JPH03217070A - Method and equipment for manufacturing printed circuit board - Google Patents

Abstract

PURPOSE:To prevent a printed circuit board from being damaged or smeared and enable it to be produced automatically by providing each specific printed circuit board setting process, printed circuit board positioning process, first press process, strip take-out process, strip positioning process, and second press process. CONSTITUTION:The process consists of a printed circuit board setting process A for setting a printed circuit board 1 in stages, a printed circuit board positioning process B for positioning it by taking in the printed circuit board 1 one by one with attraction and punching it in a strip shape, a first press process C for punching the printed circuit board 1 into a strip shape and at the same time retaining the strip-shaped printed circuit board 11 at an upper mold 31, a strip take-out process D for taking our the punched strip 11, a strip positioning process E for positioning for the purpose of punching the inside of the strip 11 into pieces, and a second press process F for punching the inside of the strip 11 into pieces. For example, for retaining the strip- shaped printed circuit board 11 in the above first process C, the punched strip 11 is retained onto the upper mold 31 of a first press machine 3 by fitting the die side surface of the upper mold 31 into the strip-shaped printed circuit board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a manufacturing method and manufacturing apparatus for automatically and continuously manufacturing printed circuit boards.

[Prior art]

Conventionally, printed circuit boards... By manual press machine. In a strip shape. It is then punched out into individual pieces.

That is, the printed circuit board is produced by punching out strips from a sheet-like substrate, and then punching out individual pieces of substrates from the strips.
A large number of them are manufactured (see FIGS. 2 to 4 below). In other words, the individual pieces of substrate obtained in this way. It is called a printed circuit board.

The printed circuit board is an individual printed circuit board such as a chip-on-board, and has a conductive circuit and a through hole (not shown) on the board.

[Problem to be solved]

However, the above conventional technology has the following problems.

That is, since the printed circuit board mentioned above is manufactured using a manual press machine, the punching process takes a long time. The work is complicated. Furthermore, it is easy to damage the substrate.

For example, when the punching process is completed. To remove the substrate from the mold of the manual press machine mentioned above. Blow air or use tools such as tweezers. Therefore, these tasks. This requires a lot of manual labor and is likely to cause damage or dirt to the conductor circuit on the surface of the board. As a result, product defects occur and yields decrease.

The present invention has been made in view of such conventional problems, and it is an object of the present invention to provide a method and apparatus for manufacturing a printed circuit board that can be automatically manufactured without damaging or staining the printed circuit board. It is.

[Means for Solving the Problems] The present invention includes a board setting process for setting boards in stacks. a substrate positioning step in which the substrates are taken in one by one by suction and positioned for punching out the substrates into strips;
A first pressing step in which the substrate is punched into strips and the strip-shaped substrate is held in an upper mold, a strip removal step in which the punched strips are taken out, and a strip positioning step in which the inside of the strip is positioned for punching out individual pieces. , a method for manufacturing a printed circuit board characterized by comprising a second pressing step of punching out the inside of the strip into individual pieces.

The most noteworthy feature of the present invention is that the substrates are taken in one by one by vacuum suction. A substrate positioning step in which the substrate is positioned for punching into strips, and a first pressing step in which the substrate is punched out into strips and the strip-shaped substrate is held in an upper mold. The present invention further includes a strip taking-out step of taking out the punched strip.

As a method for holding the strip-shaped substrate in the upper die, for example, there is a method in which a punched strip is held in the upper die of the first press machine by fitting the gouged side surface of the upper die and the strip-shaped substrate.

In addition, as a method for taking out the punched strips, for example, as shown in the example, a conveyor belt is slid under the upper die in the first press machine that holds the strips together, and the above-mentioned holding is carried out using hydraulic pressure. There is a method in which a cylinder is released and the strip is dropped onto the belt conveyor to automatically convey it.

In addition, the strips are formed by arranging a large number of individual substrates on a sheet substrate, for example, and punching out a group of such individual substrates into strips as a set (Fig. 2, (See Figure 3).

Also, punching out the inside of the strip into individual pieces means, for example, punching out individual pieces of printed circuit boards such as a plurality of chips on boards that the strip-shaped substrate has. Without individualization.
This refers to punching out pieces into a state that can be easily individualized.
(See Figure 4).

On the other hand, as a device for manufacturing the above printed circuit board. A board setting device that stacks and sets the board to input the board, a board positioning device that picks up the board by suction and punches it into strips, and a board positioning device that punches the board into the strip and holds the board in the upper die. The first press machine and. Consisting of a strip take-out device that takes out the punched strip from the first press, a strip positioning device that positions the inside of the strip for punching into individual pieces, and a second press that punches out the inside of the strip into individual pieces. There is a printed circuit board manufacturing device characterized by:

In the above manufacturing equipment. The most noteworthy thing is the substrate positioning process, which picks up the substrates one by one by suction and positions them for punching them into strips. A first press machine that punches out the substrate into strips and holds the substrate on an upper die, and a strip take-out device that takes out the punched strips from the first press are provided.

Further, as the first press machine for holding the strip on the upper mold, there is a device for holding the strip by contact resistance between the side surface of the goo part of the upper mold and the substrate.

[For production]

In the manufacturing method according to the present invention. The printed circuit board is manufactured using the following procedure.

That is. First, set the boards in stacks. Next, the substrates are picked up one by one by suction and positioned for punching out strips. Next, the substrate is punched out into a rectangular shape, and the rectangular substrate is held in an upper die. Then, take out the punched strip of paper. Next, position the inside of the strip for punching out individual pieces. Next, the inside of the strip is punched out into individual pieces using a second press machine.

After that... Such a substrate is subjected to a process such as cleaning.

On the other hand, a printed circuit board manufacturing apparatus is used to automatically manufacture the printed circuit board.

〔effect〕

As described above, according to the present invention, printed circuit boards can be automatically and easily manufactured.

therefore. No damage or dirt to the printed circuit board. A method and apparatus for manufacturing a printed circuit board that can be automatically manufactured can be provided.

〔Example〕

The manufacturing method according to the first example wood will be explained with reference to FIGS. 1 to 10.

That is, in the manufacturing method of this example, as shown in FIGS. 2 to 4, a sheet-like substrate 1 is punched out into strips 11, and the inside of the strips 11 is punched out into pieces holding individual substrates 120. It is something to do. The above board 1 is as shown in FIG. A large number of individual substrates 120 are arranged in parallel. It has sprockets 10 at the four corners.

Also. The strip 1l is made by arranging four pieces of the individual board 120 in a row. It has a rectangular shape. Further, the individual piece-shaped substrate 120 is as shown in FIG. In the processed substrate 12 punched into a "■" shape 125. It is supported by end pieces 111 at both upper and lower edges via legs 121.

That is, in the manufacturing method of this example, as shown in FIG.
A substrate setting step A in which the substrates are set in a stacked manner, a substrate positioning step B in which the substrates 1 are sucked and ordered and positioned for punching them into strips, and a substrate positioning step B in which the substrates 1 are punched out into strips and held in the upper mold. 1 press step C, strip take-out step D for taking out the punched strip 11, and strip positioning step E for positioning for punching into individual pieces.
and a second pressing step F in which the strips 11 are punched out into the processed substrate 12 having the individual substrates 120.

In the substrate setting step A, an operator sets the stacked sheet-like substrates 1 on the substrate setting table 101, and moves the substrates 1 together with the substrate setting table 101 to the substrate loading table 102.

As shown in FIG. 1, the substrate 1 has sprockets (holes) 10 at its four corners for positioning. Therefore. When the substrates 1 are stacked on the board setting table 101 and the substrate loading table 102, the positioning pins 103 set up on both tables are used. Insert the sprocket 10 mentioned above.

Next, in the substrate positioning step B, the substrate 1 is
Position to punch out into strips. That is, positioning is performed by suctioning the substrate 1 on the substrate loading table 102 with a suction bat 211 provided on a suction device 21, as shown in FIG. This is done by reciprocating between the H directions.

And the board 1 is. The board is inserted into the sprocket 20 and placed at a predetermined position on the board positioning table 2.

Next, in the first pressing step C, the substrate 1 is
It is punched out into a rectangular shape by the first press 3 and held. That is, the substrate 1 is as shown in FIG. From the substrate positioning process B, the substrate is automatically transported into the first press machine 3. As shown in FIG. 6, the substrate 1 is punched out while being pressed between the upper die 31 and the lower die 32 of the first press machine 3. That is, the upper mold 31 descends to the substrate l placed on the lower mold 32. Due to this. As shown in FIGS. 2 and 3, the sheet-shaped substrate 1 is... In the first press 3, it is cut into three elongated strips 11.

What should be noted here is that the cut strip 11 is... 7th
As shown in the figure, it is fitted and held within a goo portion 30 provided inside an upper mold 31.

In other words, the substrate 1 held by the upper mold 31 is as shown in FIG. The substrate 1 is held within the die portion 30 of the upper mold 31 due to the contact resistance between the side surface of the die portion 30 and the substrate l. Due to this.
The die part 30 is. As shown in FIG. 8, the strip l1 is raised together with the upper mold 31 while being fitted and held within the die portion 30.

Then, in the strip removal process D described above. The punched strip 11 is taken out from the first press machine 3. That is. When taking out the strip of paper 11 above. As shown in Figure 9. An upper mold 31 and a lower mold 3 which are opened at the top and bottom of the belt conveyor 4
Move it between 2 and 2.

Then, the strip 11 held by the upper mold 31 is dropped onto the heat converting hair 4. In other words, the die part 30
The pusher 34 is pushed out by the hydraulic cylinder 33. Due to this. The strip 11 held by the upper mold 31 is placed onto the elastic Helt Conhair 4. Drop it without damaging it. Next, as shown in FIG.
to move it to the left.

Next, in the strip positioning step E described above. Performs positioning for punching out individual pieces within the strip.

here. The strip 11 on the belt conveyor 4 is positioned by a suction bat 51 provided in the suction machine 5 as shown in FIGS. 1 and 12. roll con hair-62
This is done after moving to the strip positioning table 6 where is placed. That is. On the roll conveyor 62 is a substrate pusher 6.
1, an alignment guide 63, and a stopper 64. Due to this. The strip l1 is . The outer shape is automatically adjusted to a predetermined position on the strip positioning table 6.

In other words, the strip 11 moves in its traveling direction T. The substrate bushers 61 and stoppers 64 align the substrates. Also.
The above alignment guide 63b. The strips 11 are aligned in a direction perpendicular to the traveling direction T. The stopper 64 is.
It moves up and down by a cylinder (not shown). When transporting 1 liter of strips, it rises upward.

Next, in the second pressing step F, the inside of the strip 11 is punched out into a processed substrate 12 having individual pieces of substrate 120 using the second press machine 7. In other words, the above strip of paper II is. 1st
As shown in the figure. The above strip 1l is placed on the strip positioning table 6.
by a clamp (not shown). Upper mold 71 of second press 7
and the lower die 72. Then, by the operation of the second press machine 7. First, the inside of the strip 11 is punched out into a shape 125. Due to this. The strip 11 is as shown in FIG. 4 above. A processed substrate 12 having individual pieces of substrate 120 is punched out.

The punched plate 12 is a roll-conhaired plate.
By 8. It is automatically transported to the next cleaning process.

As described above, according to the manufacturing method of this example, printed circuit boards can be manufactured automatically and continuously.

Therefore, the printed circuit board will not be damaged or contaminated. Also. It is possible to reduce defects in printed circuit boards and save labor.

Second Embodiment A manufacturing apparatus according to this embodiment will be explained with reference to FIGS. 11 to 15.

That is, as shown in FIG. 11, the manufacturing apparatus of this example includes a substrate setting device P for setting the stacked substrates 1, a substrate positioning device S for punching out the substrates 1 into strips, and a substrate positioning device S for punching the substrates 1 into strips. a first press machine 3 that punches out the strips into strips, a strip take-out device Q that takes out the punched strips 11 from the first press machine 3, and a strip that positions the inside of the strips 11 for punching them into the shape of individual pieces of substrates 120. a positioning device R;
It consists of a second press machine 7 that punches out the inside of the strip 11 into individual pieces.

As shown in FIG. 13, the board setting device P includes a board setting table 101 for stacking the boards 1. It consists of a substrate loading table 102 that moves and stacks the substrates 1 in the J direction.

In the substrate setting table 101 and the substrate loading table 102, positioning pins 103 are provided upright at each of the four corners.

Also. As shown in FIG. 1, the substrate setting table 101 has a retaining hole for fitting into an engaging protrusion erected on the substrate loading table 102. Then, the board setting table 101 and the board loading table 102 are installed. Overlap using the above engagement protrusion and retaining hole.

Further, when the board 1 on the board setting table 101 runs out, it is used by replacing the position with one of the two board loading tables l02 installed in the JO direction.

That is, the positioning pin 103 is for inserting the substrate 1 (see Fig. 2). As a result, the board 1 is transferred to the board loading table 101 and the board loading table 102.
Above. Stack.

The substrate positioning device S has a suction pad 2 above it.
An adsorption machine 21 having 11 is provided.

The suction device 2l is arranged on a rail 213 so that it can slide between the H directions. Also, the adsorption 81!2
1 has a first drive device 212 so as to be able to slide on the rails 213. In addition, the board positioning table 2 is as shown in FIG.
It has positioning pins 20 at the four corners. and. The substrates 1 stacked on the substrate loading table 102 are moved to the substrate positioning table 2 . That is, the suction machine 21 reciprocates between the H directions. Due to this. Above board positioning stand 2
The upper part is configured so that the substrate 1 can be automatically moved from the substrate loading table 102.

The first press machine 3 is. It consists of an upper mold 31, a lower mold 32, and a crank type press 33.

That is, the first press machine 3 punches out the substrate 1 into a strip shape. This is a device for holding a strip-shaped substrate on the upper mold 31 (see FIG. 5).

An oil feed pipe 301 for sending back oil from the hydraulic machine 33 is connected to the die portion 30 (see FIG. 7). What should be noted here is that the punched strips of paper 11
The structure is such that as the upper mold 31 rises, it is automatically held by the die portion 30 in the upper mold and moves upward.

Also. The first press machine 3, as shown in FIG. 15, has a fixing clamp section 34 and a constant pitch feeding section 35 operated by a servo motor. In addition, the number 32 in the figure
is a mold.

The strip positioning device R mentioned above is. HELT CONHAIR 4 and. Strip positioning base 6 and. A suction machine 5 moves back and forth between the two.
It becomes more. The helt conveyor 4 is arranged to slide in the direction L of the first three presses.

That is, as shown in Figure 12. The belt conveyor 4 has a guide 42 below for sliding movement on the rail 41 in the L direction. Also, above Heltkonhair 4. A rail 51 for sliding the suction device 5 in the M direction is provided. The suction device 5 has a suction pad 52 at the bottom and a guide 53 at the top. Moreover, the above-mentioned strip positioning table 6 is a roll-con hair-6
Place it on 2. That is, the strip positioning table 6 is arranged on the roll conveyor 62 so that the strip 11 positioned on the strip positioning table 6 is dynamically conveyed to the second press machine 7 for the next process.

The second press machine 7 is. Upper mold 71 as shown in Fig. 11
It consists of a lower mold 72 and a crank type press 73. That is,
The second press machine 7 is . The inside of the above strip ll is the individual piece-shaped substrate 12.
This is for punching into the shape of 0 (see Fig. 4). Therefore, the second press machine 7 is equipped with the hydraulic machine 7.
3, the upper die 71 rises and falls, and the strip l
The inside of the substrate 120 is punched out into the shape of the individual piece-shaped substrate 120.

And behind the second press machine 7. As shown in FIG. 11, the processed substrate 12 is transferred to the cleaning machine 9 for the next process. A roll conveyor 8 is provided for automatic conveyance.

Next, the effects will be explained.

That is, in the manufacturing equipment of this example. Board set stand 101
13, the substrates 1 stacked on the substrate setting table 101 are moved in the J direction. Move onto the substrate loading table 102.

In addition, the stacked substrates 1 are as follows. As shown in Figure 12. By reciprocating the suction device 21 in the H direction by the operation of the first driving device 212, the suction device 21 is automatically and continuously moved onto the substrate positioning table 2.

Due to this. The substrate 1 is positioned on the substrate positioning table 2.

As shown in FIG. 15, the substrate 1 is automatically and continuously supplied to the first press 3 for the next process in a positioned state. That is. Because the first press 3 has a constant pitch feeding section 35 in the front-rear direction. The substrate 1 is automatically and continuously fed into the press 3.

next. The positioned substrate 1 is then punched out with its four corners fixed by the fixing clamps 34. As a result, the substrate 1 is punched into strips I1 (see FIG. 3).

Further, the punched strip 11 is removed as the upper die 31 rises. It is held by the upper mold 31 in the same manner as described in the first embodiment (see FIGS. 6 and 7).

Next, in the strip positioning device Q, the belt conveyor 4 is slid in the L direction by the operation of the guide 42 (see FIG. 8). The belt conveyor 4 is... It stops between the upper mold 31 and the lower mold 32 (see FIG. 9).

Next, the strip 11 that fell onto the belt conveyor -4 is -
By the operation of the guide 42 and the substrate pusher 61, the substrate is automatically and continuously transported in the M direction (see FIG. 10). At this time. The strip of paper 11 above is. It comes into contact with the stopper 64 mentioned above. In addition, the alignment guide 6 is provided on the side of the strip 11.
3 comes into contact. Due to this. The strip l1 above is. Align in the traveling direction T and a direction perpendicular to this.

Next, the strip 11 is positioned on the strip positioning table 6 so that the inside thereof can be punched out into individual pieces.

Then, the positioned strip 1l is processed by the second press machine 7, and the processed substrate l having the individual piece-shaped substrate 120 is processed.
2 is punched out. As a result, a processed substrate 12 is obtained (see FIG. 4). Next, the processed substrate 12 is sent to a cleaning machine 9 by a roll converter 8.

As described above, according to this example, printed circuit boards can be manufactured automatically, continuously, and easily.

Therefore, according to the wood example manufacturing apparatus, it is possible to obtain the same effects as in the first embodiment.

[Brief explanation of drawings]

Figures 1 to 10 show a method for manufacturing a printed circuit board according to the first embodiment, and Figure 1 is a process diagram of the method for manufacturing a printed circuit board, and Figure 2 is a plan view of a sheet-like board. Fig. 3 is a plan view of the strip, Fig. 4 is a plan view of the processed substrate, Figs. 5 to 10 are illustrations of the operation of the first press, and Figs. 11 to 15 are for the second embodiment. Figure 11 is a perspective view of the manufacturing equipment. Figure 12 is its side view. Figure 13 is a perspective view of the board setting device. Figure 14 is a perspective view of the board positioning stand, Figure 15
The figure is a plane view showing the fixed state of the substrate in the first press machine. 1. ．． ．． Base, 101. ,, Board setting stand, 102. ．． 103. ．． 1 1. ．． ．． 12. ．． ．． 1 20, 2. 、． 20. ．． ．． 3. ．． ．． 30. ．． ．． 31. ．． ．． 32. ．． ．． 4. ．． ．． 5. ．． ．． 6. ．． ．． 7. ．． ．． ．． Board loading table, ． Locating pin, strip processed board. Individual board positioning stand. Positioning bin, 1st press die section upper die, lower die, belt conveyor adsorption machine strip positioning stand, 2nd press machine,

Claims (2)

[Claims] (1) A board setting process in which the boards are set in stacks; a board positioning process in which the boards are picked up one by one by suction and then positioned for punching out the boards into strips; The first pressing process holds the board in the upper mold, the strip take-out process takes out the punched strips, the strip positioning process positions the inside of the strip for punching into individual pieces, and the punching inside the strip into individual pieces. A method for manufacturing a printed circuit board, comprising a second pressing step. (2) A board setting device that inputs the boards and sets them in a stack; a board positioning device that picks up the boards by suction and punches them into strips; a first press machine that holds the punched strips, a strip take-out device that takes out the punched strips from the first press machine, a strip positioning device that positions the inside of the strips for punching them into individual pieces, and a strip positioning device that positions the inside of the strips for punching them into pieces. A printed circuit board manufacturing device comprising a second punching press machine.