JPH0555311A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPH0555311A
JPH0555311A JP21203091A JP21203091A JPH0555311A JP H0555311 A JPH0555311 A JP H0555311A JP 21203091 A JP21203091 A JP 21203091A JP 21203091 A JP21203091 A JP 21203091A JP H0555311 A JPH0555311 A JP H0555311A
Authority
JP
Japan
Prior art keywords
piezoelectric element
capillary tool
arm
bonding
vibrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21203091A
Other languages
Japanese (ja)
Other versions
JP3006192B2 (en
Inventor
Hiroshi Haji
宏 土師
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21203091A priority Critical patent/JP3006192B2/en
Publication of JPH0555311A publication Critical patent/JPH0555311A/en
Application granted granted Critical
Publication of JP3006192B2 publication Critical patent/JP3006192B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To conduct an excellent bonding operation by a method wherein a pressing element is attached to the piezoelectric element installed on the tip part of an arm, and the pressing element is directly driven and vibrated by the piezoelectric element in such a manner that the pressing element is violently vibrated in whatever oscillation frequency. CONSTITUTION:A capillary tool 10 is moved above a semiconductor chip 13, and then the capillary 10 is brought down. At that time, a wiring 11 is pressed to the semiconductor chip 13 and a substrate 12, and a bonding operation is conducted while the capillary tool 10 is being vibrated by driving a piezoelectric element 5. At this point, the capillary tool 10 is oscillated by directly driving the piezoelectric element 5. As a result, the capillary tool 10 is oscillated strongly, and a bonding operation can be conducted excellently.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はボンディング装置に係
り、押圧子を圧電素子により直接振動させながら、ワイ
ヤボンディングなどのボンディング作業を行うようにし
たものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus, which performs a bonding work such as wire bonding while directly vibrating a pressing element by a piezoelectric element.

【０００２】[0002]

【従来の技術】半導体チップの電極と基板の電極を接続
するワイヤボンディング、フィルムキャリアのリードを
半導体チップの電極にボンディングするシングルポイン
トＴＡＢ、フリップチップのスタッドバンプの形成など
に使用されるボンディング装置は、一般に、キャピラリ
ツールやウエッジツールなどの押圧子を圧電素子により
ＵＳ振動させながら、所定のボンディングを行うように
なっている。2. Description of the Related Art Bonding devices used for wire bonding for connecting electrodes of a semiconductor chip and electrodes of a substrate, single point TAB for bonding leads of a film carrier to electrodes of a semiconductor chip, formation of stud bumps for flip chips, etc. Generally, predetermined pressing is performed while a pressing element such as a capillary tool or a wedge tool is US vibrated by a piezoelectric element.

【０００３】図４はワイヤボンディング用の従来のボン
ディング装置を示すものであって、１０１は棒状のホー
ンであり、その先端部にはキャピラリツール１０２が支
持されており、またその後端部には振動手段としての圧
電素子１０３が装着されている。また、このホーン１０
１は、その中間部をリング１０４に支持されている。１
０５はリング１０４を支持するための本体部側の支持部
である。図４中の波形は、ホーン１０１の振動特性を示
すものであって、Ａ１，Ａ２，Ａ３は共振点である。FIG. 4 shows a conventional bonding apparatus for wire bonding, in which 101 is a rod-shaped horn, a capillary tool 102 is supported at its tip, and its rear end is vibrated. A piezoelectric element 103 as a means is attached. Also, this horn 10
1 is supported by the ring 104 at an intermediate portion thereof. 1
Reference numeral 05 denotes a support portion on the main body side for supporting the ring 104. The waveform in FIG. 4 shows the vibration characteristic of the horn 101, and A1, A2 and A3 are resonance points.

【０００４】この従来手段は、圧電素子１０３の振動を
ホーン１０１を介してキャピラリツール１０２に伝達し
てこれを振動させるものであり、ホーン１０１の振動を
阻害しないように、リング１０４は非共振点Ｂ１に設け
られており、またキャピラリツール１０２は十分に振動
できるようにホーン１０１の先端部の共振点Ａ３に支持
されている。In this conventional means, the vibration of the piezoelectric element 103 is transmitted to the capillary tool 102 via the horn 101 to vibrate the same. The ring 104 does not interfere with the vibration of the horn 101. The capillary tool 102 is provided at B1 and is supported at the resonance point A3 at the tip of the horn 101 so that it can vibrate sufficiently.

【０００５】[0005]

【発明が解決しようとする課題】ところで、ホーン１０
１の振動周波数は、ワイヤの材質などのボンディング条
件に応じて変更することが望ましい。ところが、上記従
来手段では、振動周波数を変更すると、ホーン１０１の
振動特性も変化するため、これに応じて、ホーン１０１
の長さやリング１０４の取り付け位置を変えて、キャピ
ラリツール１０２とリング１０４が、それぞれ新たな共
振点や非共振点に位置するようにせねばならないことと
なる。しかしながら、このようにホーン１０１の長さや
リング１０４の取り付け位置を変えることは実際上不可
能であり、したがって従来は、常に同一振動周波数でボ
ンディングを行っており、ボンディング不良を生じやす
い問題点があった。By the way, the horn 10 is used.
It is desirable to change the vibration frequency of No. 1 according to the bonding conditions such as the material of the wire. However, in the above-mentioned conventional means, when the vibration frequency is changed, the vibration characteristic of the horn 101 is also changed.
The length and the mounting position of the ring 104 must be changed so that the capillary tool 102 and the ring 104 are located at new resonance points and non-resonance points, respectively. However, it is practically impossible to change the length of the horn 101 and the mounting position of the ring 104 in this manner, and therefore, conventionally, bonding is always performed at the same vibration frequency, which causes a problem that a bonding failure is likely to occur. It was

【０００６】そこで本発明は、ワイヤの材質に応じて振
動周波数を変えても、常に強く押圧子を振動させて、良
好なボンディングを行うことができるボンディング装置
を提供することを目的とする。Therefore, an object of the present invention is to provide a bonding apparatus which can vibrate the pressing member strongly and perform good bonding even if the vibration frequency is changed according to the material of the wire.

【０００７】[0007]

【課題を解決するための手段】このために本発明は、支
持部に片持支持されたアームと、このアームの先端部に
装着された圧電素子とを備え、この圧電素子の先端部に
押圧子を取り付け、この圧電素子によりこの押圧子を直
接駆動して振動させるようにしたものである。To this end, the present invention comprises an arm that is cantilevered by a support portion and a piezoelectric element mounted on the tip of this arm, and presses against the tip of this piezoelectric element. The pressing element is directly driven by the piezoelectric element to vibrate.

【０００８】[0008]

【作用】上記構成によれば、押圧子は圧電素子により直
接駆動されて振動するので、振動周波数に関係なく、常
に強く振動して良好なボンディングを行うことができ
る。According to the above construction, since the pressing element is directly driven by the piezoelectric element and vibrates, it is possible to always vibrate strongly and perform good bonding regardless of the vibration frequency.

【０００９】[0009]

【実施例】次に、図面を参照しながら本発明の実施例を
説明する。Embodiments of the present invention will now be described with reference to the drawings.

【００１０】図１は本発明のボンディング装置の側面
図、図２は同要部分解斜視図である。１は肉太な棒状の
アームであり、その基端部にはリング２が装着されてお
り、このリング２は本体部側の支持部３に片持支持され
ている。図３に示すように、このアーム１の先端部内に
は、その軸線ＮＡに沿ってボルト孔４が穿孔されてい
る。５は中心部に貫通孔５ａが形成されたドーナツ状の
圧電素子であり、このアーム１の先端部に４個連結して
装着されている。６はこの圧電素子５をアーム１に装着
するための平頭のボルトであり、その先端部を圧電素子
５の貫通孔５ａ内に挿通して、アーム１のボルト孔４に
螺着されている。８はキャピラリツール１０の支持部で
あり、この圧電素子５の先端部にあるボルト６の平頭部
９の下部に、上記軸線ＮＡから外して設けられている。
図３の鎖線ａは、圧電素子５の先端部の振動特性を示し
ている。図示するように、圧電素子５のセンターは、ボ
ルト６により締め付けてアーム１に固定されているの
で、殆ど振動せず、センターから外れた周辺部ほど大き
く振動する。そこで、キャピラリツール１０を取り付け
る保持部８を平頭部９の下部、すなわち圧電素子５の周
辺部に対応する位置に装着することにより、キャピラリ
ツール１０を強く振動させることができる。FIG. 1 is a side view of the bonding apparatus of the present invention, and FIG. 2 is an exploded perspective view of the same main part. Reference numeral 1 denotes a thick rod-shaped arm, a ring 2 is attached to the base end portion thereof, and the ring 2 is cantilevered by a support portion 3 on the main body side. As shown in FIG. 3, a bolt hole 4 is bored in the tip portion of the arm 1 along the axis NA thereof. Reference numeral 5 denotes a donut-shaped piezoelectric element having a through hole 5a formed in the center thereof, and four arm elements are connected to and mounted on the tip of the arm 1. Reference numeral 6 denotes a flat-headed bolt for mounting the piezoelectric element 5 on the arm 1. The tip portion of the bolt is inserted into the through hole 5a of the piezoelectric element 5 and screwed into the bolt hole 4 of the arm 1. Reference numeral 8 denotes a support portion of the capillary tool 10, which is provided below the flat head portion 9 of the bolt 6 at the tip of the piezoelectric element 5 and separated from the axis NA.
A chain line a in FIG. 3 indicates a vibration characteristic of the tip portion of the piezoelectric element 5. As shown in the drawing, the center of the piezoelectric element 5 is fastened by the bolt 6 and fixed to the arm 1. Therefore, the center of the piezoelectric element 5 hardly vibrates, and the peripheral portion farther from the center vibrates more. Therefore, by mounting the holding portion 8 to which the capillary tool 10 is attached at the lower portion of the flat head portion 9, that is, at the position corresponding to the peripheral portion of the piezoelectric element 5, the capillary tool 10 can be vibrated strongly.

【００１１】１１はキャピラリツール１０に装着された
ワイヤ、１２は基板、１３は基板１２に搭載された半導
体チップである。Reference numeral 11 is a wire mounted on the capillary tool 10, 12 is a substrate, and 13 is a semiconductor chip mounted on the substrate 12.

【００１２】本装置は上記のような構成より成り、次に
動作の説明をする。キャピラリツール１０を半導体チッ
プ１３の上方へ移動させ、そこでキャピラリツール１０
を下降させる。その際、圧電素子５を駆動してキャピラ
リツール１０を振動させながら、ワイヤ１１を半導体チ
ップ１３や基板１２の電極に押し付けてボンディングす
ることにより、半導体チップ１３と基板１２をワイヤ１
１により接続する。ここで、本手段は、上記従来手段の
ように、ホーンを介在させずに、圧電素子５により直接
キャピラリツール１０を駆動して振動させるようにして
いるので、キャピラリツール１０は強く振動し、上記ボ
ンディングを良好に行える。また、キャピラリツール１
０は、圧電素子５により直接駆動されるので、どのよう
な周波数であっても強く振動して、良好にボンディング
を行うことができる。The present apparatus has the above-mentioned structure, and its operation will be described below. The capillary tool 10 is moved above the semiconductor chip 13, and the capillary tool 10 is moved there.
To lower. At that time, the piezoelectric element 5 is driven to vibrate the capillary tool 10, and the wire 11 is pressed against the electrodes of the semiconductor chip 13 and the substrate 12 to bond the semiconductor chip 13 and the substrate 12 to each other.
Connect by 1. Here, unlike the above-mentioned conventional means, this means is designed to directly drive and vibrate the capillary tool 10 by the piezoelectric element 5 without interposing a horn. Therefore, the capillary tool 10 vibrates strongly, and Good bonding is possible. Also, the capillary tool 1
Since 0 is directly driven by the piezoelectric element 5, it vibrates strongly at any frequency and good bonding can be performed.

【００１３】[0013]

【発明の効果】以上説明したように本発明は、アームの
先端部に装着された圧電素子に押圧子を取り付けて、こ
の圧電素子により押圧子を直接駆動して振動させるよう
にしているので、どのような振動周波数であっても押圧
子を強く振動させて、良好なボンディングを行うことが
できる。As described above, according to the present invention, the pressing element is attached to the piezoelectric element mounted on the tip of the arm, and the pressing element is directly driven by the piezoelectric element to vibrate. It is possible to vibrate the presser strongly at any vibration frequency and perform good bonding.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明に係るボンディング装置の側面図FIG. 1 is a side view of a bonding apparatus according to the present invention.

【図２】同装置の要部分解斜視図FIG. 2 is an exploded perspective view of main parts of the device.

【図３】同装置の要部断面図FIG. 3 is a sectional view of the main part of the device.

【図４】従来のボンディング装置の側面図FIG. 4 is a side view of a conventional bonding apparatus.

【符号の説明】[Explanation of symbols]

１ アーム ３ 支持部 ５ 圧電素子 １０ 押圧子 1 Arm 3 Support 5 Piezoelectric Element 10 Presser

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】支持部に片持支持されたアームと、このア
ームの先端部に装着された圧電素子とを備え、この圧電
素子の先端部に押圧子を取り付け、この圧電素子により
この押圧子を直接駆動して振動させるようにしたことを
特徴とするボンディング装置。1. An arm, which is cantilevered by a support part, and a piezoelectric element mounted on the tip of this arm. A pusher is attached to the tip of this piezoelectric element. A bonding apparatus characterized in that it is directly driven to vibrate.
JP21203091A 1991-08-23 1991-08-23 Bonding equipment Expired - Fee Related JP3006192B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21203091A JP3006192B2 (en) 1991-08-23 1991-08-23 Bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21203091A JP3006192B2 (en) 1991-08-23 1991-08-23 Bonding equipment

Publications (2)

Publication Number Publication Date
JPH0555311A true JPH0555311A (en) 1993-03-05
JP3006192B2 JP3006192B2 (en) 2000-02-07

Family

ID=16615709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21203091A Expired - Fee Related JP3006192B2 (en) 1991-08-23 1991-08-23 Bonding equipment

Country Status (1)

Country Link
JP (1) JP3006192B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486733A (en) * 1992-12-24 1996-01-23 Kabushiki Kaisha Shinkawa Bonding apparatus
JPH08153758A (en) * 1994-11-28 1996-06-11 Nec Corp Device and method for ultrasonic wire bonding

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102102509B1 (en) 2017-12-27 2020-04-20 김석린 A case containing a fragrance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486733A (en) * 1992-12-24 1996-01-23 Kabushiki Kaisha Shinkawa Bonding apparatus
JPH08153758A (en) * 1994-11-28 1996-06-11 Nec Corp Device and method for ultrasonic wire bonding

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