JPH0325411Y2 - - Google Patents
Info
- Publication number
- JPH0325411Y2 JPH0325411Y2 JP4156585U JP4156585U JPH0325411Y2 JP H0325411 Y2 JPH0325411 Y2 JP H0325411Y2 JP 4156585 U JP4156585 U JP 4156585U JP 4156585 U JP4156585 U JP 4156585U JP H0325411 Y2 JPH0325411 Y2 JP H0325411Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- case
- flange
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000001816 cooling Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000010399 three-hybrid screening Methods 0.000 description 1
- 238000010396 two-hybrid screening Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156585U JPH0325411Y2 (US07922777-20110412-C00004.png) | 1985-03-25 | 1985-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156585U JPH0325411Y2 (US07922777-20110412-C00004.png) | 1985-03-25 | 1985-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61158954U JPS61158954U (US07922777-20110412-C00004.png) | 1986-10-02 |
| JPH0325411Y2 true JPH0325411Y2 (US07922777-20110412-C00004.png) | 1991-06-03 |
Family
ID=30551512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4156585U Expired JPH0325411Y2 (US07922777-20110412-C00004.png) | 1985-03-25 | 1985-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325411Y2 (US07922777-20110412-C00004.png) |
-
1985
- 1985-03-25 JP JP4156585U patent/JPH0325411Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61158954U (US07922777-20110412-C00004.png) | 1986-10-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100418148B1 (ko) | 2개이상의케이싱부분으로형성되는제어장치 | |
| JP4159861B2 (ja) | プリント回路基板の放熱構造の製造方法 | |
| EP0004148A1 (en) | Electrical connector for use in mounting an electronic device on a substrate | |
| KR19990062581A (ko) | 전자회로조립을 위한 전자회로장치 및 방법 | |
| US4387413A (en) | Semiconductor apparatus with integral heat sink tab | |
| US6449158B1 (en) | Method and apparatus for securing an electronic power device to a heat spreader | |
| JP4106125B2 (ja) | 制御装置 | |
| JP3169578B2 (ja) | 電子部品用基板 | |
| JPH0325411Y2 (US07922777-20110412-C00004.png) | ||
| JP2001257306A (ja) | 混成集積回路装置及びその製造方法 | |
| JPH11163564A (ja) | 電子機器及び電子機器の製造方法 | |
| JPH0569887U (ja) | コネクタおよびコネクタ一体型回路装置ならびにコネクタ一体型回路付き筐体 | |
| JPH10178243A (ja) | 放熱板付きプリント回路基板およびその製造方法 | |
| JPH05327249A (ja) | 電子回路モジュール及びその製造方法 | |
| JPH0263146A (ja) | プリント板に装着する発熱部品の放熱構造 | |
| JP2828553B2 (ja) | 半導体装置 | |
| JP3667130B2 (ja) | 配線基板モジュール | |
| JP3549230B2 (ja) | 回路構成体とその製造方法 | |
| JPH1098127A (ja) | 表面実装用半導体パッケージ | |
| JP2003332500A (ja) | 電子回路装置 | |
| JPH06196838A (ja) | 部品搭載済み基板 | |
| JP2572739Y2 (ja) | 電力型面実装電子部品 | |
| JPH10125833A (ja) | Ｂｇａ型パッケージ実装基板及びｂｇａ型パッケージ実装方法 | |
| JPS6112683Y2 (US07922777-20110412-C00004.png) | ||
| JPS609147A (ja) | 混合集積回路 |
