JPH0333072Y2 - - Google Patents
Info
- Publication number
- JPH0333072Y2 JPH0333072Y2 JP2775085U JP2775085U JPH0333072Y2 JP H0333072 Y2 JPH0333072 Y2 JP H0333072Y2 JP 2775085 U JP2775085 U JP 2775085U JP 2775085 U JP2775085 U JP 2775085U JP H0333072 Y2 JPH0333072 Y2 JP H0333072Y2
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- fin
- fin mounting
- fins
- tubular body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 description 6
- 239000003507 refrigerant Substances 0.000 description 6
- 238000005219 brazing Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2775085U JPH0333072Y2 (US20100012521A1-20100121-C00001.png) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2775085U JPH0333072Y2 (US20100012521A1-20100121-C00001.png) | 1985-02-27 | 1985-02-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61144651U JPS61144651U (US20100012521A1-20100121-C00001.png) | 1986-09-06 |
JPH0333072Y2 true JPH0333072Y2 (US20100012521A1-20100121-C00001.png) | 1991-07-12 |
Family
ID=30524988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2775085U Expired JPH0333072Y2 (US20100012521A1-20100121-C00001.png) | 1985-02-27 | 1985-02-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0333072Y2 (US20100012521A1-20100121-C00001.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2944377B2 (ja) * | 1993-08-25 | 1999-09-06 | 日本電気株式会社 | 放熱フィン及び放熱フィンを備えた半導体装置 |
-
1985
- 1985-02-27 JP JP2775085U patent/JPH0333072Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61144651U (US20100012521A1-20100121-C00001.png) | 1986-09-06 |