JPH0331485A - Enameled substrate and thermal head or circuit parts using the same - Google Patents
Enameled substrate and thermal head or circuit parts using the sameInfo
- Publication number
- JPH0331485A JPH0331485A JP16467189A JP16467189A JPH0331485A JP H0331485 A JPH0331485 A JP H0331485A JP 16467189 A JP16467189 A JP 16467189A JP 16467189 A JP16467189 A JP 16467189A JP H0331485 A JPH0331485 A JP H0331485A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- substrate
- thermal head
- softening point
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 39
- 239000000945 filler Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000010419 fine particle Substances 0.000 claims abstract description 5
- 210000003298 dental enamel Anatomy 0.000 claims description 17
- 239000000843 powder Substances 0.000 abstract description 6
- 239000011230 binding agent Substances 0.000 abstract description 3
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 3
- 239000010935 stainless steel Substances 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 238000010304 firing Methods 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明番友 回路基板 サーマルヘッド用基板等に用
いるほうろう基板及びそれを用いたサーマルヘラK 回
路部品に関すも
従来の技術
従来のほうろう基板はステンレ入 はうろう用鋼板など
の金属基板に非晶質ガラスまたは結晶化ガラスの粉末を
、印釈 重職 スプレー デイツプなどの方法で付着さ
せ、焼成したものであり、該基板の表面粗さ(亀 中心
線平均粗さRaで0.15〜0.3μmであっ九
発明が解決しようとする課題
しかし 従来例によるほうろう基板(よ アルミナグレ
ーズ基板−に比べる゛とまだ表面粗さが大きく、該はう
ろう基板表面へ 電板 抵抗体などからなるサーマルヘ
ッドの導電回路を形成すると、抵抗値のバラツキも大き
いものであっt。[Detailed Description of the Invention] Industrial Field of Application Companion of the Invention Circuit board Enamel board used for thermal head board etc. and thermal spatula K using the same Conventional technology related to circuit parts Conventional enamel board is made of stainless steel. Powder of amorphous glass or crystallized glass is applied to a metal substrate such as a steel plate for coating by a method such as printing, spraying, dip, etc., and then fired. However, the surface roughness is still large compared to the conventional enamel substrate (or alumina glaze substrate), and the surface roughness of the enamel substrate is 0.15 to 0.3 μm. When forming a conductive circuit for a thermal head consisting of a resistor or the like, there is a large variation in the resistance value.
発明者らは該基板の表面粗さを小さくするたへ前記ガラ
スフリットとして非晶質ガラスを用いたほうろう基板を
対象として、種々の試みを行なっ九 その結果焼成温度
を上げれば表面粗さを小さくできることがわかったが、
反面金属基板の所定の位置圏 所定の面積でガラス膜を
形成したのにもかかわら負 ガラスの表面張力のたべ
焼成後のガラス膜の面積が小さくなるという問題点がで
てき島
本発明は このような従来技術の課題を解決することを
目的とすa
課題を解決するための手段
本発明(友 金属基板上へ フィラーを含むガラス膜を
形成してなり、前記フィラー低 前記ガラス膜のガラス
の軟化点より、高い軟化点を有するガラス微粒子である
ことを特徴とすム
作用
本発明のようく フィラーを含むガラス膜を所定の面積
で形成した場合、焼成時に軟化点の低いガラスが流動す
る際&ζ 軟化点の高いフィラーパ軟化点の低いガラス
の表面張力を抑制するの℃焼成後のガラス膜の面積が小
さくならな(〜実施例
以下&−本発明の実施例について図面を参照しながら説
明すも
〈実施例1〉
図に示したようjQ 350メツシユアンダーの軟化
点714℃のガラス(市販例: CGW8445)粉末
く フィラー2として350メツシユアンダーの軟化点
870℃のガラス(市販例: CGWO317)粉末を
20%添加したものを、有機溶孤 バインダーとともに
ボールミルにて5時間ミル引きしてペーストを作り、厚
さ2mmのステンレス鋼板l上に塗布し 乾燥し丸これ
を950℃で10分間焼成し ガラス膜3が形成された
ほうろう基板を得た ガラス膜3の厚みは0.0511
& 大きさは110X90がとした このようにして
作成したガラス膜上く 図に示すような構成断面を有す
るサーマルヘッドを試作しt、、 4は電板5は発熱
抵抗体 6はオーバーコート層であも〈実施例2〉
図に示したよう一350メツシュアンダーの軟化点74
3℃のガラス(市販例: HOYAZnCl)粉末く
350メツシユアンダーの軟化点870℃のガラス(市
販例:CGWO317)粉末2を20%添加したものを
、有機溶塩 バインダーとともにボールミルにて5時
間ミル引きしてペーストを作りミ 厚さ2nのステンレ
ス鋼板l上に塗布し 乾燥した これを950℃で10
分間焼成し はうろう基板を得島 それ以外は実施例1
と同様にしてサーマルヘッドを試作し九〈比較例1.2
〉
実施例1.2においてフィラーを添加しないでほうろう
基板を得た この際焼成後のガラス膜の面積が実施例1
においては12敢 実施例2においては8x収縮したの
でサーマルヘッドは試作しなかった
く比較例3〉
従来例のほうろう基板の例として文献(Am。In order to reduce the surface roughness of the substrate, the inventors have made various attempts on enamel substrates using amorphous glass as the glass frit. As a result, the surface roughness can be reduced by increasing the firing temperature. I found out that it can be done, but
On the other hand, even though a glass film was formed in a predetermined area on a metal substrate, the surface tension of the glass was negative.
A problem arises in that the area of the glass film after firing becomes small.The purpose of the present invention is to solve the problems of the prior art. A glass film containing a filler is formed, and the filler is glass fine particles having a softening point higher than the softening point of the glass of the glass film. When a glass with a low softening point flows during firing, a filler with a high softening point suppresses the surface tension of the glass with a low softening point. (Examples below &- Examples of the present invention will be described with reference to the drawings. Example 1 As shown in the figure, jQ 350 mesh under glass (commercial example: CGW8445) powder with a softening point of 714°C As filler 2, 20% of 350 mesh under glass (commercial example: CGWO317) powder with a softening point of 870°C was added and milled with an organic melt binder in a ball mill for 5 hours to make a paste. It was applied onto a 2 mm stainless steel plate, dried, and baked at 950°C for 10 minutes to obtain an enamel substrate on which the glass film 3 was formed. The thickness of the glass film 3 was 0.0511.
& The size was 110 x 90. On top of the glass film created in this way, a thermal head having a cross section as shown in the figure was fabricated as a prototype. 4 is an electric plate 5 is a heating resistor, and 6 is an overcoat layer. Amo〈Example 2〉 As shown in the figure, the softening point of 1350 mesh under is 74.
Glass (commercial example: HOYAZnCl) powder at 3℃
350 mesh under glass with a softening point of 870°C (commercial example: CGWO317) powder 2 added at 20% was milled with an organic salt binder in a ball mill for 5 hours to make a paste. It was applied onto a steel plate and dried at 950℃ for 10 minutes.
The rest is Example 1.
A thermal head was prototyped in the same manner as 9. Comparative Example 1.2
〉 An enamel substrate was obtained without adding filler in Example 1.2. At this time, the area of the glass film after firing was the same as that of Example 1.
In Example 2, the shrinkage was 8x, so we did not want to make a prototype thermal head, so Comparative Example 3> As an example of a conventional enamel substrate, there is a document (Am.
Ceratrr、Soc、、 62.683(1983
))に公表された非晶質ガラス(組成: 5ioe
−45w tX+ Bt 0r−14w tX+ Na
g O−19w tX+KeO−5wt駕、 Li*0
−4vtX、 Cab−3vt%、 Ale’s −1
0wt策 軟化点535℃)を使用し 焼成温度を60
0℃としてほうろう基板を得九 焼成後の基板のRaは
0.3μmて従来のほうろう基板のそれと大差無かった
その後同様にしてサーマルヘッドを試作し九以上の実
施例1〜2および比較例3について、基板表面上の中心
線平均粗さRL サーマルヘッドの発熱抵抗体の抵抗
値バラツキ、サーマルヘッドの熱効率(OD= 1.0
のときの1ドツトあたりの消費電力)を測定し 比較し
九 この結果を第1褒第2表に示も
以上のように良好な表面平滑性を有し サーマルヘッド
の抵抗値バラツキの小さいサーマルヘッドが得られるこ
とが確認できた
発明の効果
以上の説明から明らかなように本発明J、t、 金属
基板上へ フィラーとして、ガラス膜のガラスの軟化点
より高い軟化点を有するガラス微粒子を含むガラス膜を
形成してなるほうろう基板を形成することによって、表
面平滑性を向上させたほうろう基板を得ることができも
またサーマルヘッドとしたとき、抵抗値バラツキを減
少させることができもCeratrr, Soc, 62.683 (1983
)) Amorphous glass (composition: 5ioe
-45w tX+ Bt 0r-14w tX+ Na
g O-19w tX+KeO-5wt pallet, Li*0
-4vtX, Cab-3vt%, Ale's -1
0wt measure (softening point 535℃) was used, and the firing temperature was set to 60℃.
An enamel substrate was obtained at 0°C.The Ra of the substrate after firing was 0.3 μm, which was not much different from that of a conventional enamel substrate.After that, a thermal head was prototyped in the same manner as above, and Examples 1 and 2 and Comparative Example 3 were obtained. , center line average roughness RL on the substrate surface, resistance value variation of the heating resistor of the thermal head, thermal efficiency of the thermal head (OD = 1.0
The power consumption per dot when Effects of the invention confirmed to be obtained As is clear from the above description, the present invention J, t is a glass containing glass fine particles having a softening point higher than the softening point of the glass of the glass film as a filler on a metal substrate. By forming an enamel substrate by forming a film, it is possible to obtain an enamel substrate with improved surface smoothness, and when used as a thermal head, it is possible to reduce variation in resistance value.
図は本発明の一実施例におけるほうろう基板を使用した
サーマルヘッドの断面図であ翫1・・・金属基板 2・
・・フィラー、 3・・・ガラス風4・・・電[5・・
・発熱抵抗恢 6・・・オーバーコート層。The figure is a cross-sectional view of a thermal head using an enamel substrate according to an embodiment of the present invention.
...Filler, 3...Glass style 4...Electric [5...
・Heating resistance 6...Overcoat layer.
Claims (3)
てなるほうろう基板であって、前記フィラーが、前記ガ
ラス膜のガラスの軟化点より、高い軟化点を有するガラ
ス微粒子であることを特徴とするほうろう基板(1) An enamel substrate formed by forming a glass film containing a filler on a metal substrate, characterized in that the filler is glass fine particles having a softening point higher than the softening point of the glass of the glass film. enamel board
とするサーマルヘッド。(2) A thermal head characterized by using the enamel substrate according to claim 1.
とする回路部品。(3) A circuit component characterized by using the enamel substrate according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16467189A JPH0331485A (en) | 1989-06-27 | 1989-06-27 | Enameled substrate and thermal head or circuit parts using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16467189A JPH0331485A (en) | 1989-06-27 | 1989-06-27 | Enameled substrate and thermal head or circuit parts using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0331485A true JPH0331485A (en) | 1991-02-12 |
Family
ID=15797620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16467189A Pending JPH0331485A (en) | 1989-06-27 | 1989-06-27 | Enameled substrate and thermal head or circuit parts using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0331485A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0533823U (en) * | 1991-10-16 | 1993-05-07 | 株式会社フクハラ | Bacteria removal device in air compressor |
JPH0619815U (en) * | 1991-10-14 | 1994-03-15 | 株式会社フクハラ | Sterilization device in air compressor |
JPH0674145U (en) * | 1993-03-29 | 1994-10-21 | フジ産業株式会社 | Air compressor |
JPH0713418U (en) * | 1993-08-02 | 1995-03-07 | フジ産業株式会社 | Membrane air dryer controller and sterilizer in compressor |
JPH07185245A (en) * | 1993-12-24 | 1995-07-25 | Fukuhara:Kk | Deodorization-sterilization apparatus in compressor |
JPH07227514A (en) * | 1994-02-18 | 1995-08-29 | Fukuhara:Kk | Sterilizing device in air compressor |
JP2003062188A (en) * | 2001-08-27 | 2003-03-04 | Heiwa Corp | Game ball shooting device |
-
1989
- 1989-06-27 JP JP16467189A patent/JPH0331485A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0619815U (en) * | 1991-10-14 | 1994-03-15 | 株式会社フクハラ | Sterilization device in air compressor |
JPH0533823U (en) * | 1991-10-16 | 1993-05-07 | 株式会社フクハラ | Bacteria removal device in air compressor |
JPH0674145U (en) * | 1993-03-29 | 1994-10-21 | フジ産業株式会社 | Air compressor |
JP2520944Y2 (en) * | 1993-03-29 | 1996-12-18 | フジ産業株式会社 | Air compressor |
JPH0713418U (en) * | 1993-08-02 | 1995-03-07 | フジ産業株式会社 | Membrane air dryer controller and sterilizer in compressor |
JPH07185245A (en) * | 1993-12-24 | 1995-07-25 | Fukuhara:Kk | Deodorization-sterilization apparatus in compressor |
JPH07227514A (en) * | 1994-02-18 | 1995-08-29 | Fukuhara:Kk | Sterilizing device in air compressor |
JP2003062188A (en) * | 2001-08-27 | 2003-03-04 | Heiwa Corp | Game ball shooting device |
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