JPH0337265Y2 - - Google Patents
Info
- Publication number
- JPH0337265Y2 JPH0337265Y2 JP1982144488U JP14448882U JPH0337265Y2 JP H0337265 Y2 JPH0337265 Y2 JP H0337265Y2 JP 1982144488 U JP1982144488 U JP 1982144488U JP 14448882 U JP14448882 U JP 14448882U JP H0337265 Y2 JPH0337265 Y2 JP H0337265Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- ceramic circuit
- holder
- conductive layer
- finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
本考案は、アルミナ基板の如きセラミツク回路
基板の取付部に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting portion for a ceramic circuit board such as an alumina substrate.
従来、セラミツク回路基板の取付けは、セラミ
ツク回路基板を金属ケースの上に載せ、該セラミ
ツク回路基板の下面には導電層を設け、該導電層
が金属ケースに接触するようにセラミツク回路基
板の上面の周縁部をばね性金属よりなる板状のホ
ルダの各フインガー状部で押え、該ホルダをネジ
で取付支持体に固定することにより行つていた。 Conventionally, when installing a ceramic circuit board, the ceramic circuit board is placed on a metal case, a conductive layer is provided on the bottom surface of the ceramic circuit board, and the top surface of the ceramic circuit board is placed so that the conductive layer is in contact with the metal case. This was accomplished by holding the peripheral edge of a plate-shaped holder made of a springy metal with finger-shaped parts, and fixing the holder to a mounting support with screws.
しかしながら、セラミツク回路基板は反りがあ
るため、該セラミツク回路基板の上面を板状のホ
ルダの各フインガー状部で押えても、該セラミツ
ク回路基板の下面の導電層を金属ケースに一様に
接触させることが困難で、該セラミツク回路基板
の下面の導電層と金属ケースとの導通を一様にと
れず、高次モードが発生し易い欠点があつた。こ
れを防止するため、ホルダによる押圧力を強くす
ると、セラミツク回路基板が割れ易い欠点があつ
た。 However, since the ceramic circuit board is warped, even if the top surface of the ceramic circuit board is held down by each finger-like part of the plate-like holder, the conductive layer on the bottom surface of the ceramic circuit board cannot be uniformly contacted with the metal case. This has the disadvantage that it is difficult to maintain uniform conduction between the conductive layer on the lower surface of the ceramic circuit board and the metal case, and higher-order modes are likely to occur. In order to prevent this, if the pressing force by the holder is increased, the ceramic circuit board tends to break easily.
本考案の目的は、セラミツク回路基板に反りが
あつても該セラミツク回路基板の導電層の接地
を、該セラミツク回路基板を割らずに確実にとる
ことができ、しかも接地が確実にとれたか否かの
確認を容易に行うことができるセラミツク回路基
板の取付部を提供することにある。 The purpose of this invention is to be able to reliably ground the conductive layer of the ceramic circuit board without breaking the ceramic circuit board even if the ceramic circuit board is warped, and to determine whether or not the grounding has been reliably established. An object of the present invention is to provide a mounting part for a ceramic circuit board that allows easy confirmation of the compatibility of the ceramic circuit board.
本考案に係るセラミツク回路基板の取付部は、
取付支持体の上にクツシヨン材を介してセラミツ
ク回路基板が載置され、前記セラミツク回路基板
の上面の周縁部に導電層が設けられ、該導電層の
上にばね性金属よりなる板状のホルダの各フイン
ガー状部がそれぞれ半田付けで固定され、前記ホ
ルダは前記取付支持体に固定されていることを特
徴とするものである。 The mounting part of the ceramic circuit board according to the present invention is
A ceramic circuit board is placed on the mounting support via a cushion material, a conductive layer is provided on the periphery of the upper surface of the ceramic circuit board, and a plate-shaped holder made of a spring metal is placed on the conductive layer. Each of the finger-like parts of the holder is fixed by soldering, and the holder is fixed to the mounting support.
以下、本考案の実施例を図面を参照して詳細に
説明する。第１図乃至第３図に示すように、取付
支持体としてのケース１の底板１Ａ上には、熱伝
導性シリコンゴムの如き熱を伝え易い板状のクツ
シヨン材２を介してアルミナ基板の如きセラミツ
ク回路基板３が載置されている。セラミツク回路
基板３の上面の周縁には、アース層を兼ねて導電
層４が設けられている。これらの導電層４の上に
は、リン青銅やベリリウム銅などのばね性金属よ
りなる板状のホルダ５の複数のフインガー状部５
Ａがそれぞれ半田６付けで固定されている。各ホ
ルダ５は取付支持体としてのケース１に固定され
ている。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 to 3, a plate-shaped cushion material 2 such as an alumina substrate is placed on the bottom plate 1A of the case 1 as a mounting support through a plate-shaped cushion material 2 that easily transmits heat such as thermally conductive silicone rubber. A ceramic circuit board 3 is mounted. A conductive layer 4 is provided on the periphery of the upper surface of the ceramic circuit board 3 and also serves as a ground layer. A plurality of finger-shaped parts 5 of a plate-shaped holder 5 made of a spring metal such as phosphor bronze or beryllium copper are placed on these conductive layers 4.
Each A is fixed with 6 solders. Each holder 5 is fixed to the case 1 as a mounting support.
以上説明したように、本考案に係るセラミツク
回路基板の取付部においては、セラミツク回路基
板の上面の周縁部に導電層を設け、該導電層の上
にばね性金属よりなる板状のホルダの各フインガ
ー状部をそれぞれ半田付けで固定したので、該セ
ラミツク回路基板に反りがあつても、該セラミツ
ク回路基板に強い押圧力を与えなくとも確実に接
地することができる。従つて、接地を確実にとる
ためにセラミツク回路基板が割れてしまう事態を
回避することができる。また、半田付け部がセラ
ミツク回路基板の上面にあるので、接地が確実に
とれたか否かの確認を目視により容易に行うこと
ができる。更に、本考案のようにセラミツク回路
基板の周縁上部の導電層にホルダのフインガー状
部を半田付けして接地をとると、セラミツク回路
基板が小形化し、回路の高密度化、実装部品の小
形化が進んで、高い周波数帯で共振が発生し易く
なつても、その共振を起し易い部品の近くで接地
が容易に取れて、共振の発生を防止することがで
きる。かつまた、このようにセラミツク回路基板
の上面の導電層へホルダのフインガー状部を半田
付けすると、セラミツク回路基板の上面での半田
付けゆえ、半田付け作業を容易に行うことができ
る。更に、本考案では、セラミツク回路基板はク
ツシヨン材の上に載置され、しかもホルダのフイ
ンガー状部で固定されているので、振動を緩和す
ることができ、振動によるセラミツク回路基板の
破損を防止することがてきる。 As explained above, in the mounting part of the ceramic circuit board according to the present invention, a conductive layer is provided at the periphery of the upper surface of the ceramic circuit board, and each plate-shaped holder made of a spring metal is placed on the conductive layer. Since the finger-like portions are each fixed by soldering, even if the ceramic circuit board is warped, the ceramic circuit board can be reliably grounded without applying strong pressing force. Therefore, it is possible to avoid a situation where the ceramic circuit board is broken due to reliable grounding. Further, since the soldering portion is located on the top surface of the ceramic circuit board, it is possible to easily visually check whether or not the grounding has been established. Furthermore, if the finger-shaped part of the holder is grounded by soldering to the conductive layer on the upper part of the periphery of the ceramic circuit board as in the present invention, the ceramic circuit board can be made smaller, and the circuit density can be increased and the mounted components can be made smaller. Even if resonance becomes more likely to occur in a high frequency band due to the progress of the vibration, grounding can be easily established near components that are likely to cause resonance, and resonance can be prevented from occurring. Furthermore, by soldering the finger-like portions of the holder to the conductive layer on the upper surface of the ceramic circuit board in this manner, the soldering work can be easily performed because the soldering is performed on the upper surface of the ceramic circuit board. Furthermore, in the present invention, the ceramic circuit board is placed on the cushion material and is fixed by the finger-shaped parts of the holder, so vibrations can be alleviated and damage to the ceramic circuit board due to vibrations can be prevented. Something will happen.
図面は本考案に係るセラミツク回路基板の取付
部の一実施例を示したもので、第１図は縦断面
図、第２図はセラミツク回路基板とホルダとの関
係を示す斜視図、第３図はホルダのフインガー状
部の取付関係を示す拡大斜視図である。
１……取付支持体、２……クツシヨン材、３…
…セラミツク回路基板、４……導電層、５……ホ
ルダ、５Ａ……フインガー状部、６……半田。
The drawings show an embodiment of the mounting part of the ceramic circuit board according to the present invention, in which Fig. 1 is a longitudinal sectional view, Fig. 2 is a perspective view showing the relationship between the ceramic circuit board and the holder, and Fig. 3 is a perspective view showing the relationship between the ceramic circuit board and the holder. FIG. 2 is an enlarged perspective view showing the attachment relationship of the finger-shaped portions of the holder. 1...Mounting support body, 2...Cushion material, 3...
... Ceramic circuit board, 4 ... Conductive layer, 5 ... Holder, 5A ... Finger-shaped part, 6 ... Solder.
Claims (1)
ツク回路基板が載置され、前記セラミツク回路基
板の上面の周縁部に導電層が設けられ、該導電層
の上にばね性金属よりなる板状のホルダの各フイ
ンガー状部がそれぞれ半田付けで固定され、前記
ホルダは前記取付支持体に固定されていることを
特徴とするセラミツク回路基板の取付部。 A ceramic circuit board is placed on the mounting support via a cushion material, a conductive layer is provided on the periphery of the upper surface of the ceramic circuit board, and a plate-shaped holder made of a spring metal is placed on the conductive layer. A mounting portion for a ceramic circuit board, wherein each finger-shaped portion is fixed by soldering, and the holder is fixed to the mounting support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14448882U JPS5948071U (en) | 1982-09-24 | 1982-09-24 | Mounting part of ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14448882U JPS5948071U (en) | 1982-09-24 | 1982-09-24 | Mounting part of ceramic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948071U JPS5948071U (en) | 1984-03-30 |
| JPH0337265Y2 true JPH0337265Y2 (en) | 1991-08-07 |
Family
ID=30322193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14448882U Granted JPS5948071U (en) | 1982-09-24 | 1982-09-24 | Mounting part of ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948071U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0530386Y2 (en) * | 1985-03-13 | 1993-08-03 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528066U (en) * | 1975-07-03 | 1977-01-20 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6141279Y2 (en) * | 1978-10-09 | 1986-11-25 |
-
1982
- 1982-09-24 JP JP14448882U patent/JPS5948071U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528066U (en) * | 1975-07-03 | 1977-01-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948071U (en) | 1984-03-30 |
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