JPH03300Y2 - - Google Patents
Info
- Publication number
- JPH03300Y2 JPH03300Y2 JP6905789U JP6905789U JPH03300Y2 JP H03300 Y2 JPH03300 Y2 JP H03300Y2 JP 6905789 U JP6905789 U JP 6905789U JP 6905789 U JP6905789 U JP 6905789U JP H03300 Y2 JPH03300 Y2 JP H03300Y2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- printed circuit
- circuit board
- solder
- waves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 44
- 238000005476 soldering Methods 0.000 claims description 9
- 239000012530 fluid Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6905789U JPH03300Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-15 | 1989-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6905789U JPH03300Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-15 | 1989-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0293071U JPH0293071U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-07-24 |
| JPH03300Y2 true JPH03300Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-01-08 |
Family
ID=31294352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6905789U Expired JPH03300Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-15 | 1989-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03300Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5867645B1 (ja) * | 2015-03-20 | 2016-02-24 | 富士ゼロックス株式会社 | ノズル先端部材、ノズル、はんだ付け装置、基板装置の製造方法 |
| TWI842826B (zh) | 2019-02-22 | 2024-05-21 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | 基材處理設備及處理基材之方法 |
| USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
| KR20210024423A (ko) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | 홀을 구비한 구조체를 형성하기 위한 방법 |
-
1989
- 1989-06-15 JP JP6905789U patent/JPH03300Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0293071U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-07-24 |