JPS5867091A - Glazed ceramic board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The surface flatness and heat resistance of the present invention's Daleze are excellent,
pbo, an electronic component layer that has low thermal conductivity and is refreshed even though it does not contain alkali.
t'Ij&.

In recent years, with the remarkable development of the electronics industry, electronic components have become higher quality and more precise.

The glazed ceramic substrate is used during construction.
A glass layer can be formed on top, and it is suitable for p, thin Mtl, and thick II resistance elements, for integrated circuits using high-precision film circuits, and for thermal recording devices. *Jill is used for Ruhetsu F etc.

Benefits of glazed substrate as a thermal head with F[K
) Thick film and thin film methods are available, while thick film methods reduce the applied voltage by half and increase thermal efficiency by inserting a heat storage glass layer that allows the distribution to be more than 1 dot per layer. 19 Thin film method allows for better clarity than t dots), excellent flatness, heat resistance and alkali, PbOy
Lee〇1! Kyoto is rising.

In addition, the glaze is required to have good thermal conductivity), and the OII target value is -aooJαl/I
・S・C・℃ properties are required. With this thermal conductivity, the i-dase layer O can be formed thinly, so the glaze 0J
On IJI) The central station etc. are small and are reduced to Table IIO 1,000 m * Dale Met 7 electric circuit board.

The quality and crane resistance required by the company above is 9% O'eA), and the need for replacement is as follows: m0s14~γ/JlRu* BaO/ 11- Atminerusan, Muryuki~4~/4
4 *1 As an essential component, and O gold component Q food composition.
This OJj! P1 [Ingredients and subcomponents: 8rO10 or less e Btus 1 mol or less, CaO/#Jlk
#-Hereinafter #Mgoz4#-Hereinafter O, a glaze composition with a total composition of 1004 lue, including 7 or less types, was applied on a sensor substrate and baked to form a glaze composition II#
It is a sign.

In the present invention, a large amount of Boo is added to obtain low thermal conductivity, and Abo is added to prevent crystallization and improve heat resistance.
It is characterized by containing a large amount of lt.

When comparing a glaze containing only the above essential ingredients and a glaze containing sub-components, there is almost no change in the properties, but the glaze containing only the essential ingredients has some air bubbles remaining in the glass. It has devitrification and mesodia properties.

In the above glaze composition, if it falls outside the limited range,
If 810g is less than 144ru, the coefficient of expansion will be high, and the adhesion of the multi-layer substrate will be reduced, and if it is more than 7/100g, it will be si.
m gets worse. If BaO is less than 111% Roux, low thermal conductivity cannot be obtained.

Dale's table IfOPjle % O1tXm to 1m <
, Jr. The company's thermal expansion rate is large for 4 or more people.
If the false value is less than 44 ru, it becomes stable glass, /4
% Roux or more, Fi melting becomes open. Nine.

Sr increases vitrification and promotes meltability at T4 lubrication, but beyond this the heat resistance decreases *Sr
O* CaOa K / 04 # 44 fl j
This is because J4 Ru★ has the effect of promoting lath formation, but moreover, it promotes clarification of MgOFi glass O by devitrification with &J*, and reduces the thickness of the glass by reducing bubbles. be.

The present invention will be explained in detail below based on examples.

Example: Item *Mu1 (OH)a*B*
■1HJOs * CaCO5 * 8rOOs * I
Weigh the k-, deposit it with the Raikai machine, and then give it to the user.
At/##℃O optimum l1llll! It melted. The molten liquid was poured into water and rapidly cooled, and then finely pulverized using a L-RUNLE manufactured by Arusu to obtain a glass 7 lift. Each glass 7 Lift Ftap with a composition of 1 was produced by the above method.

Even though I was incited to do so, I have a #anna meeting with a differential Ls! 0XjOx/Jt
I prepared an AM size V&O board.

A paste of Glass 7 Lift with each composition shown in Table 1 below was applied onto the ζO substrate using a printing method, and after drying, it was coated with a paste.
It was fired at 0° C. to obtain a glaze substrate with a Daleze thickness of 10*copam.

Table 2 below shows the measured thermal expansion coefficient and thermal conductivity 1 surface resistance of the glazed substrates of each composition manufactured above.

Thermal expansion coefficient for each composition O glaze! -XJ) A 77m sample was manufactured and measured, and the peak of the 1IlIilI line was shown as the yield point.

Table INO resistance was determined by installing O silver electrodes on the surface of the dale of each composition, applying TOOV with an electric meter, measuring the leakage current between the O electrodes after JO seconds, and then measuring the surface insulation resistance. .

Although not listed in Table 1 above, the surface roughness of a glazed and double-sided substrate with an O6 composition within the claimed range was less than a01 μm when mounted on both surfaces, and the conventional comparison product Oak! It showed superior smoothness compared to μmK.

The comparison product had a liJ of 5 μm or less, while the comparative product had a 30 μm, and the substrate had a good flatness of less than 17σpm/jOW.

The thermal expansion coefficient of the glaze is j/-'llx/f', which is no different from the conventional product, but the heat resistance is as follows: the yield point is 7#0~7
10℃, compared to 410℃ of the conventional product: 10℃
The temperature was as high as -110°C.

In terms of thermal conductivity, it is ts-Joxiv'), and compared to the conventional comparison product 01JxlO', it is alkali, pb.

Although it was a tree, it was greatly modified and the desired OB standard value g-aooJ mentioned above was achieved, and the surface smoothness and flatness O were excellent.

Table w#1 resistance is /4#X//') Conventional comparison product Kox
i/” Has better insulating properties than K, and has higher electrical stability O%
It became fh%o.

As described above, the present invention! The lased fixed substrate is of excellent quality and is suitable for use in glazed substrates, thin film substrates, printer head substrates, etc.

Claims (1)

[Claims] (') 810g 14~? 1 mole e jlgo
/jj-1tMoru2AlsOs 4~/44Ru is an essential acid, and a glaze composition in which the total composition of all components is 1004 Ru is made! ! Ik*t on the board
, Glazed top 9 characterized by being formed by firing
Tsukusu board. - Patent Claim 0IIH1/IEL Description: A glazed ceramic substrate, characterized in that the seven-layer substrate is an aluminum or beryllia substrate. u) 810m 14~'l/ 4-e BaO/
17-Color basket roux. Mu1m's 4~/44 ru as an essential acid, and as a subcomponent Br010*ru or less* Bytes 1
A glaze composition T- in which the total composition is 100 mol is added by adding one or more of the following θJ to the caote*h% or less! 1 [Apply on top,
A 9-sex board is made of a laminated plate formed by firing. (b) Scope of patent claims Ryutsu 2 Tutas I
II is a double-sided board that is characterized by the fact that it is a rear board.