JPH0337956Y2 - - Google Patents
Info
- Publication number
- JPH0337956Y2 JPH0337956Y2 JP691484U JP691484U JPH0337956Y2 JP H0337956 Y2 JPH0337956 Y2 JP H0337956Y2 JP 691484 U JP691484 U JP 691484U JP 691484 U JP691484 U JP 691484U JP H0337956 Y2 JPH0337956 Y2 JP H0337956Y2
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- resin molded
- chain
- electronic component
- printing ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 24
- 239000000057 synthetic resin Substances 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 13
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP691484U JPS60119537U (ja) | 1984-01-20 | 1984-01-20 | 電子部品における印刷インクの乾燥装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP691484U JPS60119537U (ja) | 1984-01-20 | 1984-01-20 | 電子部品における印刷インクの乾燥装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60119537U JPS60119537U (ja) | 1985-08-13 |
| JPH0337956Y2 true JPH0337956Y2 (cs) | 1991-08-12 |
Family
ID=30484790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP691484U Granted JPS60119537U (ja) | 1984-01-20 | 1984-01-20 | 電子部品における印刷インクの乾燥装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60119537U (cs) |
-
1984
- 1984-01-20 JP JP691484U patent/JPS60119537U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60119537U (ja) | 1985-08-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE8502584L (sv) | Forfarande for framstellning av ett elektriskt stralningsvermeelement | |
| JP2517040B2 (ja) | 印刷配線板の搬送方法 | |
| JPH0337956Y2 (cs) | ||
| JPH1187429A5 (cs) | ||
| JPS5954292A (ja) | 印刷配線板の製造法および加熱装置 | |
| JPS6447058A (en) | Package for semiconductor device | |
| JPS595494Y2 (ja) | プリント基板予備加熱装置 | |
| JPS57130437A (en) | Sealing method of ic | |
| JPS5875684A (ja) | 均一加熱装置 | |
| JPS6179293A (ja) | 電子部品の取付け方法 | |
| JPS61141199A (ja) | チツプ部品の実装方法 | |
| JPS61282213A (ja) | 回路基板搬送用断熱チエ−ン | |
| JPH0214208Y2 (cs) | ||
| KR0120969Y1 (ko) | 금형장치를 예열하는 운반차 | |
| JPS5966153A (ja) | 半導体シ−ル装置 | |
| JPS59181092A (ja) | 硬化装置 | |
| KR950034720A (ko) | Ic다이와 기판간의 본딩을 위한 다이 부착물 큐어 방법 및 이 방법에 의한 프로덕트 | |
| JPH0546985B2 (cs) | ||
| JPS6063949U (ja) | 半導体装置 | |
| JPS6418572A (en) | Soldering device | |
| JPS6138225Y2 (cs) | ||
| ATE59813T1 (de) | Transferdruckverfahren. | |
| JPS60192471U (ja) | プリント板 | |
| JPS62278783A (ja) | ヒ−タ | |
| JPH0259860U (cs) |