JPH03245558A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH03245558A
JPH03245558A JP2246822A JP24682290A JPH03245558A JP H03245558 A JPH03245558 A JP H03245558A JP 2246822 A JP2246822 A JP 2246822A JP 24682290 A JP24682290 A JP 24682290A JP H03245558 A JPH03245558 A JP H03245558A
Authority
JP
Japan
Prior art keywords
resin
substrate
semiconductor chip
semiconductor device
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2246822A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0566024B2 (enrdf_load_stackoverflow
Inventor
Tasao Soga
太佐男 曽我
Mamoru Sawahata
沢畠　守
Takaya Suzuki
誉也 鈴木
Masatake Nametake
正剛 行武
Fumio Nakano
文雄 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2246822A priority Critical patent/JPH03245558A/ja
Publication of JPH03245558A publication Critical patent/JPH03245558A/ja
Publication of JPH0566024B2 publication Critical patent/JPH0566024B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2246822A 1990-09-17 1990-09-17 半導体装置 Granted JPH03245558A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2246822A JPH03245558A (ja) 1990-09-17 1990-09-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2246822A JPH03245558A (ja) 1990-09-17 1990-09-17 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1325234A Division JPH0639563B2 (ja) 1989-12-15 1989-12-15 半導体装置の製法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP08306742A Division JP3125137B2 (ja) 1996-11-18 1996-11-18 半導体装置

Publications (2)

Publication Number Publication Date
JPH03245558A true JPH03245558A (ja) 1991-11-01
JPH0566024B2 JPH0566024B2 (enrdf_load_stackoverflow) 1993-09-20

Family

ID=17154214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2246822A Granted JPH03245558A (ja) 1990-09-17 1990-09-17 半導体装置

Country Status (1)

Country Link
JP (1) JPH03245558A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883432A (en) * 1995-11-30 1999-03-16 Ricoh Company, Ltd. Connection structure between electrode pad on semiconductor device and printed pattern on printed circuit board
US6413624B1 (en) 1999-03-09 2002-07-02 International Superconductivity Technology Center Oxide superconductor and process for producing same
US7046110B2 (en) 2002-06-12 2006-05-16 International Superconductivity Technology Center, The Juridical Foundation Superconducting magnet made of high-temperature bulk superconductor and process of producing same
JP2009117607A (ja) * 2007-11-06 2009-05-28 Shinko Electric Ind Co Ltd 配線基板と半導体装置及びその製造方法
JP2010010694A (ja) * 2009-08-06 2010-01-14 Sony Chemical & Information Device Corp 接続構造体の製造方法
JP2014209570A (ja) * 2013-03-29 2014-11-06 オムロン株式会社 電子機器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS5756954A (en) * 1980-09-22 1982-04-05 Hitachi Ltd Resin-sealed electronic parts
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS5834824A (ja) * 1981-08-26 1983-03-01 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS5756954A (en) * 1980-09-22 1982-04-05 Hitachi Ltd Resin-sealed electronic parts
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS5834824A (ja) * 1981-08-26 1983-03-01 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883432A (en) * 1995-11-30 1999-03-16 Ricoh Company, Ltd. Connection structure between electrode pad on semiconductor device and printed pattern on printed circuit board
US6413624B1 (en) 1999-03-09 2002-07-02 International Superconductivity Technology Center Oxide superconductor and process for producing same
US7046110B2 (en) 2002-06-12 2006-05-16 International Superconductivity Technology Center, The Juridical Foundation Superconducting magnet made of high-temperature bulk superconductor and process of producing same
US8512799B2 (en) 2002-06-12 2013-08-20 International Superconductivity Technology Center, The Juridical Foundation Process of producing a superconducting magnet made of a high-temperature bulk superconductor
JP2009117607A (ja) * 2007-11-06 2009-05-28 Shinko Electric Ind Co Ltd 配線基板と半導体装置及びその製造方法
JP2010010694A (ja) * 2009-08-06 2010-01-14 Sony Chemical & Information Device Corp 接続構造体の製造方法
JP2014209570A (ja) * 2013-03-29 2014-11-06 オムロン株式会社 電子機器

Also Published As

Publication number Publication date
JPH0566024B2 (enrdf_load_stackoverflow) 1993-09-20

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