JP2502851Y2 (en) 1989-08-24 1989-08-24 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH0338649U true JPH0338649U (en) 1991-04-15
JP2502851Y2 JP2502851Y2 (en) 1996-06-26

Family

ID=31648056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989098981U Expired - Lifetime JP2502851Y2 (en) 1989-08-24 1989-08-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JP2502851Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919361A (en) * 1982-07-24 1984-01-31 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919361A (en) * 1982-07-24 1984-01-31 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
JP2502851Y2 (en) 1996-06-26

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