JPH0334258U - - Google Patents

Info

Publication number
JPH0334258U
JPH0334258U JP1989094568U JP9456889U JPH0334258U JP H0334258 U JPH0334258 U JP H0334258U JP 1989094568 U JP1989094568 U JP 1989094568U JP 9456889 U JP9456889 U JP 9456889U JP H0334258 U JPH0334258 U JP H0334258U
Authority
JP
Japan
Prior art keywords
light emitting
lead wire
emitting diode
reflective wall
diode lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989094568U
Other languages
Japanese (ja)
Other versions
JPH0741170Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989094568U priority Critical patent/JPH0741170Y2/en
Publication of JPH0334258U publication Critical patent/JPH0334258U/ja
Application granted granted Critical
Publication of JPH0741170Y2 publication Critical patent/JPH0741170Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図と第２図は本考案実施例にかかる発光ダ
イオードランプの側面断面図ａと平面断面図ｂ、
第３図は他の実施例にかかる平面図ａと等価回路
図ｂである。 １０，１１，１２……リード線、２１，２２，
２３……反射壁、６０，６１，６２……樹脂。 1 and 2 are a side sectional view a and a plan sectional view b of a light emitting diode lamp according to an embodiment of the present invention,
FIG. 3 is a plan view a and an equivalent circuit diagram b of another embodiment. 10, 11, 12... Lead wire, 21, 22,
23... Reflective wall, 60, 61, 62... Resin.

Claims (1)

【実用新案登録請求の範囲】 １ ランプ外壁に近接した反射壁を有するリード
線と、そのリード線の近傍に配置された複数の配
線用リード線と、リード線の前記反射壁近傍に載
置され前記複数の配線用リード線に配線が施され
た色の異なる複数の発光ダイオードと、少なくと
もリード線の一部と発光ダイオードとを覆い、略
円形の表示面を有した透光性の樹脂とを具備した
ことを特徴とする発光ダイオードランプ。 ２ 前記リード線の反射壁は、配線用リード線側
を解放してなり、前記配線用リード線は前記反射
壁と連なる側壁を具備したことを特徴とする請求
項１項記載の発光ダイオードランプ。 ３ 前記リード線の反射壁は全てのリード線にま
たがつて設けられた樹脂成形品からなり、前記発
光ダイオードは略同じ波長の短波長発光ダイオー
ドが複数含まれていることを特徴とする請求項１
項記載の発光ダイオードランプ。 ４ 前記リード線の反射壁はリード線の整列方向
に対し傾斜した方向に長軸を有する略楕円形をな
し、前記発光ダイオードは同じ発光色のものが前
記略楕円形の長軸の両端近傍に配置されているこ
とを特徴とする請求項１項記載の発光ダイオード
ランプ。[Claims for Utility Model Registration] 1. A lead wire having a reflective wall close to the outer wall of the lamp, a plurality of wiring lead wires placed near the lead wire, and a lead wire placed near the reflective wall of the lead wire. A plurality of light emitting diodes of different colors wired on the plurality of wiring lead wires, and a translucent resin covering at least a portion of the lead wires and the light emitting diodes and having a substantially circular display surface. A light emitting diode lamp characterized by: 2. The light emitting diode lamp according to claim 1, wherein the reflective wall of the lead wire has a wiring lead wire side open, and the wiring lead wire has a side wall continuous with the reflective wall. 3. The reflective wall of the lead wire is made of a resin molded product provided across all the lead wires, and the light emitting diodes include a plurality of short wavelength light emitting diodes having substantially the same wavelength. 1
Light-emitting diode lamp as described in section. 4. The reflective wall of the lead wire has a substantially elliptical shape having a long axis in a direction inclined with respect to the direction in which the lead wires are aligned, and the light emitting diodes have the same luminescent color near both ends of the long axis of the substantially elliptical shape. 2. The light emitting diode lamp according to claim 1, further comprising a light emitting diode lamp.
JP1989094568U 1989-08-11 1989-08-11 Light emitting diode lamp Expired - Lifetime JPH0741170Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989094568U JPH0741170Y2 (en) 1989-08-11 1989-08-11 Light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989094568U JPH0741170Y2 (en) 1989-08-11 1989-08-11 Light emitting diode lamp

Publications (2)

Publication Number Publication Date
JPH0334258U true JPH0334258U (en) 1991-04-04
JPH0741170Y2 JPH0741170Y2 (en) 1995-09-20

Family

ID=31643889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989094568U Expired - Lifetime JPH0741170Y2 (en) 1989-08-11 1989-08-11 Light emitting diode lamp

Country Status (1)

Country Link
JP (1) JPH0741170Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136224A (en) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd Light-emitting diode illumination module

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49103388U (en) * 1972-12-27 1974-09-05
JPS5571569U (en) * 1978-11-07 1980-05-16
JPS5621471U (en) * 1979-07-24 1981-02-25
JPS5839063U (en) * 1981-09-08 1983-03-14 三洋電機株式会社 Full color light emitting semiconductor device
JPS60102775A (en) * 1983-11-09 1985-06-06 Toshiba Corp Emitted light indicator
JPS6151763U (en) * 1984-09-10 1986-04-07
JPS61179003A (en) * 1985-02-04 1986-08-11 スタンレー電気株式会社 Light source for vehicle lamp apparatus
JPS624380A (en) * 1985-06-29 1987-01-10 Toshiba Corp Light emitting diode device
JPH0192684U (en) * 1987-12-10 1989-06-16
JPH01157577A (en) * 1987-12-14 1989-06-20 Mini Pairo Denki:Kk Semiconductor light emitting device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49103388U (en) * 1972-12-27 1974-09-05
JPS5571569U (en) * 1978-11-07 1980-05-16
JPS5621471U (en) * 1979-07-24 1981-02-25
JPS5839063U (en) * 1981-09-08 1983-03-14 三洋電機株式会社 Full color light emitting semiconductor device
JPS60102775A (en) * 1983-11-09 1985-06-06 Toshiba Corp Emitted light indicator
JPS6151763U (en) * 1984-09-10 1986-04-07
JPS61179003A (en) * 1985-02-04 1986-08-11 スタンレー電気株式会社 Light source for vehicle lamp apparatus
JPS624380A (en) * 1985-06-29 1987-01-10 Toshiba Corp Light emitting diode device
JPH0192684U (en) * 1987-12-10 1989-06-16
JPH01157577A (en) * 1987-12-14 1989-06-20 Mini Pairo Denki:Kk Semiconductor light emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136224A (en) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd Light-emitting diode illumination module

Also Published As

Publication number Publication date
JPH0741170Y2 (en) 1995-09-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term