JPH03214761A - Hermetically sealed terminal and manufacture thereof - Google Patents
Hermetically sealed terminal and manufacture thereofInfo
- Publication number
- JPH03214761A JPH03214761A JP1126790A JP1126790A JPH03214761A JP H03214761 A JPH03214761 A JP H03214761A JP 1126790 A JP1126790 A JP 1126790A JP 1126790 A JP1126790 A JP 1126790A JP H03214761 A JPH03214761 A JP H03214761A
- Authority
- JP
- Japan
- Prior art keywords
- outer ring
- metal outer
- molded body
- gold
- auxiliary member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000002184 metal Substances 0.000 claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 59
- 238000003780 insertion Methods 0.000 claims abstract description 17
- 230000037431 insertion Effects 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims description 37
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 35
- 229910052737 gold Inorganic materials 0.000 claims description 35
- 239000010931 gold Substances 0.000 claims description 35
- 239000011521 glass Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
- 229910052709 silver Inorganic materials 0.000 description 14
- 239000004332 silver Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000005219 brazing Methods 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000004663 powder metallurgy Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010897 surface acoustic wave method Methods 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241001137251 Corvidae Species 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、圧カセンサや半導体装置等に使用される気密
端子及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an airtight terminal used in pressure sensors, semiconductor devices, etc., and a method for manufacturing the same.
１
［従来技術］
気密端子には種々のタイプのものかあるが、その一つと
して、第４図に示すような圧力センサに使用されるもの
かある。1 [Prior Art] There are various types of airtight terminals, one of which is the one used in a pressure sensor as shown in FIG.
この圧力七ンリは、金属外環１の中央の開口、例えば、
通気孔２に気体導入用のパイブ３を例えば、銀ロウ１］
けずろと共に、その閤りの複数のリード挿通孔４にリー
ド５をそれそれ挿通してカラス６て封着してなる気密端
子か使用される。二の気密端子は、その後、金属外環１
及ひ銀ロウ付けされたバイブ３の表面に金めつきを施し
て金めつき層１１を形成してから、シリコン台座７を金
属外環１０通気孔２の闇紗部に気密；こ固着すると共に
、該シリコン台座７に圧力検知用のダイアフラム８を気
密：こ取イ」けてりーＩｓ’ ５とワイヤボンデイング
し、その上からキャップ９を被せ金属外環１の周囲で気
密に固着したものである。This pressure is applied to the central opening of the metal outer ring 1, for example.
For example, insert a pipe 3 for introducing gas into the ventilation hole 2 using silver solder 1]
In addition to the slot, an airtight terminal is used in which the leads 5 are individually inserted into a plurality of lead insertion holes 4 of the slot and sealed with a crow 6. The second airtight terminal is then connected to the metal outer ring 1
After applying gold plating to the surface of the silver-brazed vibrator 3 to form a gold plating layer 11, the silicon pedestal 7 is airtightly fixed to the dark gauze portion of the metal outer ring 10 and the vent hole 2. At the same time, a diaphragm 8 for pressure detection is airtightly wire bonded to the silicon pedestal 7, and a cap 9 is placed on top of the diaphragm 8, and the diaphragm 8 is airtightly fixed around the metal outer ring 1. It is.
この圧力七ンサに使用されろ上記策密端子は、その金属
外環１の表面か金めつき層１１て被覆されており、しか
して、シリコン台座７は、加熱に−２一
よりシリコン台座７と金めっき層１１の接合界面に形成
される金−シリコンの共晶く図示せず）によって金属外
環１の通気孔２の周縁部に気密に固着されている。The surface of the metal outer ring 1 of the above-mentioned tight terminal used in this pressure sensor is coated with a gold plating layer 11, and the silicon pedestal 7 is heated by -21. The metal outer ring 1 is airtightly fixed to the peripheral edge of the vent hole 2 by a gold-silicon eutectic (not shown) formed at the bonding interface between the metal outer ring 1 and the gold plating layer 11.
［発明が解決しようとする課題コ
しかしながら、上記気密端子では、金属外環１の通気孔
２にパイブ３を銀ロウイ」けして金めつきを施すと、シ
リコン台座７の固着時の加熱により、銀コウ１寸け部１
２内の銅成分が金めっきＮ１１内に拡散し易く、銀ロウ
付け部１２表面が変色したり、銀ロウ中の銅成分の金め
っきＮ１１への拡散による｝戒少によって固着強度の低
下か生し易く、場合によっては、パイブ３が脱落すると
いった問題があった。[Problems to be Solved by the Invention] However, in the above-mentioned airtight terminal, when the pipe 3 is silver-plated into the vent hole 2 of the metal outer ring 1, heat generated when the silicon pedestal 7 is fixed, Ginkou 1 dimension part 1
The copper component in the silver solder may easily diffuse into the gold plating N11, resulting in discoloration of the surface of the silver soldering part 12, or a decrease in bonding strength due to the diffusion of the copper component in the silver solder into the gold plating N11. In some cases, the pipe 3 may fall off.
そのため、金めつき層１１を形成する前に、金属外環１
と該金属外環１に銀ロウＩｔ ！ｊされたパイブ３との
表面に無電界のニッケルめっきを施してニッケルめっき
Ｎ（図示せず）を形成してから金めつき層１１を形成し
、銀ロウ付け部１２内の銅成分の金めっきｉｌｌへの拡
散防止を図ることも−３−
あるか、上記ニッケルめっき層を形成する作業工程が増
え、原価上昇の原因になるといった問題かあった。Therefore, before forming the gold plating layer 11, the metal outer ring 1
And silver solder It! on the metal outer ring 1! After applying electroless nickel plating to the surface of the pipe 3 which has been pierced to form a nickel plating N (not shown), a gold plating layer 11 is formed, and the gold of the copper component in the silver soldered part 12 is removed. There is also a problem in that it is necessary to prevent diffusion into the plating illumination, and the number of work steps for forming the nickel plating layer increases, which causes an increase in cost.
また、金属外環１とバイブ３とを銀ロウ付けするため、
両方の部品を一対で準備する必要があり、部品点数が多
くなるといった問題もあり、各部品の保管場所等の管理
がたいへんであった。In addition, in order to silver-braze the metal outer ring 1 and the vibe 3,
Both parts had to be prepared as a pair, which caused problems such as an increase in the number of parts, and it was difficult to manage the storage locations of each part.
同様の問題は、例えは、弾性表面波素子用や半導体装置
用ステムにおける金属外環とアースリードとの銀ロウ付
け郎分においても生じる。A similar problem occurs, for example, in silver brazing between a metal outer ring and a ground lead in a stem for a surface acoustic wave element or a semiconductor device.
［課題を解決するための手段］
上記課題を解決するため本発明の気密端子は、リード挿
通孔を有する金属外環と該金属外環に取付く補助部ｔ才
とを一体化し・た成形１本の前記リード挿通口にリード
を挿通し、各リードをカラス封着すると共に、前記成形
体の表面を直接金めっき層にて被覆したことを特徴とす
る。[Means for Solving the Problems] In order to solve the above problems, the airtight terminal of the present invention is a molded terminal in which a metal outer ring having a lead insertion hole and an auxiliary part attached to the metal outer ring are integrated. The book is characterized in that a lead is inserted into the lead insertion opening of the book, each lead is glass-sealed, and the surface of the molded body is directly coated with a gold plating layer.
また、本発明の気密端子の製造方法は、複数のリード゛
挿通孔を有する金属外環と該金属外環に取付く補助部材
とを一体化した成形１本を形成し、該４−
成形体の上記金属外環の複数のりート挿通孔にそれぞれ
りーＩ・を挿通してガラス封着した後、上記成形体に直
接金めっきを施して表面を直接金めっき層にて被覆する
ことを特融とする。Furthermore, the method for manufacturing an airtight terminal of the present invention includes forming one molded product in which a metal outer ring having a plurality of lead insertion holes and an auxiliary member attached to the metal outer ring are integrated, and A special feature of the present invention is to insert the grooves I into the plurality of groove insertion holes of the metal outer ring and seal them with glass, and then directly apply gold plating to the molded body to directly cover the surface with a gold plating layer. To melt.
［作用コ
上記構成の気密端子では、金属外環と該金属外環に取付
く補助部材とを一体化して成形しているため、補助部材
を別途準備する必要がなくなり、表面を直接金めっき層
にて被覆しても従来のように補助部材と金属外環との連
結部分が銀ロウ材によって接合されていないため、銀コ
ウ材中の銅成分が金めつき層に拡散して変色したり、連
結強度が低下して補助部ｔ才が脱落することがなくなる
。[Operation] In the airtight terminal with the above configuration, the metal outer ring and the auxiliary member attached to the metal outer ring are integrally molded, so there is no need to separately prepare the auxiliary member, and the surface is directly coated with the gold plating layer. Even if the auxiliary member and the metal outer ring are coated with gold, unlike conventional methods, the connecting part between the auxiliary member and the metal outer ring is not bonded with silver brazing material, so the copper component in the silver brazing material may diffuse into the gold plating layer and cause discoloration. This prevents the auxiliary part from falling off due to a decrease in connection strength.
また、本発明では、金属外環と該金属外環に取付く補助
部ｔ才を一体化してた成形体を形成してから、該成形体
の金属外環の複数のりート挿通孔にリー１・を挿通し・
てガラス到着が行える。各リード゛をガラス到着した成
形体に直接金めっきを施して該成形体の表面を金めつき
層にて被覆すると、補助部材と金属外環との連結部分か
銀ロウ材によっ５
て接合されないため、銀コウ材中の銅成分か金めつき層
に拡散して連結部分が変色したり、連結強度が低下して
補助部材が脱落する心配はない。In addition, in the present invention, after forming a molded body in which a metal outer ring and an auxiliary part attached to the metal outer ring are integrated, the molded body is inserted into a plurality of thread insertion holes in the metal outer ring of the molded body. Insert 1.
You can arrive by glass. When each lead is directly gold-plated on the glass molded body and the surface of the molded body is coated with a gold plating layer, the connection part between the auxiliary member and the metal outer ring is joined with silver brazing material. Therefore, there is no need to worry about the copper component in the silver plated material diffusing into the gold plating layer, causing discoloration of the connecting parts, or reducing the strength of the connections, causing the auxiliary members to fall off.
［実施例］ 以下、図面を参照して本発明の一実施例を説明する。[Example] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例に係る気密端子の断面図であ
り、第２図は同気密端子の要部拡大断面図である。図に
示す気密端子は、例え（！．、圧カセンサ用に使用され
る気密端子てあり、金属外環２１と該金属外環２１に取
付けられる補助部材２２としてのパイプを一体で成形し
た成形体２０を設けた点を除き、既述した従来の気密端
子と同様の構造を呈している。FIG. 1 is a sectional view of an airtight terminal according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view of a main part of the airtight terminal. The airtight terminal shown in the figure is, for example, an airtight terminal used for a pressure sensor, and is a molded body made by integrally molding a metal outer ring 21 and a pipe as an auxiliary member 22 attached to the metal outer ring 21. The terminal has the same structure as the conventional airtight terminal described above except that the terminal 20 is provided.
即ち、上記成形体２０の金属外環２１は、従来同様、中
央に例えは、通気孔２が形成され、この通気孔２の周り
に、複数（この実施例では４つ）のリード′挿通孔４か
穿孔ざれ、外周縁にキャップ９を固着する段部２３がｌ
ｖＩ設ざれている。一方、補助部｛４２２は上記通気孔
２の下面周縁部に連結−６
一体化された気体導入用のバイブとなっている。That is, as in the conventional case, the metal outer ring 21 of the molded body 20 has, for example, a ventilation hole 2 formed in the center, and a plurality of (four in this embodiment) lead insertion holes around the ventilation hole 2. 4 is perforated, and the stepped portion 23 for fixing the cap 9 to the outer periphery is l.
vI is established. On the other hand, the auxiliary part 422 is connected to the peripheral edge of the lower surface of the vent hole 2 and serves as a vibrator for introducing gas.
そして、成形体２の金属外環２１の上記リード挿通孔４
にそれぞれリード５が挿入されてガラス６にてガラス封
着され、さらに、成形体２０の表面全体が、第２図に示
すように、金めっき１２４で被覆ざれている。Then, the lead insertion hole 4 of the metal outer ring 21 of the molded body 2
A lead 5 is inserted into each of the molded bodies 20 and sealed with a glass 6, and the entire surface of the molded body 20 is coated with gold plating 124, as shown in FIG.
上記構成の気密端子の製造方法としては、まず、図示し
ていないが、金属外環２１と補助部材２２を一体とした
型を形成し、この型因に金属粉末を充填して加圧加熱す
る、いわゆる粉末冶金法により成形体２０が成形される
。このとき、金属外環２１と補助部材２２の連結部分が
一体に成形されるため、従来のように銀ロウ付けを行っ
て接続する必要がなくなり、工数低減が図れる。As for the manufacturing method of the airtight terminal having the above structure, first, although not shown, a mold is formed in which the metal outer ring 21 and the auxiliary member 22 are integrated, and the mold is filled with metal powder and heated under pressure. The compact 20 is formed by a so-called powder metallurgy method. At this time, since the connection portion between the metal outer ring 21 and the auxiliary member 22 is integrally molded, there is no need for silver brazing to connect the metal outer ring 21 and the auxiliary member 22 as in the past, and the number of man-hours can be reduced.
成形体２０を成形すると、金属外環２１の各リード挿通
孔４にそれぞれリード５を挿通し、該リード５；こカラ
ス６を外嵌して加熱溶融し、各りード５をリード挿通孔
４内にガラス封着する。After forming the molded body 20, the leads 5 are inserted into the respective lead insertion holes 4 of the metal outer ring 21, and the leads 5 and the crows 6 are fitted onto the outside and heated and melted. Sealed with glass inside.
各リード５をリード挿通孔４内にカラス封着すると、成
形体２０に金めつきを施し、表面に金め＝７−
っき１２４を積層させて気密端子が製造される。After each lead 5 is glass-sealed in the lead insertion hole 4, the molded body 20 is gold-plated, and gold plating 124 is laminated on the surface to produce an airtight terminal.
このとき、金属外環２１と補助部材２２との連結部分は
一体となっているので、従来のように銀ロウ付を行なわ
ないため、成形体２００表面を直接金めっき層２４て被
覆しても、連結部分に従来のようｔこ変色が生じたり、
銀ロウ祠中の銅成分が金めつき層２４内に拡散して連結
部分の連結強度を低下させることは全くなく、補助部材
２２が金属外環２１より脱落する心配がない気密端子と
なる。At this time, since the connecting portion between the metal outer ring 21 and the auxiliary member 22 is integrated, silver brazing is not performed as in the conventional case, and the surface of the molded body 200 can be directly coated with the gold plating layer 24. , discoloration may occur at the connecting part as usual,
The copper component in the silver solder does not diffuse into the gold plating layer 24 and reduce the connection strength of the connection part at all, resulting in an airtight terminal in which there is no fear that the auxiliary member 22 will fall off from the metal outer ring 21.
上記製造方法によって製造される本発明の気密端子は、
例えば、圧力センサに使用される。この組立は、第１図
に一点鎖線で示すように、成形体２０の金属外環２１の
通気孔２の周縁部にシリコン台座７が載置され、加熱に
よって成形体２０表面の金めつき層２４の金成分と、シ
リコン台座７のシリコン成分が、その接合界面に金一シ
リコン共晶層（図示せず）を形成し、シリコン台座７か
気密に金属外環２１に固着される。このとき、金めっき
Ｍ２４の厚みが１．２μｍより薄いと、充分な金一シリ
コン共晶層の形成が困難となり、シ一８一
リコン台座７の固着強度や気密性の低下を招くおそれが
あるので、上記金めっき層２４の厚みは１．２μｍ以上
であることか好ましい。The airtight terminal of the present invention manufactured by the above manufacturing method includes:
For example, it is used in pressure sensors. In this assembly, as shown by the dashed line in FIG. 1, a silicon pedestal 7 is placed on the periphery of the vent hole 2 of the metal outer ring 21 of the molded body 20, and the gold-plated layer on the surface of the molded body 20 is heated. The gold component 24 and the silicon component of the silicon pedestal 7 form a gold-silicon eutectic layer (not shown) at their bonding interface, and the silicon pedestal 7 is hermetically fixed to the metal outer ring 21. At this time, if the thickness of the gold plating M24 is thinner than 1.2 μm, it will be difficult to form a sufficient gold-silicon eutectic layer, which may lead to a decrease in the adhesion strength and airtightness of the silicon pedestal 7. Therefore, the thickness of the gold plating layer 24 is preferably 1.2 μm or more.
シリコン台座７が金属外環２１に気密に固着されると、
該シリコン台座７に圧力検知用のダイアフラム８が気密
に取付けられる。そして、このダイアフラム８の各端子
と各リード５とがワイヤボンディングざれ、その上から
キャップ９が被せられて金属外環２１の周縁段部２３て
気密に固着され、圧カセンサが組立てられる。When the silicon pedestal 7 is hermetically fixed to the metal outer ring 21,
A pressure sensing diaphragm 8 is airtightly attached to the silicon pedestal 7. Then, each terminal of this diaphragm 8 and each lead 5 are wire-bonded, a cap 9 is placed over the cap 9, and the cap 9 is hermetically fixed to the peripheral step 23 of the metal outer ring 21, thereby assembling a pressure sensor.
このように、圧カセンサに使用される上記気密端子は、
金属外環２１と補助部ｔオ２２とが一体成形されるた成
形体２０となるため、強度的にも強くなり、また、従来
のように両部材を接合する作業が不要となり工数の低減
が図れ、部品点数も半減し、部品管理か容易となる。さ
らに、金属外環２１と補助部材２２との連結部分に銀ロ
ウ付けを行うことなく一体に連結されるため、表面に金
めつきを施す前にニッケルめっきを施して銀ロウ材中の
銅成分の金めっきへの拡散を防止するニッケ−９−
ルめっき層を形成する必要がなく、さらに工数の低減が
図れるようになる。In this way, the airtight terminal used in pressure sensors is
Since the metal outer ring 21 and the auxiliary part 22 are integrally molded to form the molded body 20, the strength is increased, and there is no need to join the two parts as in the past, reducing the number of man-hours. This reduces the number of parts by half, making parts management easier. Furthermore, since the metal outer ring 21 and the auxiliary member 22 are integrally connected without silver brazing at the connection part, nickel plating is applied before gold plating on the surface to prevent the copper content in the silver brazing material. There is no need to form a nickel-9-plated layer to prevent diffusion of nickel into the gold plating, and the number of steps can be further reduced.
尚、本発明は上記した圧カセンサ用の気密端子に限られ
るものでなく、第３図に示すような気密端子てあっても
よい。該気密端子は、例えは、弾性表面波素子用の気密
端子であり、該気密端子の成形体３０は、金属外環３１
と該金属外環３１の下端に一体で例えは、粉末冶金法に
よって一体成形された補助部祠３２となるアースリ−１
・よりなり、その表面全体を直接金めっきＮ３３ζこで
被覆したものである。Note that the present invention is not limited to the above-described airtight terminal for a pressure sensor, but may also be an airtight terminal as shown in FIG. The airtight terminal is, for example, an airtight terminal for a surface acoustic wave element, and the molded body 30 of the airtight terminal has a metal outer ring 31.
An earth ring 1 is integrated with the lower end of the metal outer ring 31 and serves as an auxiliary part shrine 32, which is integrally formed by powder metallurgy.
・The entire surface is directly coated with gold plating N33ζ.
上記の気密端子においては、成形体３０の金属外環３１
に穿孔されたリード挿通孔３４にシールリード３５を挿
通してカラス３６によってカラス封着してから、表面に
金めつきを施すことかできるので、従来のように金属外
環３１にアースリ一Ｆとなる補助部材３２を銀ロウ付け
して取付けることなく、一体の成形体３０に金めつきを
直接施すことができ、上記実施例と同様に工数の低減や
部品点数を減少させることかでき、金属外環：〕１−１
０
と補助部材３２との連結部分の連結強度が低下して補助
部材３２が脱落する心配がなくなる。In the above airtight terminal, the metal outer ring 31 of the molded body 30
Since the seal lead 35 can be inserted into the lead insertion hole 34 drilled in the metal outer ring 31 and then sealed with a crow 36, the surface can be gold plated. It is possible to directly apply gold plating to the integral molded body 30 without attaching the auxiliary member 32 by silver soldering, and as in the above embodiment, it is possible to reduce the number of man-hours and the number of parts. Metal outer ring:〕1-1
There is no need to worry about the auxiliary member 32 falling off due to a reduction in the connection strength of the connection portion between the auxiliary member 32 and the auxiliary member 32.
この気密端子を用いた弾性表面波素子では、シリコン製
のペレッ１・３７を金属外環３１上に支持して加熱する
ことによって上記実施例と同様に表面の金めつき層３３
によって金一シリコン共晶体が形成されてベレッＩ・３
７が確実に固着され、キャップ３８を被せて組立てられ
る。In the surface acoustic wave element using this airtight terminal, by supporting the silicon pellets 1 and 37 on the metal outer ring 31 and heating them, the gold-plated layer 33 on the surface is removed in the same manner as in the above embodiment.
A gold-silicon eutectic is formed by Beret I.3.
7 is securely fixed, and the cap 38 is put on and assembled.
尚、上記実施例では成形体２０．３０を粉末冶金法にて
一体で成形したが、金属外環２１．３１と一体となる補
助部材２２．３２の突出長さが比較的短ければプレス加
工等によって一体成形してもよい
［発明の効果コ
以上の説明から明らかなように、本発明の気密端子とそ
の製造方法によれは、金属外環と補助部材とを一体の成
形体としたため、従来のように両部ｔ１を接合する作業
が不要となり工数の低減が図れ、部品点数も減少し、部
品管理が容易となり、接合部での強度低下の心配もない
。ざらに、金属−１１−
外環と補助部材との連結部分（こ従来のように銀ロウ付
けを行うことなく一体に連結されるため、表面に金めつ
きを施す前にニッケルめっきを施したりして銀コウ材中
の銅成分の金めつき層への拡散を防止する必要もなく、
ざらに工数の低減が図れるようになるといった効果を奏
する。In the above embodiment, the molded body 20.30 was integrally molded by powder metallurgy, but if the protruding length of the auxiliary member 22.32 that is integrated with the metal outer ring 21.31 is relatively short, it may be formed by pressing, etc. [Effects of the Invention] As is clear from the above description, the airtight terminal and the method for manufacturing the same of the present invention have the advantage that the metal outer ring and the auxiliary member are made into an integral molded body, which is different from the conventional method. The work of joining both parts t1 as shown in FIG. 1 is not necessary, so the number of man-hours can be reduced, the number of parts is also reduced, parts management becomes easy, and there is no fear of strength reduction at the joint part. Roughly speaking, metal - 11 - The connection part between the outer ring and the auxiliary member (this is connected integrally without silver soldering as in the past, so nickel plating is applied before gold plating on the surface). There is no need to prevent the copper components in the silver plated material from diffusing into the gold plating layer.
This has the effect of significantly reducing the number of man-hours.
第１図は本発明の一実施例に係る気密端子の断面図、第
２図は同気密端子の要部拡大断面図、第３図は本発明の
他の実施例に係る気密端子の断面図、第４図は従来の気
密端子の断面図てある。
４，３４・・・リード挿通孔、５，３５・・・リード、
２０，３（１・・・成形体、２１．３１・・・金属外環
、２２．３２・・・補助部材、
２３．３３・・・金めつき層。FIG. 1 is a sectional view of an airtight terminal according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view of a main part of the same airtight terminal, and FIG. 3 is a sectional view of an airtight terminal according to another embodiment of the invention. , FIG. 4 is a sectional view of a conventional hermetic terminal. 4, 34... Lead insertion hole, 5, 35... Lead,
20,3 (1... Molded body, 21.31... Metal outer ring, 22.32... Auxiliary member, 23.33... Gold plating layer.
Claims (2)
付く補助部材とを一体化した成形体の前記リード挿通口
にリードを挿通し、各リードをガラス封着すると共に、
前記成形体の表面を直接金めっき層にて被覆したことを
特徴とする気密端子。(1) Inserting the leads into the lead insertion openings of a molded body that integrates a metal outer ring having a lead insertion hole and an auxiliary member attached to the metal outer ring, and sealing each lead with glass,
An airtight terminal characterized in that the surface of the molded body is directly coated with a gold plating layer.
環に取付く補助部材とを一体化した成形体を形成し、該
成形体の上記金属外環の複数のリード挿通孔にそれぞれ
リードを挿通してガラス封着した後、上記成形体に直接
金めっきを施して表面を金めっき層にて被覆することを
特徴とする気密端子の製造方法。(2) A molded body is formed by integrating a metal outer ring having a plurality of lead insertion holes and an auxiliary member attached to the metal outer ring, and each of the plurality of lead insertion holes in the metal outer ring of the molded body is formed. A method for producing an airtight terminal, which comprises inserting a lead and sealing the molded body with glass, and then directly plating the molded body with gold to cover the surface with a gold plating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1126790A JP2744501B2 (en) | 1990-01-19 | 1990-01-19 | Hermetic terminal and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1126790A JP2744501B2 (en) | 1990-01-19 | 1990-01-19 | Hermetic terminal and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03214761A true JPH03214761A (en) | 1991-09-19 |
| JP2744501B2 JP2744501B2 (en) | 1998-04-28 |
Family
ID=11773191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1126790A Expired - Lifetime JP2744501B2 (en) | 1990-01-19 | 1990-01-19 | Hermetic terminal and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2744501B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511959U (en) * | 1991-07-31 | 1993-02-19 | 能美防災株式会社 | Sprinkler fire extinguishing equipment unwinding piping unit |
| JP2012500974A (en) * | 2008-08-21 | 2012-01-12 | エススリーシー， インコーポレイテッド | Sensor device package and method |
| CN105806553A (en) * | 2016-06-02 | 2016-07-27 | 中国工程物理研究院材料研究所 | High-pressure sensor |
-
1990
- 1990-01-19 JP JP1126790A patent/JP2744501B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0511959U (en) * | 1991-07-31 | 1993-02-19 | 能美防災株式会社 | Sprinkler fire extinguishing equipment unwinding piping unit |
| JP2012500974A (en) * | 2008-08-21 | 2012-01-12 | エススリーシー， インコーポレイテッド | Sensor device package and method |
| CN105806553A (en) * | 2016-06-02 | 2016-07-27 | 中国工程物理研究院材料研究所 | High-pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2744501B2 (en) | 1998-04-28 |
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