JPH03250640A - Ultrasonic wire bonding device - Google Patents

Ultrasonic wire bonding device

Info

Publication number
JPH03250640A
JPH03250640A JP2045809A JP4580990A JPH03250640A JP H03250640 A JPH03250640 A JP H03250640A JP 2045809 A JP2045809 A JP 2045809A JP 4580990 A JP4580990 A JP 4580990A JP H03250640 A JPH03250640 A JP H03250640A
Authority
JP
Japan
Prior art keywords
welding jig
lead frame
twisting
bonding
horn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2045809A
Other languages
Japanese (ja)
Inventor
Hidekazu Ando
英一 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPC Electronics Corp
Original Assignee
SPC Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SPC Electronics Corp filed Critical SPC Electronics Corp
Priority to JP2045809A priority Critical patent/JPH03250640A/en
Publication of JPH03250640A publication Critical patent/JPH03250640A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To eliminate bonding variations induced by the directional property of a lead frame with respect to vibrating directions by mounting a welding jig to a twisting vibration horn which is making a twisting motion. CONSTITUTION:A welding jig 2 is mounted to the lower end of a twisting vibration horn 1. The welding jig 2 is lowered with the twisting vibration horn 1 in such a manner that the welding jig 2 presses slightly a lead wire 5 on a lead frame 4 set to a base 3. Then, the vibration from a twisting vibrator is transmitted to the twisting vibration horn and provides the twisting vibration to the welding jig 2, thereby bonding the lead wire 5 with the lead frame 4. It is, therefore, possible to eliminate bonding variations induced by the lead frame direction with respect to the vibrating directions.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は超音波ワイヤーボンディング装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an ultrasonic wire bonding device.

（従来の技術） 従来の此種装置は第３図に示すように、縦振動するホー
ン１′に溶接治具２′を垂直に固定し、基台３′に載置
したり−トフレーム４′上のり一トワイヤ５′に溶接治
具２′を微小圧て抑圧しホーン１′に縦振動の超音波振
動を与えなから、リードフレーム４′にリートワイヤ５
′をボンディングするようになっている。(Prior Art) As shown in FIG. 3, in a conventional device of this type, a welding jig 2' is vertically fixed to a longitudinally vibrating horn 1', and the welding jig 2' is placed on a base 3'. The welding jig 2' is slightly pressed against the lead wire 5' to apply vertical ultrasonic vibration to the horn 1'.
′ is bonded.

（発明か解決しようとする課題） しかしなから、最近ＩＣの高集積化、多ビン化に伴い、
リードフレーム４の巾かたんたん狭くなっている。この
ため、ホーン１′の振動方向に直交するような位置にあ
るリードフレーム４′は超音波振動を受けて剥れ、或い
は切れなどの事故か発生するなど信頼性か低下する不都
合かあった。(Invention or problem to be solved) However, with the recent increase in the integration of ICs and the increase in the number of bins,
The width of lead frame 4 has become narrower. For this reason, the lead frame 4', which is located perpendicular to the vibration direction of the horn 1', is subject to ultrasonic vibration and may peel off or break, resulting in a reduction in reliability.

そこて、本発明においては、超音波振動の方向に対する
リードフレームの方向性による信頼性の低下を阻止する
ことかできる超音波ワイヤーボンディング装置を提供す
るのか目的である。Therefore, it is an object of the present invention to provide an ultrasonic wire bonding apparatus that can prevent a decrease in reliability due to the directionality of a lead frame with respect to the direction of ultrasonic vibration.

（課題を解決するための手段） 本発明における超音波ワイヤーボンディング装置は、リ
ートワイヤをリードフレームにボンディシフする装置に
おいて溶接治具を捻り振動する捻り振動率−ンに取付け
たものである。(Means for Solving the Problems) The ultrasonic wire bonding apparatus according to the present invention is an apparatus for bonding a lead wire to a lead frame, in which a welding jig is attached to a torsional vibrator that vibrates torsionally.

又、リートワイヤの先端を溶融して金属ホールを形成す
る加熱手段を有するものである。It also has a heating means for melting the tip of the lead wire to form a metal hole.

（作　　用） 本発明は前記のように構成したもので、リードフレーム
にリートワイヤを溶接治具て微小圧て抑圧し、捻り振動
ホーンからの捻り振動によりボンディングする。(Function) The present invention is configured as described above, and the lead wire is pressed against the lead frame with a slight pressure using a welding jig, and bonding is performed by torsional vibration from a torsional vibration horn.

又、リートワイヤの先端を溶融して金属ボールを形成し
、この金属ボールを溶接治具てリードフレームに微小圧
で抑圧して握り振動によりボンディングする。Further, the tip of the lead wire is melted to form a metal ball, and this metal ball is pressed against the lead frame using a welding jig with minute pressure and bonded by grip vibration.

（実施例） 本発明の第１実施例を第１図に基いて詳細に説明すると
、捻り振動ホーンｌの下端に溶接治具２を取付け、基台
３上にセットしたリードフレーム４上のリートワイヤ５
に溶接治具２を微小圧て押圧せしめるように、溶接治具
２を捻り振動ホーン１と共に下降させる。そして、図示
を省略した捻り振動子からの振動を捻りホーンに伝え、
溶接治具２に捻り振動を与え、リートワイヤ５をり一１
〜フレーム４にボンディングするようになっている。(Embodiment) A first embodiment of the present invention will be described in detail based on FIG. 5
The welding jig 2 is lowered together with the torsional vibrating horn 1 so that the welding jig 2 is pressed with a slight pressure. Then, vibrations from a torsion vibrator (not shown) are transmitted to the torsion horn,
Torsional vibration is applied to the welding jig 2, and the wire 5 is twisted
~ It is designed to be bonded to frame 4.

捻り振動を用いることにより、従来の装置で発生してい
た振動方向に対するリードフレームの方向によるボンデ
ィングのバラツキか解消され、信頼性の高いボンディン
グか可能となる。By using torsional vibration, variations in bonding due to the direction of the lead frame relative to the vibration direction that occur in conventional devices are eliminated, and highly reliable bonding is possible.

次に第２実施例を第２図に基いて説明すると、溶接治具
６は垂直方向にワイヤー通過孔７を設けてリードワイヤ
５を通過てきるように設け、溶接治具６の上昇位置の近
傍に電気放電用のスーパークロット等の加熱手段８を設
置し、リートワ・イヤ５の発端に金属ボール９を形成せ
しめるようになっている。Next, the second embodiment will be described based on FIG. A heating means 8 such as a super clot for electric discharge is installed nearby, and a metal ball 9 is formed at the beginning of the leetower ear 5.

第２実施例は前記のように構成したものて、溶接治具６
か上昇位置にあるときに、シートワイヤ５の先端を加熱
手段８によって溶融して金属ホール８を形成せしめる。The second embodiment has a welding jig 6 constructed as described above.
When the sheet wire 5 is in the raised position, the tip of the sheet wire 5 is melted by the heating means 8 to form a metal hole 8.

その後、溶接治具６と共に金属ボール８を下降させてリ
ードフレーム４の上に位置させ、微小圧て抑圧し、図示
を省略した捻りホーンによる捻り振動を溶接治具に与え
なからソー１−フレーム４に金属ボール９をボンディン
グする。Thereafter, the metal ball 8 is lowered together with the welding jig 6 and placed on top of the lead frame 4, and is suppressed with a slight pressure to prevent torsional vibrations caused by a torsion horn (not shown) from being applied to the welding jig. A metal ball 9 is bonded to 4.

その後、溶接治具６のみを上昇させ、リードワイヤ５を
切断する。Thereafter, only the welding jig 6 is raised and the lead wire 5 is cut.

前記操作を繰返すことにより順次ボンディング工程を進
めるようになっている。By repeating the above operations, the bonding process is sequentially advanced.

（発明の効果） 本発明は前記のような構成、作用を有するものて捻り振
動を用いているので、従来の装置て発生していた振動方
向に対するリードフレームの方向性によるボンディング
のバラツキか解消され、信頼性の高いボンディング可能
となる。(Effects of the Invention) Since the present invention uses torsional vibration having the above-described structure and function, it is possible to eliminate variations in bonding due to the orientation of the lead frame with respect to the vibration direction that occurred in conventional devices. , it becomes possible to perform highly reliable bonding.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明に係る超音波ワイヤーボンディング装置
の第１実施例の正面図、第２図は第２実施例の要部を切
断した正面図、第３図は従来装置の正面図である。 １・・・ホーン、２・・・溶接治具、３・・・基台。 ４・・・リードフレーム、５・・・リートワイヤ。 ６・・・溶接治具、７・・・ワイヤー通過孔。FIG. 1 is a front view of a first embodiment of an ultrasonic wire bonding device according to the present invention, FIG. 2 is a front view of the second embodiment with main parts cut away, and FIG. 3 is a front view of a conventional device. . 1... Horn, 2... Welding jig, 3... Base. 4...Lead frame, 5...Lead wire. 6... Welding jig, 7... Wire passage hole.

Claims (2)

【特許請求の範囲】[Claims] （１）リードワイヤをリードフレームにボンディングす
る装置において、溶接治具を捻り振動する捻り振動ホー
ンに取付けたことを特徴とする超音波ワイヤーボンディ
ング装置。(1) An ultrasonic wire bonding device for bonding a lead wire to a lead frame, characterized in that a welding jig is attached to a torsional vibration horn that vibrates torsionally. （２）リードワイヤの先端を溶融して金属ボールを形成
する加熱手段を有することを特徴とする請求項（１）記
載の超音波ワイヤーボンディング装置。(2) The ultrasonic wire bonding apparatus according to claim (1), further comprising a heating means for melting the tip of the lead wire to form a metal ball.
JP2045809A 1990-02-28 1990-02-28 Ultrasonic wire bonding device Pending JPH03250640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2045809A JPH03250640A (en) 1990-02-28 1990-02-28 Ultrasonic wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2045809A JPH03250640A (en) 1990-02-28 1990-02-28 Ultrasonic wire bonding device

Publications (1)

Publication Number Publication Date
JPH03250640A true JPH03250640A (en) 1991-11-08

Family

ID=12729587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2045809A Pending JPH03250640A (en) 1990-02-28 1990-02-28 Ultrasonic wire bonding device

Country Status (1)

Country Link
JP (1) JPH03250640A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140475A (en) * 1992-10-26 1994-05-20 Matsushita Electric Ind Co Ltd Ultrasonic wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06140475A (en) * 1992-10-26 1994-05-20 Matsushita Electric Ind Co Ltd Ultrasonic wire bonding device

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