JPH0334276A - Socket device for ic mounting - Google Patents

Abstract

PURPOSE:To absorb the noise in the signal fed to the IC by forming a penetration capacitor with a metal pin, a derivative, and a conductive member. CONSTITUTION:When a sharp pulse type noise is mixed in the signal on a base 3, the noise in the signal is released into a metal tube 6 by a penetration capacitor which is formed of a metal pin 1, a derivative 5, and the metal tube 6, to form a socket, in the process to feed the signal to the lead of the IC through a socket device, and it is not reached directly to the lead of the IC. The noise released in the metal tube 6 is bypassed to an earth signal wire on the base 3 from an earthing wiring 7 through a dielectric type metal member 4 to form the socket device. As a result, only the pulse type noise mixed in the signal can be bypassed efficiently, and released to the earthing member on the base.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC mounting socket device used for mounting a semiconductor integrated circuit (hereinafter referred to as IC) on a substrate.

[Conventional technology]

FIG. 2 is a diagram showing a conventional socket device for mounting an IC of this kind. In the figure, reference numeral 1 indicates a metal pin forming the socket device, which has a hole 11 into which an IC lead (not shown) is attached, and a leg 12 to be fixed to the board. , 2 is an insulating member made of glass, epoxy or plastic that fixes the metal pin 1 and forms a socket device, and 3 is a substrate having through holes 31 that fix the legs 12 of the metal pin 1.

[Problem to be solved by the invention]

In this conventional socket device used to mount an IC on a board, a signal on the board 3 is taken in through a through hole and supplied directly to the IC lead through a metal pin 1. Therefore, a signal mixed with pulse noise is directly supplied to the IC lead while containing the noise, and this pulse noise may cause the IC to malfunction.

This invention was made to improve this problem, and it is designed to prevent the socket device itself from absorbing pulse noise when the signal supplied to the IC contains pulse noise. purpose.

[Means to solve the problem]

The IC mounting socket device according to the present invention is configured to be mounted on a board on which electronic components are arranged, and to support a metal pin on which an IC is mounted with a conductive member via a dielectric. Noise in the signal is absorbed by a feedthrough capacitor formed by a pin, a dielectric material, and a conductive member.

[Effect]

The IC mounting socket device according to the present invention is capable of absorbing pulse noise mixed in signals on the board by a feed-through capacitor formed by a metal pin, a dielectric material, and a conductive member. does not require any parts, does not unnecessarily increase the number of parts on the board, and does not increase the mounting area.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. In other words, in Fig. 1, 4 is Nke!・A conductive metal member 5 forming the device is attached to the metal part N4 by a conductive metal cylinder 6 placed around the metal pin 1, and a feedthrough capacitor is connected between the metal pin 1 and gold X#6. The dielectric material 7 is a ground wire for dissipating pulsed noise absorbed from the signal from the socket device to the ground signal on the board.

Note that the other ellipsoids are the same as the conventional one shown in FIG. 2, so their explanation will be omitted.

With this configuration, if sharp pulse noise is mixed into the signal on the board, the noise in the signal will form a socket in the process of supplying the signal to the IC lead via the socket device. metal pin 1 and dielectric 5
It escapes to the metal tube 6 by the feed-through capacitor formed by the metal tube 6 and does not reach the IC leads directly.
The noise released to the metal frJ6 is bypassed from the ground wiring 7 to the ground signal line on the board via the dielectric metal member 4 forming the socket device.

Therefore, only the pulse noise mixed in the signal can be efficiently bypassed and released to the ground portion on the board.

Further, by providing the feedthrough capacitor inside the socket device, no external parts are required, and the number of parts on the board is not increased unnecessarily and the mounting area is not increased.

〔Effect of the invention〕

As described above, the IC mounting socket device according to the present invention has a feedthrough capacitor formed in the socket itself, so it can efficiently absorb pulse noise mixed in signals on the board, and has a simple structure. No increase in mounting area.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a main part showing an embodiment of the present invention, and FIG. 2 is a sectional view of a main part of a conventional IC mounting socket device. In the figure, 1 is a metal pin, 11 is a hole, 12 is a leg, 3 is a substrate, 4 is a metal member, 5 is a dielectric, 6 is a metal tube, and 7 is a ground wire. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] A metal pin is removably attached to a substrate on which an electronic component is arranged and an IC is attached thereto, and a conductive member that supports the metal pin via a dielectric, and the metal pin, the dielectric, and the conductive member are connected to each other. An IC mounting socket device formed by forming a feedthrough capacitor that absorbs noise in signals.