JPH0322920Y2 - - Google Patents

Info

Publication number

JPH0322920Y2

JPH0322920Y2 JP9839585U JP9839585U JPH0322920Y2 JP H0322920 Y2 JPH0322920 Y2 JP H0322920Y2 JP 9839585 U JP9839585 U JP 9839585U JP 9839585 U JP9839585 U JP 9839585U JP H0322920 Y2 JPH0322920 Y2 JP H0322920Y2

Authority

JP

Japan

Prior art keywords

heat sink

wiring board

printed wiring

semiconductor element

heat

Prior art date

1985-06-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000004065 semiconductor Substances 0.000 claims description 15
• 230000017525 heat dissipation Effects 0.000 description 5
• 230000005855 radiation Effects 0.000 description 2
• 230000035939 shock Effects 0.000 description 2
• 229910000838 Al alloy Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1