JPH0337265Y2 - - Google Patents
Info
- Publication number
- JPH0337265Y2 JPH0337265Y2 JP1982144488U JP14448882U JPH0337265Y2 JP H0337265 Y2 JPH0337265 Y2 JP H0337265Y2 JP 1982144488 U JP1982144488 U JP 1982144488U JP 14448882 U JP14448882 U JP 14448882U JP H0337265 Y2 JPH0337265 Y2 JP H0337265Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- ceramic circuit
- holder
- conductive layer
- finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14448882U JPS5948071U (ja) | 1982-09-24 | 1982-09-24 | セラミツク回路基板の取付部 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14448882U JPS5948071U (ja) | 1982-09-24 | 1982-09-24 | セラミツク回路基板の取付部 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948071U JPS5948071U (ja) | 1984-03-30 |
| JPH0337265Y2 true JPH0337265Y2 (enrdf_load_stackoverflow) | 1991-08-07 |
Family
ID=30322193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14448882U Granted JPS5948071U (ja) | 1982-09-24 | 1982-09-24 | セラミツク回路基板の取付部 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948071U (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0530386Y2 (enrdf_load_stackoverflow) * | 1985-03-13 | 1993-08-03 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528066U (enrdf_load_stackoverflow) * | 1975-07-03 | 1977-01-20 | ||
| JPS6141279Y2 (enrdf_load_stackoverflow) * | 1978-10-09 | 1986-11-25 |
-
1982
- 1982-09-24 JP JP14448882U patent/JPS5948071U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948071U (ja) | 1984-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5160434B2 (ja) | 多接合部ばねフィンガを有する接地ばねを用いて電子コンポーネントに熱的に接触したヒート・シンクを接地するための方法および装置 | |
| US5541811A (en) | Shielding and cooling arrangement | |
| JPH0864732A (ja) | 半導体集積回路装置 | |
| JPH0951187A (ja) | 熱の発散装置及び熱の発散方法 | |
| KR100416980B1 (ko) | 볼 그리드 어레이 칩 고정장치 | |
| JPH0779053A (ja) | 電気装置 | |
| JP2004134518A (ja) | 電子部品、電子部品の製造方法及び製造装置 | |
| JPH0337265Y2 (enrdf_load_stackoverflow) | ||
| JPH0680911B2 (ja) | 電子部品を搭載したプリント配線板の放熱構造 | |
| JPH05259670A (ja) | プリント配線板構造体 | |
| US20020014351A1 (en) | Module-mounting motherboard device | |
| JP2504486B2 (ja) | 混成集積回路構造 | |
| JP2004031854A (ja) | 放熱構造 | |
| JPH0638479Y2 (ja) | 電子部品のシールドケース | |
| JPH09139448A (ja) | 半導体の取付具及びその取付方法並びにこれを用いた半導体装置 | |
| JP2755288B2 (ja) | シールドケース | |
| JP2806622B2 (ja) | ヒートシンクの取付構造 | |
| JP3696060B2 (ja) | 放熱構造、及び、その形成方法 | |
| JPS5928388Y2 (ja) | 太陽電池基板の固定構造 | |
| JP2531625Y2 (ja) | スクリーン印刷用印刷版 | |
| JP2813683B2 (ja) | 電子部品搭載用基板 | |
| JPH1154972A (ja) | 電子機器の電子部品取付け構造 | |
| JP2936845B2 (ja) | 集積回路の実装構造 | |
| JPH10173113A (ja) | Lsiパッケージ用冷却装置およびその固定方法 | |
| JPH04291749A (ja) | 放熱部材を備えた電子部品搭載用基板 |