JPH0329393A - Metal-clad laminated plate - Google Patents
Metal-clad laminated plateInfo
- Publication number
- JPH0329393A JPH0329393A JP16417289A JP16417289A JPH0329393A JP H0329393 A JPH0329393 A JP H0329393A JP 16417289 A JP16417289 A JP 16417289A JP 16417289 A JP16417289 A JP 16417289A JP H0329393 A JPH0329393 A JP H0329393A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- drill
- roughed
- metal foil
- laminated plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 239000011888 foil Substances 0.000 claims abstract description 23
- 230000003746 surface roughness Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000005553 drilling Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 etc. are preferable Chemical compound 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント配線板などに供される金属張り禎層
仮に関するものである.特にプリント配線板に加工する
際のドリルによる穴開け加工に通した金属張り積層板に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a metal cladding layer used for printed wiring boards and the like. In particular, the present invention relates to a metal-clad laminate that has been subjected to a drilling process when being processed into a printed wiring board.
近年、プリント配線板には電子部品がますます高密度に
実装される様になって来ている.このために微小な穴を
情度良く数多く加工できる金属張り積層板が切望されて
いる。しかし、−Cに使用されている金属箔は、片面粗
化した金属箔で粗化面は絶縁層との接着力を増すために
使われ外部表面に露出した金属箔は粗化されていない平
滑な面である.このために穴開け加工をドリルで行う際
のドリルの刃先が滑り易く、所定の位置に精度良く穴を
開けることが困難で位置ずれが生じ易く加工寸法の情度
のばらつきを大きくする原因の1つになっていた。また
、一方で能率良く穴開け加工するために金属張り積層板
を複数枚重ねてドリルで加工することが一般に行われる
が金属張り積層板同士が粗化されていない平滑な表面の
金属箔張りのためにドリルの回転力で金属張り積層板同
士にずれが生しる.このために重ねた金属張りlj1J
!l板の間においても所定の位置に精度良く穴を開ける
ことが困難で位置ずれが生し易く寸法精度のばらつきを
大きくする原因の1つになっていた.〔発明が解決しよ
うとする課題]
本発明は、金属張り積N仮をプリント配線板に加工する
のに六開けをドリルによって行う際のドリルの刃先の滑
りを阻止し、また、金属張り積層板を複数枚重ねてドリ
ル加工する際の金属張り積層仮同士のずれを阻止し、穴
開け加工の寸法精度を高めることのできる金属張り積層
板を提供することにある,
(課題を解決するための手段〕
本発明は、上記の点に鑑みて為されたものであり、両面
粗化された金属箔を絶縁層の外層表面に形成したことを
特徴とする金属張り積層板を要旨とするものである.
以下に、本発明について図面に基づいて説明をする。第
1図は、本発明の金處張り積層板の断面図、第2図は積
層戒形して金属張り積層板となる前の各構威材料を分か
りやすく示した分解図である。In recent years, electronic components have become increasingly densely mounted on printed wiring boards. For this reason, there is a strong need for metal-clad laminates that can be machined with a large number of minute holes with ease. However, the metal foil used in -C is a metal foil that is roughened on one side, and the roughened side is used to increase the adhesive strength with the insulating layer, and the metal foil exposed on the external surface is smooth and not roughened. This is a good aspect. For this reason, when drilling holes with a drill, the cutting edge of the drill tends to slip, making it difficult to accurately drill holes in the predetermined position, which tends to cause misalignment, which is one of the causes of large variations in machining dimensions. It had become. On the other hand, in order to drill holes efficiently, it is common practice to stack multiple metal-clad laminates and drill them using a drill. Therefore, the rotational force of the drill causes misalignment between the metal-clad laminates. Metal clad lj1j layered for this purpose
! It was difficult to accurately drill holes at predetermined positions between the l plates, and misalignment was likely to occur, which was one of the causes of large variations in dimensional accuracy. [Problems to be Solved by the Invention] The present invention prevents the tip of the drill from slipping when making six holes with a drill to process a metal-clad laminate into a printed wiring board, and also The object of the present invention is to provide a metal-clad laminate that can prevent misalignment between the metal-clad laminates when drilling is performed by stacking multiple sheets, and can improve the dimensional accuracy of drilling. Means] The present invention has been made in view of the above points, and its gist is a metal-clad laminate characterized in that a metal foil roughened on both sides is formed on the outer surface of an insulating layer. The present invention will be explained below based on the drawings. Figure 1 is a cross-sectional view of the metal-clad laminate of the present invention, and Figure 2 is a cross-sectional view of the metal-clad laminate before it is laminated to form a metal-clad laminate. It is an exploded view showing each structural material in an easy-to-understand manner.
本発明の絶縁層1は基材に樹脂を含浸し半硬化させたブ
リプレグ3が1枚又は、複数枚重ね合わせて戒形し硬化
したものであり、樹脂としては、エポキシ樹脂、ポリイ
ミド樹脂、フェノール樹脂、ポリエステル樹脂、フッソ
樹脂および、これらの変性樹脂などの熱硬化性樹脂を、
基材としては、通常は、ガラスクロス等が用いられる。The insulating layer 1 of the present invention is made of one or more Brypreg 3, which is a base material impregnated with a resin and semi-cured.The resin is made of epoxy resin, polyimide resin, phenol, etc. thermosetting resins such as resins, polyester resins, fluorocarbon resins, and modified resins,
As the base material, glass cloth or the like is usually used.
この他、石英繊維布等の無機繊維布、セルロース系繊維
紙等の有機繊維紙等又は、ポリイミド樹脂繊維布等の高
耐熱性有N繊維布等をそれぞれ用途に応して組合せて用
いることができる。前記半硬化させたブIJプレグ3の
半硬化とは、熱硬化性樹脂の硬化過程において一般に3
ステージと言われる止四のものであり、さらに熱が加わ
れば硬化反応が起こり、かつ手で触れてもべとつきがな
く、これらを重ねて置くことのできる性状のものを言う
。In addition, inorganic fiber cloth such as quartz fiber cloth, organic fiber paper such as cellulose fiber paper, highly heat-resistant N fiber cloth such as polyimide resin fiber cloth, etc. can be used in combination depending on the purpose. can. Semi-curing of the semi-cured IJ preg 3 generally refers to semi-curing of the semi-cured IJ preg 3
It is a four-piece type called a stage, which undergoes a hardening reaction when heat is applied, is not sticky to the touch, and can be placed one on top of the other.
前記絶縁層lの外層表面に形成される金属箭2としては
、銅、ニッケル、アルミニウム、ステンレスなどの金属
箔が、特には銅箔が霊気伝導性の良好な点で好ましい。As the metal cage 2 formed on the outer layer surface of the insulating layer 1, metal foils such as copper, nickel, aluminum, stainless steel, etc. are preferable, and copper foil is particularly preferable since it has good spiritual conductivity.
この場合、電解銅箔、圧延銅箔いずれでも良く特に限定
するものではない。In this case, either electrolytic copper foil or rolled copper foil may be used, and there is no particular limitation.
また、これら金属箔に回路を形成した金属箔を用いるこ
ともできる。これらいずれの場合にも使用される金属濱
の厚みは、微細回路形成を行うには18μ調以下が望ま
しい。Moreover, metal foils in which circuits are formed on these metal foils can also be used. In any of these cases, the thickness of the metal layer used is preferably 18 μm or less in order to form a fine circuit.
次に本発明の金属張り積N板Aは、前記ブリプレグ3の
1枚ないし複数枚を重ね合わせ、その外層表面に4〜6
μ−の表面粗度に両表面を粗化した金属箔2を配設し、
加圧、加熱することによって得ることができる。一般に
金属箔は前記プリプレグとの接着を良くするために接着
面1よ粗化されているが、本発明においては、特に両表
面ともに4〜6μ−の表面粗度に粗化した金属箔2を使
用するものであり、片方の粗化面は従来通りプリプレグ
3との接着力を高めるものであり、他方の金属張り積層
板Aにおいて外部に露出した金B箔2の粗化面は、ドリ
ルの刃先が金属箔表面で滑るのを阻止することができる
のである。また、かかる金属張り積層板を複数枚重ねて
ドリル加工する時、これら金属張り積層板同士がずれる
のも阻止することができるのである.
次に本発明を実施例と比較例によって説明する。Next, the metal laminate N board A of the present invention is produced by stacking one or more of the Buri Preg 3, and applying 4 to 6
A metal foil 2 with roughened surfaces on both surfaces is arranged to have a surface roughness of μ-,
It can be obtained by applying pressure and heating. Generally, the metal foil is roughened on the adhesive surface 1 to improve adhesion with the prepreg, but in the present invention, the metal foil 2 is particularly roughened to a surface roughness of 4 to 6 μ- on both surfaces. The roughened surface of one side is used to increase the adhesion with the prepreg 3 as before, and the roughened surface of the gold B foil 2 exposed to the outside on the other metal-clad laminate A is heated by a drill. This prevents the cutting edge from slipping on the metal foil surface. Furthermore, when a plurality of such metal-clad laminates are stacked and drilled, it is possible to prevent these metal-clad laminates from shifting from each other. Next, the present invention will be explained with reference to Examples and Comparative Examples.
(実施例〕
実施例 l
樹脂としてプロム化エボキシ樹B’8 ( DER−5
11, Eκ80ダウケミカル製)を100重量部、、
硬化剤としてジンアンジアミド(ダイサイ)を3重量部
、硬化促進剤として2エチル4メチルイミダゾ−ル(2
E4MZ)を0.1重量部、そして溶媒としてメチルエ
チルケトン(MEK). ジメチルホルムアミド(D
MF)の等星混合7夜を55重量部それぞれ配合してな
る樹脂ワニスをガラス布の仕様7628のガラス布基材
に含浸、乾燥させ、樹脂が半硬化したブリプレグ3を得
、このプリプレグ3を8枚重ねた外層両表面に4〜6μ
mの表面粗度に両表面を粗化した厚み18μmの銅箔2
を配置し、薫気ブレスを用いて、成形温度170’C,
威形圧力50kg/cm”、100分間の条件で積層戒
形を行い、プリプレグ3で構威された絶縁層lの外層表
面に両面粗化した金属箔2を配設した厚さ1.6mmの
プリント配線板用の両面銅張り禎層仮Aを得た。(Example) Example l Prominated epoxy tree B'8 (DER-5
11. 100 parts by weight of Eκ80 (manufactured by Dow Chemical),
3 parts by weight of ginandiamide (Daisai) as a curing agent and 2 ethyl 4 methyl imidazole (2 parts by weight) as a curing accelerator.
0.1 part by weight of E4MZ) and methyl ethyl ketone (MEK) as a solvent. Dimethylformamide (D
A glass cloth base material of specification 7628 was impregnated with a resin varnish made by blending 55 parts by weight of MF) equal star mixture 7 nights, and dried to obtain Bripreg 3 in which the resin was semi-cured. 4-6μ on both surfaces of the outer layer of 8 layers
Copper foil 2 with a thickness of 18 μm with both surfaces roughened to a surface roughness of m
was placed, and using a fume breath, the molding temperature was 170'C.
Lamination was carried out under the conditions of 100 minutes at a forming pressure of 50 kg/cm'', and a metal foil 2 roughened on both sides was arranged on the outer layer surface of an insulating layer 1 made up of prepreg 3, with a thickness of 1.6 mm. A double-sided copper-clad layer temporary A for printed wiring boards was obtained.
この両面銅張り積N仮Aを用いて、3 0 0 mm角
のこの両面銅張り積rr3仮を2枚重ねその下面に1,
6m厚みの捨て板を配置し、1.27mmピッチの格子
状にφ0.35Mの穴を、回転数8000Orpm,
1回転当たりの送り速度30μ−/revの条件でド
リル加工し、1枚目の表面と2枚目の裏面に開いた穴の
基準穴に対するずれの値を50か所計測し、その結果を
第1表に示した。Using this double-sided copper-clad stack N tentative A, stack two 300 mm square double-sided copper-clad stacks rr3 tentative and place 1,
A 6m thick sacrificial plate was placed, and holes of φ0.35M were arranged in a grid pattern with a pitch of 1.27mm, and the number of revolutions was 8000 rpm.
Drilling was performed at a feed rate of 30 μ-/rev per revolution, and the deviation values of the holes drilled on the front side of the first sheet and the back side of the second sheet with respect to the reference hole were measured at 50 locations, and the results were recorded in the It is shown in Table 1.
比較例 1
実施例の両面粗化された金属箔を片方表面が圧延ロール
で仕上がったままの粗化されていない平滑な銅笛に変え
た以外は実施例1と同様に実施し第1表の結果を得た。Comparative Example 1 The same procedure as in Example 1 was carried out, except that the double-sided roughened metal foil of Example was changed to a non-roughened, smooth copper whistle with one surface finished with a rolling roll. Got the results.
以上第1表の結果より両面粗化された金属箔を絶縁層の
外層表面に形成した実施例■の金属張り積層板を重ねて
ドリル加工を行ったものは、粗化されていない平滑な金
属箔の場合の比較例lに比べ基準穴に対するずれは小さ
く、加工寸法精度が良い金属張り積層板であることがG
I E2できた。From the results shown in Table 1 above, the metal clad laminates of Example 2, in which metal foils roughened on both sides were formed on the outer surface of the insulating layer, were layered and drilled to produce smooth, unroughened metal. Compared to Comparative Example 1 in the case of foil, the deviation from the reference hole is small, and the metal-clad laminate has good processing dimensional accuracy.
IE2 was completed.
(以 下 余 白)
第1表
C単位:μm〕
〔発明の効果〕
本発明の金属張り積層板は、粗化された金属7δが絶縁
層の外層表面に形成され露出しているためにプリント配
線板に加工する際の六開けをドリルによって行う際にド
リルの刃先の滑るのを阻止することができ、また、複数
枚の金属張り積層板を重ねてドリル加工する際の金属張
り積層板同士のずれも阻止することができ、これらの効
果としてドリルによる穴開け加工の寸法精度を高めるこ
とができるのである.(Margin below) Table 1 C Unit: μm [Effects of the Invention] The metal-clad laminate of the present invention has roughened metal 7δ formed on the outer layer surface of the insulating layer and is exposed, making it difficult to print. It can prevent the tip of the drill bit from slipping when using a drill to drill holes when processing into wiring boards, and it can also prevent the tip of the drill bit from slipping between metal-clad laminates when drilling multiple metal-clad laminates together. As a result, the dimensional accuracy of drilling with a drill can be improved.
第1図は、本発明の一実施例を示す断面図であり、第2
図は、本発門の金属張りla層板になる前の構成材料の
分解図である。
A・・・金属張り積層板
1・・・絶縁層
2・・・金属箔
3・・・プリプレグ
1.1 図
2
第2図FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
The figure is an exploded view of the constituent materials before becoming the metal-clad la laminate of this invention. A...Metal-clad laminate 1...Insulating layer 2...Metal foil 3...Prepreg 1.1 Figure 2 Figure 2
Claims (2)
したことを特徴とする金属張り積層板。(1) A metal-clad laminate characterized in that a double-sided roughened metal foil is formed on the outer surface of an insulating layer.
mであることを特徴とする請求項1記載の金属張り積層
板。(2) The surface roughness of the metal foil roughened on both sides is 4 to 6μ
The metal-clad laminate according to claim 1, wherein the metal-clad laminate is m.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16417289A JPH0329393A (en) | 1989-06-27 | 1989-06-27 | Metal-clad laminated plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16417289A JPH0329393A (en) | 1989-06-27 | 1989-06-27 | Metal-clad laminated plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0329393A true JPH0329393A (en) | 1991-02-07 |
Family
ID=15788096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16417289A Pending JPH0329393A (en) | 1989-06-27 | 1989-06-27 | Metal-clad laminated plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0329393A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5763693A (en) * | 1995-02-24 | 1998-06-09 | Mitsui Chemicals, Inc. | Process for producing isopropyl alcohol |
KR20030067943A (en) * | 2002-02-09 | 2003-08-19 | 한국 기술교류 주식회사 | Manufacturing method of printed circuit board for thin film motor |
WO2010027022A1 (en) | 2008-09-05 | 2010-03-11 | 味の素株式会社 | Bacterium capable of producing l-amino acid, and method for producing l-amino acid |
-
1989
- 1989-06-27 JP JP16417289A patent/JPH0329393A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5763693A (en) * | 1995-02-24 | 1998-06-09 | Mitsui Chemicals, Inc. | Process for producing isopropyl alcohol |
KR20030067943A (en) * | 2002-02-09 | 2003-08-19 | 한국 기술교류 주식회사 | Manufacturing method of printed circuit board for thin film motor |
WO2010027022A1 (en) | 2008-09-05 | 2010-03-11 | 味の素株式会社 | Bacterium capable of producing l-amino acid, and method for producing l-amino acid |
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