JPH0337234Y2 - - Google Patents
Info
- Publication number
- JPH0337234Y2 JPH0337234Y2 JP11876785U JP11876785U JPH0337234Y2 JP H0337234 Y2 JPH0337234 Y2 JP H0337234Y2 JP 11876785 U JP11876785 U JP 11876785U JP 11876785 U JP11876785 U JP 11876785U JP H0337234 Y2 JPH0337234 Y2 JP H0337234Y2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- dhd
- diode
- heat
- covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 239000002893 slag Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 229910052799 carbon Inorganic materials 0.000 description 13
- 239000011521 glass Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 230000003746 surface roughness Effects 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11876785U JPH0337234Y2 (US08080257-20111220-C00005.png) | 1985-07-31 | 1985-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11876785U JPH0337234Y2 (US08080257-20111220-C00005.png) | 1985-07-31 | 1985-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6228445U JPS6228445U (US08080257-20111220-C00005.png) | 1987-02-20 |
| JPH0337234Y2 true JPH0337234Y2 (US08080257-20111220-C00005.png) | 1991-08-07 |
Family
ID=31005533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11876785U Expired JPH0337234Y2 (US08080257-20111220-C00005.png) | 1985-07-31 | 1985-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337234Y2 (US08080257-20111220-C00005.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0759923B2 (ja) * | 1988-12-21 | 1995-06-28 | 株式会社日立製作所 | 弁駆動用アクチュエータ |
-
1985
- 1985-07-31 JP JP11876785U patent/JPH0337234Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6228445U (US08080257-20111220-C00005.png) | 1987-02-20 |
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