JPH0322920Y2 - - Google Patents
Info
- Publication number
- JPH0322920Y2 JPH0322920Y2 JP9839585U JP9839585U JPH0322920Y2 JP H0322920 Y2 JPH0322920 Y2 JP H0322920Y2 JP 9839585 U JP9839585 U JP 9839585U JP 9839585 U JP9839585 U JP 9839585U JP H0322920 Y2 JPH0322920 Y2 JP H0322920Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wiring board
- printed wiring
- semiconductor element
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9839585U JPH0322920Y2 (US08188275-20120529-C00054.png) | 1985-06-28 | 1985-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9839585U JPH0322920Y2 (US08188275-20120529-C00054.png) | 1985-06-28 | 1985-06-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS628643U JPS628643U (US08188275-20120529-C00054.png) | 1987-01-19 |
| JPH0322920Y2 true JPH0322920Y2 (US08188275-20120529-C00054.png) | 1991-05-20 |
Family
ID=30966292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9839585U Expired JPH0322920Y2 (US08188275-20120529-C00054.png) | 1985-06-28 | 1985-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322920Y2 (US08188275-20120529-C00054.png) |
-
1985
- 1985-06-28 JP JP9839585U patent/JPH0322920Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628643U (US08188275-20120529-C00054.png) | 1987-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH09213848A (ja) | 電子部品のヒートシンク | |
| JPH0322920Y2 (US08188275-20120529-C00054.png) | ||
| JPH0736468U (ja) | 電子部品の放熱構造 | |
| JPH07336009A (ja) | 半導体素子の放熱構造 | |
| JPH0617309Y2 (ja) | 半導体の放熱装置 | |
| JPH0343751Y2 (US08188275-20120529-C00054.png) | ||
| JPH0638431Y2 (ja) | ヒートシンク | |
| JPH0810230Y2 (ja) | 電気部品と放熱体の取付構造 | |
| JPS6246270Y2 (US08188275-20120529-C00054.png) | ||
| JPH0334914Y2 (US08188275-20120529-C00054.png) | ||
| JP2888192B2 (ja) | 表面実装部品の放熱構造 | |
| JPH09116284A (ja) | 放熱器 | |
| JP2940528B2 (ja) | トランジスタ組立取付用放熱板 | |
| JPS60121665U (ja) | 印刷配線板 | |
| JPH0316314Y2 (US08188275-20120529-C00054.png) | ||
| JPS6331400Y2 (US08188275-20120529-C00054.png) | ||
| JPH0445279Y2 (US08188275-20120529-C00054.png) | ||
| JPS6141240Y2 (US08188275-20120529-C00054.png) | ||
| JPS6228770Y2 (US08188275-20120529-C00054.png) | ||
| JPH0379447U (US08188275-20120529-C00054.png) | ||
| JPS6016582U (ja) | 集積回路実装構造 | |
| JPS63128742U (US08188275-20120529-C00054.png) | ||
| JPS605143U (ja) | ヒ−トシンク構造 | |
| JPH04130448U (ja) | 放熱装置 | |
| JPS58170845U (ja) | 半導体アンプ |
