JPH0328474Y2 - - Google Patents

Info

Publication number
JPH0328474Y2
JPH0328474Y2 JP1985153897U JP15389785U JPH0328474Y2 JP H0328474 Y2 JPH0328474 Y2 JP H0328474Y2 JP 1985153897 U JP1985153897 U JP 1985153897U JP 15389785 U JP15389785 U JP 15389785U JP H0328474 Y2 JPH0328474 Y2 JP H0328474Y2
Authority
JP
Japan
Prior art keywords
light
light emitting
wire
emitting elements
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985153897U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62129591U (en, 2012
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985153897U priority Critical patent/JPH0328474Y2/ja
Publication of JPS62129591U publication Critical patent/JPS62129591U/ja
Application granted granted Critical
Publication of JPH0328474Y2 publication Critical patent/JPH0328474Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP1985153897U 1985-10-08 1985-10-08 Expired JPH0328474Y2 (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985153897U JPH0328474Y2 (en, 2012) 1985-10-08 1985-10-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985153897U JPH0328474Y2 (en, 2012) 1985-10-08 1985-10-08

Publications (2)

Publication Number Publication Date
JPS62129591U JPS62129591U (en, 2012) 1987-08-15
JPH0328474Y2 true JPH0328474Y2 (en, 2012) 1991-06-19

Family

ID=31073198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985153897U Expired JPH0328474Y2 (en, 2012) 1985-10-08 1985-10-08

Country Status (1)

Country Link
JP (1) JPH0328474Y2 (en, 2012)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6636027B1 (en) * 2000-10-24 2003-10-21 General Electric Company LED power source
WO2007122566A1 (en) * 2006-04-25 2007-11-01 Koninklijke Philips Electronics N.V. Led array grid, method and device for manufacturing said grid and led component for use in the same
JP4829756B2 (ja) * 2006-07-27 2011-12-07 コトヒラ工業株式会社 発光モジュール配列表示装置
JP5610851B2 (ja) * 2010-06-02 2014-10-22 スパークリングライツ株式会社 切断可能な照明装置及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102279U (en, 2012) * 1977-01-22 1978-08-17

Also Published As

Publication number Publication date
JPS62129591U (en, 2012) 1987-08-15

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