JPH0335832B2 - - Google Patents

Info

Publication number
JPH0335832B2
JPH0335832B2 JP60273073A JP27307385A JPH0335832B2 JP H0335832 B2 JPH0335832 B2 JP H0335832B2 JP 60273073 A JP60273073 A JP 60273073A JP 27307385 A JP27307385 A JP 27307385A JP H0335832 B2 JPH0335832 B2 JP H0335832B2
Authority
JP
Japan
Prior art keywords
cooling mechanism
heat sink
integrated circuit
solder
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60273073A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62131550A (ja
Inventor
Haruhiko Yamamoto
Yukihisa Katsuyama
Shunichi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60273073A priority Critical patent/JPS62131550A/ja
Priority to US06/914,942 priority patent/US4879632A/en
Priority to EP86307669A priority patent/EP0217676B1/en
Priority to DE86307669T priority patent/DE3688962T2/de
Publication of JPS62131550A publication Critical patent/JPS62131550A/ja
Priority to US07/079,877 priority patent/US4783721A/en
Priority to US07/079,876 priority patent/US4920574A/en
Priority to US07/261,904 priority patent/US5126919A/en
Publication of JPH0335832B2 publication Critical patent/JPH0335832B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60273073A 1985-10-04 1985-12-03 ヒ−トシンク着脱機構 Granted JPS62131550A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP60273073A JPS62131550A (ja) 1985-12-03 1985-12-03 ヒ−トシンク着脱機構
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/079,876 US4920574A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/261,904 US5126919A (en) 1985-10-04 1988-10-25 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60273073A JPS62131550A (ja) 1985-12-03 1985-12-03 ヒ−トシンク着脱機構

Publications (2)

Publication Number Publication Date
JPS62131550A JPS62131550A (ja) 1987-06-13
JPH0335832B2 true JPH0335832B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-05-29

Family

ID=17522766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60273073A Granted JPS62131550A (ja) 1985-10-04 1985-12-03 ヒ−トシンク着脱機構

Country Status (1)

Country Link
JP (1) JPS62131550A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241639B2 (ja) * 1997-06-30 2001-12-25 日本電気株式会社 マルチチップモジュールの冷却構造およびその製造方法
JP6410920B2 (ja) * 2015-03-10 2018-10-24 三菱電機株式会社 電力変換装置及び冷凍サイクル装置

Also Published As

Publication number Publication date
JPS62131550A (ja) 1987-06-13

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