JPH0323602A - Manufacture of resistance network element - Google Patents

Abstract

PURPOSE:To obtain an element whose cost is low, whose performance is high and whose heat-resistant property is good by a method wherein a resistance material composed of a metal organic substance is printed and baked and a plurality of thin-film resistance films are formed. CONSTITUTION:An undercoat pattern 3 whose surface is smooth is formed on a heat-resistant insulating substrate 1. Then, a resistance material composed of a metal organic substance is printed on the pattern 3 and is baked; a thin-film resistance pattern 2 is formed. Then, a conductor pattern 4 composed of a thick-film conductor is formed so as to be connected to the pattern 2; an overpattern 5 with which the pattern 2 and the pattern 4 excluding one part are covered is formed. Thereby, an element whose performance is high and whose heat-resistant property is good can be obtained at a low cost. The pattern 4 may be formed after the pattern has been formed; and the resistance material may be printed on the pattern 5 and may be baked.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing resistor network elements used in high-density interconnect circuits.

Conventional technology In recent years, as the demand for lighter, thinner, and smaller electronic devices has increased, small resistance network elements have come to be used more and more as resistance elements on circuit boards in order to increase the packaging density. There is. In addition, in recent years, the precision of parts has increased,
As noise becomes lower, the demand for resistor network elements is increasing from thick-film types to thin-film types with high precision and low noise.

Part 6 about an example of a conventional small resistance network element
This will be explained using figures. (For example, see Japanese Patent Application Laid-Open No. 63-94603.) This figure is a perspective cutaway view of a parallel circuit type resistance network element. 32, a plurality of strip-shaped electrodes 33 facing the long sides thereof, and a plurality of thick film resistor elements 34 connecting these two electrodes are formed by printing or the like, and the L-shaped electrode 32 and the strip-shaped electrode 33 are formed by printing or the like. Terminals 36 are connected to the respective terminals by soldering, and then covered with a coating 36 of an insulating sealing material.

Problems to be Solved by the Invention However, the resistive network element manufactured by this manufacturing method had the following problems.

1. Since a thick film resistor (material is a metal mixture) is used, the resistance temperature characteristics are as large as approximately 200 ppIII/C, and the current noise characteristics are also approximately + at a resistance value of 100KΩ.
1011B is bad. (If a 1μV rip occurs at the IV voltage, O(1B) 2. In order to solve the problem in 1 above, high-precision thin film resistor network elements have been developed in recent years, but these resistor network elements are made by sputtering. Since a resistive film is formed, continuous processing is difficult, and mass production requires a large number of sputtering equipment, which results in higher production costs compared to thick resistive network elements.Furthermore, the heat treatment of the resistive film requires 360" C to 400℃, requiring heat treatment of approximately 500"C or more, and since a glass protective coating cannot be used, a resin protective coating must be used. For this reason, the heat resistance is lower than that of thick film resistor network elements. There are issues such as inferior gender.

In order to solve these problems all at once, it is an object of the present invention to provide a thin film resistance network element that is high-performance, inexpensive, and has good heat resistance.

Means for Solving the Problems In order to achieve the above objects, the present invention forms an undercoat pattern with a smooth surface on a heat-resistant insulating substrate, and prints a resistive material made of a metal organic substance on the undercoat pattern. A plurality of thin film resistor patterns are formed by baking, and a conductor pattern made of a thick film conductor is formed to connect the thin film resistor patterns, completely covering the thin film resistor pattern and partially covering the conductor pattern. except for forming an overcoat pattern. Alternatively, an undercoat pattern with a smooth surface is formed on a heat-resistant insulating substrate, a conductor pattern made of a thick film conductor is formed overlapping a part of the undercoat pattern, and the conductor pattern is connected to the conductor pattern on the undercoat pattern. A plurality of thin film resistance patterns are formed by printing and baking a resistance material made of a metal-organic substance, and an overcoat pattern is formed so as to completely cover the thin film resistance patterns and leave a part of the conductor pattern. It's something to shout about.

action As a result, the following effects can be obtained.

Multiple thin-film resistive films can be formed by printing and baking a resistive material made of a metal-organic substance rather than a metal mixture without using a sputtering device, which reduces production costs and makes it possible to create a device as inexpensive as a thick-film resistive network element. It is possible to provide a thin film resistor network element with high precision, low resistance temperature range, and low current noise at a price comparable to that of thin film resistor network elements.

Furthermore, since the thin film resistor is made by printing and firing a resistance material made of a metal-organic substance, a glass coat can be used as a protective coat, and the heat resistance can be improved compared to conventional thin film resistor network elements. Since the thin film resistor in the housing uses a resistive material with a certain amount of glass, low current noise can be achieved.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective cutaway view of a resistance network element according to an embodiment of ta1 of the present invention, FIG. FIG. 4 is a perspective cutaway view of the resistance network element of the example, FIG. 4 is a BB' cross-sectional view of the resistance network element of FIG.

(Example 1) A first example of the present invention will be described using FIGS. 1 and 2.

First, a 96 μmina substrate 1 with excellent heat resistance and insulation properties.
accept. Next, in order to smooth out the undulations and protrusions on the substrate where the resistor pattern 2 will be formed, an undercoat gas paste made of lead borosilicate glass is screen printed using a plurality of strip-shaped printing patterns. , with a penolet type continuous kiln! A plurality of undercoat patterns 3 are formed by baking at a temperature of 190° C. for 15 minutes at the peak and 2 hours at IN-OUT. Next, on top of each undercoat pattern 3, Ru
A resistive paste made of a metal-organic material containing 02 as a main component is screen printed. Then, in order to remove only the organic part of the metal-organic resistance paste and bake only the metal part into the undercoat pattern 3, it was heated in a continuous pot oven at a temperature of 640''C for 10 minutes at a peak time of 10 minutes. O
A plurality of thin film resistor patterns 2 are formed by baking by profile 1 with a UT time of 46 minutes. Next, a thick film silver paste is screen printed using an L-shaped pattern and a strip-shaped pattern so as to partially overlap the thin film resistor pattern 2, and is heated in a continuous firing furnace at a temperature of 600°C for a peak time. The conductor pattern 4 is formed by baking according to the profile of 6 minutes and XH-OUT 45 minutes. Furthermore, in order to protect the thin film resistor pattern 2, an overcoat glass paste made of lead borosilicate glass was screen printed so as to completely cover the thin film resistor pattern 2, and eoo"c was applied in a continuous firing furnace. peak time 1 at a temperature of
An overcoat pattern 6 is formed by baking for 6 minutes and IN-OU1' for 90 minutes using a profile μ. Next, in order to equalize the resistance values of the thin film resistor pattern 2, only the resistor pattern 2 is destroyed by a laser beam (oscillation frequency is 5 k}b output is 0.3 W) that passes through the overcoat pattern 6. , perform the correction of resistance value correction. Next, the terminal 6 is fixed to the conductor pattern 4 by soldering, and finally, the terminal 6 is sealed with a sealing resin 7 except for the tip portion.

Through the above steps, a resistive network element according to the first embodiment of the present invention is manufactured.

The resistance value variation, resistance temperature characteristic (TCR), current noise characteristic, and resistance value change due to heat resistance test (460'Q 10 minutes) of the resistor network element according to the first embodiment were compared with the conventional rectangular plate type thin film chip resistor. As a result, it was found that the resistance value variation, TCR, and current noise characteristics were equivalent to those of conventional thin film resistor network elements.As shown in Figure 6, in terms of heat resistance, it was found that Thin film resistive network elements are so superior.

In this first example, the conductor pattern was printed and fired after the metal-organic resistance paste was printed, but the same performance was obtained even if the metal-organic resistance paste was printed and fired after the conductor pattern was printed and fired.

(Embodiment 2) Next, a second embodiment of the present invention (q) will be described with reference to FIGS. 3 and 4.

The 96 anoremina substrate 11, which has excellent heat resistance and insulation properties, is accepted. Next, in order to smooth out the ridges and protrusions on the substrate where the resistor pattern 12 will be formed, an undercoat glass paste made of lead borosilicate glass is screen printed using a plurality of strip-shaped printing patterns. A plurality of undercoat patterns 13 are formed by firing in a VPT continuous firing furnace at a temperature of 900'C according to a profile of 15 minutes at the peak and 2 hours at IN-OUT. Next, on each undercoat pattern 13, a resistive paste made of a metal organic substance containing Ru02 as a main component is screen printed. Then, in order to remove only the organic components of the metal-organic resistance paste and bake only the metal components into the undercoat pattern 13, the heat treatment was performed using a VPT type continuous firing furnace at 640° C. for a peak time of 10 minutes.
- A plurality of thin film resistor patterns 12 are formed by baking with a profile μ with an OUT time of 46 minutes. Next, a thick film silver paste was screen printed using an L-shaped pattern and a strip-shaped pattern so as to overlap a part of the thin film resistor pattern 12, and was heated to a temperature of eoo°C using a continuous clay furnace.
The conductor pattern 14 is formed by baking according to a profile with a peak time of 6 minutes and an IN-OUT time of 45 minutes. Furthermore, in order to protect the thin film resistor pattern 12, an overcoat glass paste made of lead borosilicate glass was screen printed to completely cover the thin film resistor pattern 12, and then placed in a Peptide continuous firing furnace. Therefore, the overcoat pattern 16 is formed by firing at a temperature of SOO°C using a firing profile with a peak time of 16 minutes and an IN-0υT of 90 minutes. Next, in order to equalize the resistance values of the thin film resistor pattern 12, a laser beam (oscillation frequency is sk-an, output is 0.3
W), the resistance value is corrected by destroying only the thin film resistor pattern 12. Next, a thick film electrode is applied to the end surface of the base material 11 using a roller so as to be electrically conductive with the conductive pattern 14.
The end surface electrode pattern 1 was baked at a temperature of 0°C with a peak time of 16 minutes and an IN-OUT profile of 90 minutes.
6 is a formal precept.

Through the above steps, a resistive network element according to the second embodiment of the present invention is manufactured.

Comparison of resistance value variations, resistance temperature characteristics (TCR), current noise characteristics, and resistance value changes by heat resistance test (460'0 10 minutes) of the resistance network element according to the second embodiment with a conventional square plate type thin film chip resistor. As a result, it was found that the resistance value variation, TCR, and current noise characteristics were equivalent to those of conventional thin-film resistor network elements.
As shown in FIG. 6, it can be said that the heat resistance is superior to conventional thin film resistance network elements.

In this second embodiment, the metal-organic resistance paste is printed and baked after the conductor pattern 14 is printed, but the same performance can be obtained even if the conductor pattern 14 is printed and baked after the metal-organic resistance paste is printed. can get.

In a specific example, the firing temperature of the undercoat was 900°C, and the firing temperature of the metal-organic resistance paste was 640°C.
The firing temperature of the conductor pattern was set to 600"C, and the firing temperature of the overcoat glass paste was set to 600"C, but this does not limit the firing temperature.In addition, the metal-organic resistance paste preferably has Ru02 as its main component. A resistive paste should be used, but) ii-
Other metal-organic resistance pastes such as Or-based ones may also be used.

Effects of the Invention As is clear from the above explanation, according to the present invention, a plurality of thin film resistive films can be formed by printing and firing a resistive material made of a metal-organic material, thereby reducing production costs and making it possible to form thick film resistive network elements. It has high accuracy, low resistance temperature characteristics, and similar properties to thin film resistor network elements at a similar low price.
A thin film resistor network element with low current noise can be provided.

Since the thin film resistive film in the housing is printed and baked with a resistive material made of a metal-organic material, a glass coat can be used as a protective coat, and the heat resistance can be improved compared to conventional thin film resistive network elements.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway perspective view of a resistor network element according to a first embodiment of the present invention, FIG. Second aspect of the present invention
FIG. 4 is a partially cutaway perspective view of the resistive network element of the embodiment shown in FIG.
B' sectional view, FIG. 5 is an explanatory view showing the heat resistance performance of the resistance network element of the present invention, and FIG. 6 is a perspective view with a part of the conventional resistance network element cut away. 1.11...96 alumina substrate, 2.12...
...Thin film resistance pattern, 3,1.3...Undercoat pattern, 4.14...Conductor c/
-:/． 5. 1 5... Overcoat pattern, 6... Terminal, 7... Sealing resin, 16... End surface electrode pattern.

Claims (5)

[Claims] (1) An undercoat pattern with a smooth surface is formed on a heat-resistant insulating substrate, a plurality of thin film resistance patterns are formed by printing and baking a resistance material made of a metal organic substance on the undercoat pattern, and the thin film A resistor network element characterized in that a conductor pattern made of a thick film conductor is formed to connect the resistor patterns, and an overcoat pattern is formed by completely covering the thin film resistor pattern and excluding a part of the conductor pattern. manufacturing method. (2) Forming an undercoat pattern with a smooth surface on a heat-resistant insulating substrate, forming a conductor pattern made of a thick film conductor overlapping a part of the undercoat pattern, and forming the conductor pattern on the undercoat pattern. A plurality of thin film resistance patterns are formed by printing and firing a resistance material made of a metal-organic material so as to connect them, and an overcoat pattern is formed so as to completely cover the thin film resistance patterns and leave a part of the conductor pattern. A method for manufacturing a resistor network element, characterized by: (3) The method for manufacturing a resistance network element according to claim 1 or 2, wherein the undercoat pattern and the overcoat pattern are made of lead borosilicate glass, and the metal-organic resistance material is mainly composed of RuO_2. (4) The lead terminal is soldered to the part of the conductor pattern that is not covered by the overcoat pattern, and the entire resistive network element is molded with an insulating sealing material, leaving a part of the lead terminal. Claim 1
Or the manufacturing method of the resistance network element according to 2. (5) The resistance network element according to claim 1 or 2, characterized in that an end face electrode made of a conductive material is formed on the end face portion of the heat-resistant insulating substrate so as to overlap a portion of the conductor pattern that is not covered with the overcoat pattern. manufacturing method.