JPH0322077B2 - - Google Patents
Info
- Publication number
- JPH0322077B2 JPH0322077B2 JP63133873A JP13387388A JPH0322077B2 JP H0322077 B2 JPH0322077 B2 JP H0322077B2 JP 63133873 A JP63133873 A JP 63133873A JP 13387388 A JP13387388 A JP 13387388A JP H0322077 B2 JPH0322077 B2 JP H0322077B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- circuit
- placement
- circuit board
- component storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000003463 adsorbent Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63133873A JPH01302899A (ja) | 1988-05-31 | 1988-05-31 | チツプ状回路部品配置装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63133873A JPH01302899A (ja) | 1988-05-31 | 1988-05-31 | チツプ状回路部品配置装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01302899A JPH01302899A (ja) | 1989-12-06 |
JPH0322077B2 true JPH0322077B2 (en, 2012) | 1991-03-26 |
Family
ID=15115066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63133873A Granted JPH01302899A (ja) | 1988-05-31 | 1988-05-31 | チツプ状回路部品配置装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01302899A (en, 2012) |
-
1988
- 1988-05-31 JP JP63133873A patent/JPH01302899A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01302899A (ja) | 1989-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR920002278B1 (ko) | 리드선이 없는 회로부품의 장착장치 | |
JPH0514000A (ja) | プリント配線基板保持装置 | |
JPH0586079B2 (en, 2012) | ||
US4851966A (en) | Method and apparatus of printed circuit board assembly with optimal placement of components | |
JPH0322077B2 (en, 2012) | ||
US6638785B2 (en) | Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making | |
JPH0586080B2 (en, 2012) | ||
JPH0810234Y2 (ja) | チップ状回路部品マウント装置 | |
JPH0322079B2 (en, 2012) | ||
JPH0586078B2 (en, 2012) | ||
JPS5856277B2 (ja) | 電子部品装着方法 | |
KR100839493B1 (ko) | 칩 트레이 | |
TWI662751B (zh) | 連接端子單元及電路板裝置 | |
US5145405A (en) | Chip connector structure | |
JPH034080Y2 (en, 2012) | ||
JPH0745899Y2 (ja) | 突出部を有する外部接続端子および当該外部接続端子を備えた混成集積回路装置 | |
JPH06103800B2 (ja) | チップ状回路部品マウント装置 | |
JPS6218066Y2 (en, 2012) | ||
JPS644673B2 (en, 2012) | ||
JPH0322960Y2 (en, 2012) | ||
JPH0353477Y2 (en, 2012) | ||
JPH073577Y2 (ja) | 混成集積回路装置 | |
JPH01278097A (ja) | チップ状回路部品配置装置 | |
JP2592027Y2 (ja) | 混成集積回路部品 | |
JPH0651031Y2 (ja) | チップ状電子部品マウント装置 |