JPH0334258U - - Google Patents
Info
- Publication number
- JPH0334258U JPH0334258U JP1989094568U JP9456889U JPH0334258U JP H0334258 U JPH0334258 U JP H0334258U JP 1989094568 U JP1989094568 U JP 1989094568U JP 9456889 U JP9456889 U JP 9456889U JP H0334258 U JPH0334258 U JP H0334258U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead wire
- emitting diode
- reflective wall
- diode lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989094568U JPH0741170Y2 (ja) | 1989-08-11 | 1989-08-11 | 発光ダイオードランプ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989094568U JPH0741170Y2 (ja) | 1989-08-11 | 1989-08-11 | 発光ダイオードランプ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0334258U true JPH0334258U (enFirst) | 1991-04-04 |
| JPH0741170Y2 JPH0741170Y2 (ja) | 1995-09-20 |
Family
ID=31643889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989094568U Expired - Lifetime JPH0741170Y2 (ja) | 1989-08-11 | 1989-08-11 | 発光ダイオードランプ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741170Y2 (enFirst) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49103388U (enFirst) * | 1972-12-27 | 1974-09-05 | ||
| JPS5571569U (enFirst) * | 1978-11-07 | 1980-05-16 | ||
| JPS5621471U (enFirst) * | 1979-07-24 | 1981-02-25 | ||
| JPS5839063U (ja) * | 1981-09-08 | 1983-03-14 | 三洋電機株式会社 | 全色発光半導体装置 |
| JPS60102775A (ja) * | 1983-11-09 | 1985-06-06 | Toshiba Corp | 発光表示装置 |
| JPS6151763U (enFirst) * | 1984-09-10 | 1986-04-07 | ||
| JPS61179003A (ja) * | 1985-02-04 | 1986-08-11 | スタンレー電気株式会社 | 車両用灯具の光源 |
| JPS624380A (ja) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | 発光ダイオ−ド装置 |
| JPH0192684U (enFirst) * | 1987-12-10 | 1989-06-16 | ||
| JPH01157577A (ja) * | 1987-12-14 | 1989-06-20 | Mini Pairo Denki:Kk | 半導体発光装置 |
-
1989
- 1989-08-11 JP JP1989094568U patent/JPH0741170Y2/ja not_active Expired - Lifetime
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49103388U (enFirst) * | 1972-12-27 | 1974-09-05 | ||
| JPS5571569U (enFirst) * | 1978-11-07 | 1980-05-16 | ||
| JPS5621471U (enFirst) * | 1979-07-24 | 1981-02-25 | ||
| JPS5839063U (ja) * | 1981-09-08 | 1983-03-14 | 三洋電機株式会社 | 全色発光半導体装置 |
| JPS60102775A (ja) * | 1983-11-09 | 1985-06-06 | Toshiba Corp | 発光表示装置 |
| JPS6151763U (enFirst) * | 1984-09-10 | 1986-04-07 | ||
| JPS61179003A (ja) * | 1985-02-04 | 1986-08-11 | スタンレー電気株式会社 | 車両用灯具の光源 |
| JPS624380A (ja) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | 発光ダイオ−ド装置 |
| JPH0192684U (enFirst) * | 1987-12-10 | 1989-06-16 | ||
| JPH01157577A (ja) * | 1987-12-14 | 1989-06-20 | Mini Pairo Denki:Kk | 半導体発光装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741170Y2 (ja) | 1995-09-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |