JPH033256A - Method of correcting warp of cap - Google Patents
Method of correcting warp of capInfo
- Publication number
- JPH033256A JPH033256A JP1136584A JP13658489A JPH033256A JP H033256 A JPH033256 A JP H033256A JP 1136584 A JP1136584 A JP 1136584A JP 13658489 A JP13658489 A JP 13658489A JP H033256 A JPH033256 A JP H033256A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- recess
- corners
- flange
- warpage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 19
- 239000002184 metal Substances 0.000 claims abstract description 8
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は半導体装置などに用いられるキャップの製造時
に生じるキャップの反り矯正方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for correcting warpage of a cap that occurs during manufacturing of a cap used for a semiconductor device or the like.
（従来技術）
半導体装置には、パッケージに半導体チップを搭載した
後、半導体チップ搭載部を金属層のキャップにより気密
封止して提供されるものがある。(Prior Art) Some semiconductor devices are provided by mounting a semiconductor chip on a package and then hermetically sealing the semiconductor chip mounting portion with a cap made of a metal layer.
この気密封止する際に用いられるキャップには、平板状
のものなど種々のタイプがあるが、第２図に示すように
半導体チップ搭載部などに対応する中央部の平面形状が
矩形状に隆起し、周縁部が同様に矩形状に平坦なフラン
ジとして形成された断面形状が浅い皿状のキャップがあ
る。この隆起部を有するキャップは金属板を絞り加工す
ることによって製造される。There are various types of caps used for this airtight sealing, including flat ones, but as shown in Figure 2, the planar shape of the central part corresponding to the semiconductor chip mounting area is raised in a rectangular shape. However, there is also a dish-shaped cap with a shallow cross-sectional shape and a peripheral edge formed as a flat rectangular flange. The cap having this raised portion is manufactured by drawing a metal plate.
（発明が解決しようとする課！ｆｌ）
ところが、上記のような絞り加工によって製造されるキ
ャップでは、絞り加工した際、隆起部の四隅に加工歪み
が集中する結果、この歪みによる応力がフランジに作用
して、キャップに反りが発生する。たとえば、キャップ
の外形が２５ｍｍ角で板厚が０．２市の場合、絞り加工
後に生じる反りは１５０〜３５０μｍ程度で、このまま
ではキャップとして使えない。(Problem to be solved by the invention!fl) However, in a cap manufactured by drawing as described above, processing strain concentrates on the four corners of the raised part during drawing, and stress due to this distortion is applied to the flange. This causes the cap to warp. For example, if the outer diameter of the cap is 25 mm square and the plate thickness is 0.2 mm, the warpage that occurs after drawing is about 150 to 350 μm, and it cannot be used as a cap as it is.
そこで１本発明は上記問題点を解消すべくなされたもの
であり、その目的とするところは、絞り加工によって製
造するキャップの絞り加工時に生じる反りを効果的に矯
正することのできるキャップの反り矯正方法を提供しよ
うとするものである。Therefore, the present invention has been made to solve the above-mentioned problems, and its purpose is to correct warpage of caps that can effectively correct the warpage that occurs during the drawing process of caps manufactured by drawing process. It is intended to provide a method.
（課題を解決するための手段） 本発明は上記目的を達成するため次の構成をそなえる。(Means for solving problems) The present invention has the following configuration to achieve the above object.
すなわち、金属板を絞り加工して平面形状が矩形状に隆
起する隆起部と、該隆起部の周縁部に矩形状のフランジ
を設けたキャップを製造するにあたり、前記絞り加工を
施した後、前記隆起部の四隅を隆起部の上方からヒツト
フオーム（打圧成形）することにより、絞り加工時に隆
起部の四隅に生じた歪みを緩和することを特徴とする。That is, in manufacturing a cap having a protruding portion having a rectangular planar shape by drawing a metal plate and a rectangular flange provided on the peripheral edge of the protruding portion, after performing the drawing process, the It is characterized in that the four corners of the raised part are press-formed from above the raised part to alleviate the distortion that occurs at the four corners of the raised part during the drawing process.
（′作用）
金属板を絞り加工した後、キャップの隆起部の四隅をヒ
ツトフオームすることにより、隆起部の四隅の歪みが緩
和でき、周縁部のフランジ部分の反りを矯正することが
できる。('Function) After the metal plate is drawn, the four corners of the protruding portion of the cap are human-formed, so that the distortion at the four corners of the protruding portion can be alleviated, and the warpage of the flange portion of the peripheral portion can be corrected.
（実施例）
以下本発明の好適な実施例を添付図面に基づいて詳細に
説明する。(Embodiments) Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
第１図は本発明方法を説明する説明図で、１０は本発明
方法によって矯正したキャップ、１２は矯正に用いるポ
ンチである。FIG. 1 is an explanatory diagram for explaining the method of the present invention, where 10 is a cap that has been straightened by the method of the present invention, and 12 is a punch used for straightening.
キャップ１０は全体形状が矩形状に形成され、その中央
部に隆起部１２が形成されている。キャップ１０は金属
板を絞り加工して得たもので、隆起部１２はキャップ１
０の中央部に矩形状に隆起する。隆起部１２の周縁部に
は矩形状にフランジ１４が形成される。第２図はキャッ
プ１０をパッケージに接合した状態を示すが、図のよう
に隆起部１２は半導体チップ搭載部などに対応して設け
られ、フランジ１４はパッケージの上端周縁部にはんだ
などにより気密に接合される。キャップ１０の断面形状
は図のように浅い皿状である。The cap 10 has a rectangular overall shape, and a raised portion 12 is formed in the center thereof. The cap 10 is obtained by drawing a metal plate, and the raised portion 12 is the same as the cap 1.
There is a rectangular bulge in the center of 0. A rectangular flange 14 is formed at the peripheral edge of the raised portion 12 . FIG. 2 shows the state in which the cap 10 is bonded to the package. As shown in the figure, the raised portion 12 is provided to correspond to the semiconductor chip mounting area, and the flange 14 is attached to the upper edge of the package to make it airtight. Joined. The cross-sectional shape of the cap 10 is a shallow dish-like shape as shown in the figure.
絞り加工後のキャップは、第３図に示すように、隆起部
１２の四隅の絞り部分に歪みが集中する結果、フランジ
１４の端縁部が隆起部１２側へ接近する方向に反りが生
じる。As shown in FIG. 3, in the drawn cap, distortion is concentrated in the drawn portions at the four corners of the raised portion 12, and as a result, the end edge of the flange 14 is warped in the direction toward the raised portion 12.
第１図で１６はこのキャップに生じた反りを解消するた
めに用いるポンチで、ポンチ１６の下面の四隅には、上
記隆起部１２の四隅位置に対応して、下方に突出する小
突起１８を設ける。In FIG. 1, reference numeral 16 denotes a punch used to eliminate the warpage that has occurred in the cap. At the four corners of the lower surface of the punch 16, there are small protrusions 18 that protrude downward, corresponding to the four corner positions of the raised portions 12. establish.
絞り加工後のキャップの隆起部１２の四隅の位置とポン
チ１６の小突起１８の位置を位置合わせし、隆起部１２
の上方からポンチ１６によってヒツトフオームすると、
隆起部１２およびフランジ１４の反りが矯正され、第１
図に示すキャップ１０のように反りが矯正されたキャッ
プが得られる。Align the positions of the four corners of the raised part 12 of the cap after drawing with the position of the small projections 18 of the punch 16, and
When punched from above by the punch 16,
The warpage of the raised portion 12 and the flange 14 is corrected, and the first
A cap whose warp is corrected like the cap 10 shown in the figure is obtained.
図で２０は小突起１８が隆起部１２の四隅にあたったこ
とによって形成された圧痕（へこみ）である。In the figure, numerals 20 indicate impressions (dents) formed by the small protrusions 18 hitting the four corners of the raised portion 12.
上記のように隆起部１２をヒツトフオームすることによ
って反りを矯正する方法によれば、たとえば、前述のキ
ャップの場合、矯正後のキャップの反りは３０〜４０μ
ｍ程度に矯正することができた。According to the method of correcting warpage by human forming the raised portion 12 as described above, for example, in the case of the above-mentioned cap, the warpage of the cap after correction is 30 to 40μ.
I was able to correct it to about m.
このように上記の隆起部をヒツトフオームする方法によ
れば、きわめて容易にキャップの反りを矯正することが
できる。これは、絞り加工によってもっとも歪みが集中
している隆起部１２の四隅を打圧することによって、隆
起部１２の歪みを効果的に緩和することができるととも
に、ポンチ１６による隆起部１２の歪みの矯正効果が周
縁部のフランジ１４にまで及んで、全体的に効果的な反
り矯正がなされる。According to the above-mentioned method of human-forming the raised portion, warpage of the cap can be corrected very easily. By pressing the four corners of the raised part 12 where the distortion is most concentrated during the drawing process, the distortion of the raised part 12 can be effectively alleviated, and the distortion of the raised part 12 can be corrected by the punch 16. The effect extends to the peripheral flange 14, resulting in effective warpage correction as a whole.
また、上記の矯正方法では、ヒツトフオームするポンチ
１６がじかに当たるのは隆起部１２だけであってフラン
ジ１４にはじかに当たらないから、キャップの接合面で
あるフランジ１４を傷めたりする心配がなく、好適な接
合面が得られる。In addition, in the above straightening method, since the punch 16 that hits the human form directly hits only the raised portion 12 and does not directly hit the flange 14, there is no fear of damaging the flange 14, which is the joint surface of the cap, and it is suitable. A good bonding surface can be obtained.
第２図はパッケージに上記キャップ１０を接合して気密
封止した状態を示すが、キャップ１０の反りが大幅に矯
正されることによって、キャップ封止がより的確になさ
れる。FIG. 2 shows a state in which the cap 10 is joined to the package and hermetically sealed. The cap 10 can be sealed more accurately by significantly correcting the warpage of the cap 10.
なお、隆起部の中央部にヒートシンク接合などのための
開口部を設けたキャップであっても、上記と同様にして
絞り加工時の反りを矯正することができる。Note that even in the case of a cap in which an opening for heat sink bonding or the like is provided in the center of the raised portion, warping during drawing can be corrected in the same manner as described above.
以上、本発明について好適な実施例を挙げて種々説明し
たが、本発明はこの実施例に限定されるものではなく５
種々のタイプの半導体装置に同様に適用できるものであ
って、発明の精神を逸脱しない範囲内で多くの改変を施
し得るのはもちろんのことである。The present invention has been variously explained above using preferred embodiments, but the present invention is not limited to these embodiments.
It goes without saying that the invention can be similarly applied to various types of semiconductor devices, and that many modifications can be made without departing from the spirit of the invention.
（発明の効果）
上述したように、本発明に係るキャップの反り矯正方法
によれば、キャップの隆起部の四隅をポンチでヒツトフ
オームすることによって絞り加工により生じたキャップ
の反りをきわめて効果的に矯正することができる。また
、本発明に係る方法は、キャップの隆起部をヒツトフオ
ームするという簡易な方法であるから、矯正作業も容易
にできる等の著効を奏する。(Effects of the Invention) As described above, according to the cap warpage correction method according to the present invention, by punching the four corners of the protruding portion of the cap, warpage of the cap caused by drawing can be corrected very effectively. can do. Further, since the method according to the present invention is a simple method of human forming the protruding portion of the cap, it is effective in facilitating the correction work.
第１図は本発明方法を示す説明図、第２図はキャップを
パッケージに接合した状態を示す説明図、第３図は絞り
加工後のキャップの反りを示す説明図である。
１０・・・キャップ、 １２・・・隆起部。
１４・・・フランジ、 １６・・・ポンチ、１８ ・
・
・小突起。
２０・・・圧痕。FIG. 1 is an explanatory diagram showing the method of the present invention, FIG. 2 is an explanatory diagram showing a state in which a cap is joined to a package, and FIG. 3 is an explanatory diagram showing warpage of the cap after drawing. 10... Cap, 12... Protuberance. 14...Flange, 16...Punch, 18・
・・Small protrusion. 20...Indentation.
Claims (1)
隆起部と、該隆起部の周縁部に矩形状のフランジを設け
たキャップを製造するにあたり、 前記絞り加工を施した後、前記隆起部の四 隅を隆起部の上方からヒットフォームすることにより、
絞り加工時に隆起部の四隅に生じた歪みを緩和すること
を特徴とするキャップの反り矯正方法。[Claims] 1. In manufacturing a cap having a protruding portion having a rectangular planar shape by drawing a metal plate, and a rectangular flange on the peripheral edge of the protruding portion, the drawing process includes: After applying, hit form the four corners of the raised part from above the raised part,
A method for correcting warpage of a cap, which is characterized by alleviating distortions generated at the four corners of a raised part during drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1136584A JP2710987B2 (en) | 1989-05-30 | 1989-05-30 | Cap warp straightening method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1136584A JP2710987B2 (en) | 1989-05-30 | 1989-05-30 | Cap warp straightening method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH033256A true JPH033256A (en) | 1991-01-09 |
| JP2710987B2 JP2710987B2 (en) | 1998-02-10 |
Family
ID=15178700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1136584A Expired - Fee Related JP2710987B2 (en) | 1989-05-30 | 1989-05-30 | Cap warp straightening method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2710987B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50144425A (en) * | 1974-05-08 | 1975-11-20 | ||
| US9718384B2 (en) | 2014-08-13 | 2017-08-01 | Grammer Ag | Vehicle seat with adjustable backrest |
| US9827881B2 (en) | 2014-08-13 | 2017-11-28 | Grammer Ag | Vehicle seat with adjustable backrest |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4815402U (en) * | 1971-06-29 | 1973-02-21 |
-
1989
- 1989-05-30 JP JP1136584A patent/JP2710987B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4815402U (en) * | 1971-06-29 | 1973-02-21 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50144425A (en) * | 1974-05-08 | 1975-11-20 | ||
| JPS5513480B2 (en) * | 1974-05-08 | 1980-04-09 | ||
| US9718384B2 (en) | 2014-08-13 | 2017-08-01 | Grammer Ag | Vehicle seat with adjustable backrest |
| US9827881B2 (en) | 2014-08-13 | 2017-11-28 | Grammer Ag | Vehicle seat with adjustable backrest |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2710987B2 (en) | 1998-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |